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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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H01L28/87made by depositing layers

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,249,531
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
- Patent number 12,154,940
- Issue date Nov 26, 2024
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solid-state devices and methods for forming the same
- Patent number 12,094,721
- Issue date Sep 17, 2024
- University of Maryland, College Park
- Gary W. Rubloff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with assistant layer and method for fabricatin...
- Patent number 12,080,754
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a...
- Patent number 12,068,238
- Issue date Aug 20, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with assistant layer
- Patent number 12,051,718
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 12,009,387
- Issue date Jun 11, 2024
- Samsung Electronics, Co. Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,009,388
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,978,765
- Issue date May 7, 2024
- Samsung Electronics, Co. Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,973,149
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor
- Patent number 11,955,509
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jihyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a three-dimensional capacitor
- Patent number 11,955,480
- Issue date Apr 9, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 11,948,969
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalysts with modified active phase dispersion and method to prepa...
- Patent number 11,935,827
- Issue date Mar 19, 2024
- Saudi Arabian Oil Company
- Omer Refa Koseoglu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
- Patent number 11,923,355
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,406
- Issue date Mar 5, 2024
- SK hynix Inc.
- Dae Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor architectures in semiconductor devices
- Patent number 11,901,404
- Issue date Feb 13, 2024
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, preparation method of same, and semiconduc...
- Patent number 11,894,418
- Issue date Feb 6, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xianlei Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided capacitor and fabrication method thereof
- Patent number 11,894,419
- Issue date Feb 6, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced ESR in trench capacitor
- Patent number 11,888,021
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Jing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated capacitor and method for manufacturing the same
- Patent number 11,869,929
- Issue date Jan 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for deep trench capacitor with scalloped profile
- Patent number 11,854,817
- Issue date Dec 26, 2023
- KEY FOUNDRY CO., LTD.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 11,854,959
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and preparation method thereof
- Patent number 11,855,131
- Issue date Dec 26, 2023
- Changxin Memory Technologies, Inc.
- Xifei Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including metal insulator metal capacitor and...
- Patent number 11,855,126
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Jhih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-Insulator-Metal structure
- Patent number 11,842,959
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with horizontally arranged capacitor
- Patent number 11,842,960
- Issue date Dec 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022793
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-I Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREMELY HIGH DENSITY SILICON CAPACITOR
- Publication number 20250006780
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429269
- Publication date Dec 26, 2024
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SOLID-STATE DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240404838
- Publication date Dec 5, 2024
- University of Maryland, College Park
- Gary W. Rubloff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS
- Publication number 20240387616
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Zhong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387617
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240379735
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE AND CAPACITOR STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20240347444
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- PIN-JHU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO MITIGATE VERTICAL INTERCONNECT ACCESS INDUCED METAL CO...
- Publication number 20240321723
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE BASED ON MULTILAYER THIN FILM AND METHOD FOR MANU...
- Publication number 20240309503
- Publication date Sep 19, 2024
- Woonkyung LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREAS...
- Publication number 20240304662
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yingkit Felix Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290824
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240243165
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234485
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...
- Publication number 20240234488
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyukwoo KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240234592
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSING CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR FUSE STRUCTURE FOR HIGH VOLTAGE BREAKDOWN DEF...
- Publication number 20240222358
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR
- Publication number 20240222421
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jihyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH METAL-INSULATOR-METAL CAPACITOR ASSEMBLY
- Publication number 20240222260
- Publication date Jul 4, 2024
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND FABRICATING METHOD THEREOF
- Publication number 20240178267
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Hsiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ON FIN STRUCTURE AND FABRICATING METHOD OF THE SAME
- Publication number 20240162220
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING SAME
- Publication number 20240162278
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- KYOOHO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
- Publication number 20240145447
- Publication date May 2, 2024
- pSemi Corporation
- Shishir Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...
- Publication number 20240136393
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyukwoo KWON
- H01 - BASIC ELECTRIC ELEMENTS

made by depositing layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming semiconductor structure

Metal-insulator-metal structure

High capacitance MIM device with self aligned spacer

Stacked staggered electrode foil capacitor structures in semiconduc...

Multi-layer solid-state devices and methods for forming the same

Semiconductor device with assistant layer and method for fabricatin...

Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a...

Method for fabricating semiconductor device with assistant layer

Integrated circuit device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Integrated circuit device and method of manufacturing the same

Semiconductor device and method of forming the same

Metal-insulator-metal structure

Metal-insulator-metal capacitor

Integrated circuit comprising a three-dimensional capacitor

Semiconductor structure and method of manufacturing the same

Catalysts with modified active phase dispersion and method to prepa...

Deep trench capacitor fuse structure for high voltage breakdown def...

Semiconductor device

Capacitor architectures in semiconductor devices

Semiconductor structure, preparation method of same, and semiconduc...

Double-sided capacitor and fabrication method thereof

Reduced ESR in trench capacitor

Laminated capacitor and method for manufacturing the same

Manufacturing method for deep trench capacitor with scalloped profile

Metal-insulator-metal device with improved performance

Semiconductor structure and preparation method thereof

Semiconductor device including metal insulator metal capacitor and...

Metal-Insulator-Metal structure

Semiconductor device with horizontally arranged capacitor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

EXTREMELY HIGH DENSITY SILICON CAPACITOR

INTEGRATED CAPACITOR

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

MULTI-LAYER SOLID-STATE DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS

SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

CONDUCTIVE STRUCTURE AND CAPACITOR STRUCTURE AND METHOD FOR MANUFAC...

STRUCTURE TO MITIGATE VERTICAL INTERCONNECT ACCESS INDUCED METAL CO...

ELECTRONIC DEVICE BASED ON MULTILAYER THIN FILM AND METHOD FOR MANU...

CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREAS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METAL-INSULATOR-METAL STRUCTURE

CAPACITOR AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

DEEP TRENCH CAPACITOR FUSE STRUCTURE FOR HIGH VOLTAGE BREAKDOWN DEF...

METAL-INSULATOR-METAL CAPACITOR

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

SEMICONDUCTOR COMPONENT WITH METAL-INSULATOR-METAL CAPACITOR ASSEMBLY

CAPACITOR AND FABRICATING METHOD THEREOF

CAPACITOR ON FIN STRUCTURE AND FABRICATING METHOD OF THE SAME

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING SAME

Integration of Discrete Embeddable Capacitors on Integrated Circuit...

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...