-
MULTI-LAYER TRENCH CAPACITOR STRUCTURE
-
Publication number 20240153987
-
Publication date May 9, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Hsuan-Han Tseng
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
METHOD OF FABRICATING A CAPACITOR
-
Publication number 20240128311
-
Publication date Apr 18, 2024
-
STMicroelectronics (Tours) SAS
-
Mohamed Boufnichel
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
THIN FILM CAPACITORS
-
Publication number 20240096561
-
Publication date Mar 21, 2024
-
Intel Corporation
-
Mahdi Mohammadighaleni
-
H01 - BASIC ELECTRIC ELEMENTS
-
CAPACITANCE STRUCTURE
-
Publication number 20240088207
-
Publication date Mar 14, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Fu-Chiang Kuo
-
H01 - BASIC ELECTRIC ELEMENTS
-
OVER-SCULPTED STORAGE NODE
-
Publication number 20240088211
-
Publication date Mar 14, 2024
-
Micron Technology, Inc.
-
Devesh Dadhich Shreeram
-
H01 - BASIC ELECTRIC ELEMENTS
-
Passive Semiconductor Device
-
Publication number 20240079353
-
Publication date Mar 7, 2024
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Fu-Chiang KUO
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
CARBON MOLD FOR DRAM CAPACITOR
-
Publication number 20240038833
-
Publication date Feb 1, 2024
-
Applied Materials, Inc.
-
Fredrick Fishburn
-
H01 - BASIC ELECTRIC ELEMENTS
-
FABRICATING SEMICONDUCTOR DEVICE
-
Publication number 20240023305
-
Publication date Jan 18, 2024
-
Samsung Electronics Co., Ltd.
-
Sookyung Kim
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
DECOUPLING FINFET CAPACITORS
-
Publication number 20230387331
-
Publication date Nov 30, 2023
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Chung-Hui Chen
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
TRENCH CAPACITORS
-
Publication number 20230386752
-
Publication date Nov 30, 2023
-
MELEXIS TECHNOLOGIES NV
-
Appo VAN DER WIEL
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-