made by patterning layers

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H01L28/92

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Current Industry

H01L28/92made by patterning layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structures having deep trench capacitor and methods f...
- Patent number 12,148,791
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu-Yu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,125,875
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chia Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure
- Patent number 12,125,642
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure and semiconductor s...
- Patent number 12,125,874
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kyoungyoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,119,374
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Gihee Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,113,100
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongmin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,089,396
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Jongmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure of capacitive device
- Patent number 12,087,684
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer polysilicon stack for semiconductor devices
- Patent number 12,080,755
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for forming same, packaging method, and pa...
- Patent number 12,068,233
- Issue date Aug 20, 2024
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array structure and method for forming same
- Patent number 12,062,690
- Issue date Aug 13, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yanghao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with single side c...
- Patent number 12,051,719
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 12,048,138
- Issue date Jul 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kangshu Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D capacitor and method of manufacturing same
- Patent number 12,040,379
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three electrode capacitor structure using spaced conductive pillars
- Patent number 12,034,039
- Issue date Jul 9, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- EeJan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module with dielectric sidewa...
- Patent number 12,021,115
- Issue date Jun 25, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module including a cup-shaped...
- Patent number 12,015,052
- Issue date Jun 18, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming monolithic surge protect...
- Patent number 12,015,051
- Issue date Jun 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- James J. Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array, method for manufacturing the same and memory
- Patent number 11,996,440
- Issue date May 28, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiaoyu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pocket flow for trench capacitors integrated with planar capacitors...
- Patent number 11,996,438
- Issue date May 28, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional capacitive structures and their manufacturing met...
- Patent number 11,978,766
- Issue date May 7, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and its formation method and memory
- Patent number 11,980,017
- Issue date May 7, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kangshu Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 11,961,881
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Lingxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,961,882
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual hydrogen barrier layer for trench capacitors integrated with l...
- Patent number 11,955,512
- Issue date Apr 9, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,943,909
- Issue date Mar 26, 2024
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 11,942,277
- Issue date Mar 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Mao-Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric random access memory (FRAM) capacitors and methods of...
- Patent number 11,937,434
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided capacitor structures and forming methods thereof
- Patent number 11,916,102
- Issue date Feb 27, 2024
- Changxin Memory Technologies, Inc.
- Wenjia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer trench capacitor structure
- Patent number 11,916,100
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF
- Publication number 20240387615
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Po LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING A FUNCTIONAL LAYER BY MEANS OF A SACRIFICIAL LAYER AND P...
- Publication number 20240371923
- Publication date Nov 7, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Messaoud BEDJAOUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE
- Publication number 20240363523
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TAI-YI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION
- Publication number 20240363652
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...
- Publication number 20240355871
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- SZU-YU HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20240347619
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...
- Publication number 20240332347
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- SZU-YU HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBE...
- Publication number 20240321946
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Florent LALLEMAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240313042
- Publication date Sep 19, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMORY DEVICES INCLUDING B-SITE DOPANTS AND L...
- Publication number 20240276734
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240276706
- Publication date Aug 15, 2024
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240234035
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Mao-Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234490
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTACK METAL-INSULATOR-METAL (MIM) STRUCTURE USING SPACER FORMA...
- Publication number 20240222422
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240206153
- Publication date Jun 20, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Shuxian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND FABRICATING METHOD THEREOF
- Publication number 20240178267
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Hsiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE FOR HIGH-VOLTAGE APPLICATIONS
- Publication number 20240162280
- Publication date May 16, 2024
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CROWN CAPACITOR
- Publication number 20240155823
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Jen-I LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TRENCH CAPACITOR STRUCTURE
- Publication number 20240153987
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A CAPACITOR
- Publication number 20240128311
- Publication date Apr 18, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE
- Publication number 20240113158
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240105765
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE STRUCTURE
- Publication number 20240088207
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER-SCULPTED STORAGE NODE
- Publication number 20240088211
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Devesh Dadhich Shreeram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Semiconductor Device
- Publication number 20240079353
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...
- Publication number 20240063255
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- SZU-YU HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...
- Publication number 20240063254
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- SZU-YU HOU
- H01 - BASIC ELECTRIC ELEMENTS

made by patterning layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structures having deep trench capacitor and methods f...

Semiconductor structure and manufacturing method thereof

Method of manufacturing capacitor structure

Manufacturing method of semiconductor structure and semiconductor s...

Semiconductor device

Semiconductor structure and method for manufacturing semiconductor...

Semiconductor device

Integrated circuit structure of capacitive device

Multi-layer polysilicon stack for semiconductor devices

Adapter board and method for forming same, packaging method, and pa...

Capacitor array structure and method for forming same

Method for manufacturing semiconductor structure with single side c...

Method for preparing semiconductor structure and semiconductor stru...

3D capacitor and method of manufacturing same

Three electrode capacitor structure using spaced conductive pillars

Metal-insulator-metal (MIM) capacitor module with dielectric sidewa...

Metal-insulator-metal (MIM) capacitor module including a cup-shaped...

Semiconductor device and method of forming monolithic surge protect...

Capacitor array, method for manufacturing the same and memory

Pocket flow for trench capacitors integrated with planar capacitors...

Three-dimensional capacitive structures and their manufacturing met...

Capacitor structure and its formation method and memory

Method for forming semiconductor structure and semiconductor structure

Semiconductor device

Dual hydrogen barrier layer for trench capacitors integrated with l...

Semiconductor memory device

Method of manufacturing semiconductor structure and semiconductor s...

Ferroelectric random access memory (FRAM) capacitors and methods of...

Double-sided capacitor structures and forming methods thereof

Multi-layer trench capacitor structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

PATTERNING A FUNCTIONAL LAYER BY MEANS OF A SACRIFICIAL LAYER AND P...

INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE

DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION

SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...

3D CAPACITOR AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...

INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

METHOD OF FABRICATING MEMORY DEVICES INCLUDING B-SITE DOPANTS AND L...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

MULTISTACK METAL-INSULATOR-METAL (MIM) STRUCTURE USING SPACER FORMA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CAPACITOR AND FABRICATING METHOD THEREOF

ELECTRICAL DEVICE FOR HIGH-VOLTAGE APPLICATIONS

METHOD FOR FABRICATING CROWN CAPACITOR

MULTI-LAYER TRENCH CAPACITOR STRUCTURE

METHOD OF FABRICATING A CAPACITOR

HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

THIN FILM CAPACITORS

CAPACITANCE STRUCTURE

OVER-SCULPTED STORAGE NODE

Passive Semiconductor Device

SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...

SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...