Lower part of the bonding apparatus

Industry

CPC
H01L2224/75801

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75801Lower part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device with three machine bases and transfer method thereof
- Patent number 10,269,596
- Issue date Apr 23, 2019
- BOE Technology Group Co., Ltd.
- Xiaolong He
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a functional inlay
- Patent number 9,780,062
- Issue date Oct 3, 2017
- Assa Abloy AB
- Stephane Ayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a functional inlay
- Patent number 9,501,733
- Issue date Nov 22, 2016
- Assa Abloy AB
- Stephane Ayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting semiconductor device
- Patent number 9,130,011
- Issue date Sep 8, 2015
- Samsung Electronics Co., Ltd.
- Taehyun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool, electronic component mounting apparatus, and manufact...
- Patent number 8,973,807
- Issue date Mar 10, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting semiconductor light-emitting element
- Patent number 8,893,377
- Issue date Nov 25, 2014
- Panasonic Corporation
- Tomonori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support device for resonator
- Patent number 8,353,442
- Issue date Jan 15, 2013
- Adwelds Corporation
- Seiya Nakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,467,670
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method and apparatus
- Patent number 6,193,136
- Issue date Feb 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METH...
- Publication number 20130026211
- Publication date Jan 31, 2013
- Panasonic Coporation
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Systems Involving Soldering
- Publication number 20120205424
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT
- Publication number 20120070917
- Publication date Mar 22, 2012
- PANASONIC CORPORATION
- Tomonori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20110232082
- Publication date Sep 29, 2011
- TAEHYUN KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT DEVICE FOR RESONATOR
- Publication number 20110036897
- Publication date Feb 17, 2011
- Adwelds Corporation
- Seiya Nakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for mounting component
- Publication number 20010001469
- Publication date May 24, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Transfer device with three machine bases and transfer method thereof

Hybrid bonding system and cleaning method thereof

Method of manufacturing a functional inlay

Method of manufacturing a functional inlay

Light emitting diodes and a method of packaging the same

Light emitting diodes and a method of packaging the same

Apparatus for mounting semiconductor device

Bonding tool, electronic component mounting apparatus, and manufact...

Methods and systems involving soldering

Apparatus and method for mounting semiconductor light-emitting element

Support device for resonator

Method and apparatus for mounting component

Component mounting method and apparatus

Patents Applicationslast 30 patents

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METH...

Methods and Systems Involving Soldering

APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT

APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE

SUPPORT DEVICE FOR RESONATOR

Method and apparatus for mounting component