Location after the connecting process

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H01L2224/732

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/732Location after the connecting process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer
- Patent number 12,170,249
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure, semiconductor device, and joining method
- Patent number 12,168,262
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,166,026
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 12,166,156
- Issue date Dec 10, 2024
- Epistar Corporation
- Chao-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power storage pack, semiconductor device, and semiconductor device...
- Patent number 12,165,958
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Toshifumi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 12,159,862
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,159,791
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,159,857
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungseok Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240421018
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Kazuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240421049
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Takeshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240421093
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...
- Publication number 20240421102
- Publication date Dec 19, 2024
- Intel Corporation
- Chunqing Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421129
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421034
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421103
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421123
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421012
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sangsick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS
- Publication number 20240420747
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- KAZUHIRO YOSHIDA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421061
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421096
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...
- Publication number 20240421119
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...
- Publication number 20240421139
- Publication date Dec 19, 2024
- Transphorm Technology, Inc.
- Davide Bisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240421050
- Publication date Dec 19, 2024
- Shinko Electric Industries Co., Ltd.
- Etsuo UEMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421026
- Publication date Dec 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Chiu-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROLL TO ROLL SINTERING SYSTEM FOR WIDE INORGANIC TAPE MATERIAL AND...
- Publication number 20240413390
- Publication date Dec 12, 2024
- Corning Incorporated
- Michael Edward Badding
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413121
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHIH-TING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED...
- Publication number 20240413038
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS

Location after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out wafer level package structure

Semiconductor package including interposer

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of fabricating the same

Semiconductor packages and methods of forming same

Joint structure, semiconductor device, and joining method

Semiconductor structure and manufacturing method thereof

Semiconductor package using cavity substrate and manufacturing methods

Semiconductor package

Semiconductor packages and methods for forming the same

Integrated circuit packages with cavities and methods of manufactur...

Semiconductor device

Reliable semiconductor packages

Display device including anisotropic conductive film (ACF)

Semiconductor device packages and methods of manufacturing the same

Semiconductor light-emitting device

Image pickup device and electronic apparatus

Fluidic flow channel over active surface of a die

Semiconductor device including a semiconductor element having elect...

Power storage pack, semiconductor device, and semiconductor device...

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device with lead between a plurality of encapsulated...

Flat no-lead package with surface mounted structure

Semiconductor packages

Interconnect structures, packaged semiconductor devices, and method...

Info packages including thermal dissipation blocks

Semiconductor package with front side and back side redistribution...

Semiconductor package

Semiconductor devices and methods of manufacturing semiconductor de...

Seamless interconnect thresholds using dielectric fluid channels

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...

MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...

LEADFRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ROLL TO ROLL SINTERING SYSTEM FOR WIDE INORGANIC TAPE MATERIAL AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED...

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR PACKAGE

EMBEDDED SEMICONDUCTOR DEVICE

ON DIE FLEXURE CONTROL DEVICE AND METHOD