made by thin film techniques

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CPC
H01G4/306

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HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/306made by thin film techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer electronic component
- Patent number 12,191,081
- Issue date Jan 7, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,025
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and method of manufacturing the same
- Patent number 12,100,552
- Issue date Sep 24, 2024
- Taiyo Yuden Co., Ltd.
- Riki Suemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baking slurry composition, green sheet, method for manufacturing gr...
- Patent number 12,049,428
- Issue date Jul 30, 2024
- Goo Chemical Co., Ltd.
- Yutaka Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant multilayer ceramic capacitors
- Patent number 12,040,135
- Issue date Jul 16, 2024
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baking slurry composition, green sheet, method for manufacturing gr...
- Patent number 12,006,266
- Issue date Jun 11, 2024
- Goo Chemical Co., Ltd.
- Yutaka Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric thin film, capacitor element, and electronic circuit board
- Patent number 11,999,616
- Issue date Jun 4, 2024
- TDK Corporation
- Kumiko Yamazaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Three-dimensional capacitive structures and their manufacturing met...
- Patent number 11,978,766
- Issue date May 7, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 11,942,278
- Issue date Mar 26, 2024
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form high capacitance thin film capacitors (TFCs) as embe...
- Patent number 11,929,212
- Issue date Mar 12, 2024
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film high polymer laminated capacitor manufacturing method
- Patent number 11,854,748
- Issue date Dec 26, 2023
- RUBYCON CORPORATION
- Tomonao Kako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a dielectric material and methods for...
- Patent number 11,848,156
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Yan Wang
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Multilayer electronic component
- Patent number 11,837,406
- Issue date Dec 5, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,735,364
- Issue date Aug 22, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Hyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip component
- Patent number 11,705,285
- Issue date Jul 18, 2023
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitive element having aspect ratio modulation struct...
- Patent number 11,688,761
- Issue date Jun 27, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Sheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin film capacitor having a dielectric layer having a through hole...
- Patent number 11,676,767
- Issue date Jun 13, 2023
- TDK Corporation
- Yuuki Aburakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-energy density nanocomposite capacitor
- Patent number 11,673,353
- Issue date Jun 13, 2023
- POWDERMET INC.
- Andrew Sherman
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dielectric ceramic composition and ceramic capacitor using the same
- Patent number 11,646,156
- Issue date May 9, 2023
- KEMET Electronics Corporation
- Hanzheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor unit
- Patent number 11,621,128
- Issue date Apr 4, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Wei-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant multilayer ceramic capacitors
- Patent number 11,621,126
- Issue date Apr 4, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and method of manufacturing the same
- Patent number 11,610,732
- Issue date Mar 21, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tai Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered ceramic electronic component and manufacturing method...
- Patent number 11,569,034
- Issue date Jan 31, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Jin Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, circuit board incorporating the same, and thin...
- Patent number 11,430,611
- Issue date Aug 30, 2022
- TDK Corporation
- Yuuki Aburakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, manufacturing method therefor, and substrate w...
- Patent number 11,398,354
- Issue date Jul 26, 2022
- TDK Corporation
- Yuuki Aburakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a high-energy density nanocomposite film
- Patent number 11,364,693
- Issue date Jun 21, 2022
- POWDERMET INC.
- Andrew Sherman
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip component
- Patent number 11,342,125
- Issue date May 24, 2022
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LC resonance element and resonance element array
- Patent number 11,328,861
- Issue date May 10, 2022
- Noda Screen Co., Ltd.
- Masamitsu Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,322,308
- Issue date May 3, 2022
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device and manufacturing method of the same
- Patent number 11,282,641
- Issue date Mar 22, 2022
- Taiyo Yuden Co., Ltd.
- Tetsuo Shimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE BASED ON MULTILAYER THIN FILM AND METHOD FOR MANU...
- Publication number 20240309503
- Publication date Sep 19, 2024
- Woonkyung LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...
- Publication number 20240258035
- Publication date Aug 1, 2024
- Taiyo Yuden Co., Ltd.
- Yuji Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240222022
- Publication date Jul 4, 2024
- Murata Manufacturing Co., Ltd.
- Hideyuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MULTILA...
- Publication number 20240186067
- Publication date Jun 6, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hoe Chul JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20240177937
- Publication date May 30, 2024
- Yageo Corporation
- Masayuki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR MANUFACTURING AN ELECTRONIC COMPONENT
- Publication number 20240170216
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jung Jin PARK
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIELECTRIC LAYER AND METHOD OF MANUFACT...
- Publication number 20240170214
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Woochul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240153704
- Publication date May 9, 2024
- Murata Manufacturing Co., Ltd.
- Hiroaki TOKUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240087809
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Toshiyuki Nakaiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM HIGH POLYMER LAMINATED CAPACITOR
- Publication number 20240087815
- Publication date Mar 14, 2024
- RUBYCON CORPORATION
- Tomonao KAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071691
- Publication date Feb 29, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi KAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240055183
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Eung Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC, CAPACITOR, ELECTRICAL CIRCUIT, CIRCUIT BOARD, AND APPAR...
- Publication number 20240047137
- Publication date Feb 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Ryosuke KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER C...
- Publication number 20230343521
- Publication date Oct 26, 2023
- Murata Manufacturing Co., Ltd.
- Tomohiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING TH...
- Publication number 20230326682
- Publication date Oct 12, 2023
- Taiyo Yuden Co., Ltd.
- Tomoki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230290570
- Publication date Sep 14, 2023
- STMicroelectronics (Crolles 2) SAS
- Marios BARLAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20230282423
- Publication date Sep 7, 2023
- Taiyo Yuden Co., Ltd.
- Norihiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR, CONNECTED CAPACITOR, INVERTER, AND ELECTRIC VEHICLE
- Publication number 20230274888
- Publication date Aug 31, 2023
- KYOCERA CORPORATION
- Kazuki IMAGAWA
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD
- Publication number 20230268132
- Publication date Aug 24, 2023
- Taiyo Yuden Co., Ltd.
- Shigeto TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHARGE STORAGE DEVICE WITH TWO DIFFERENT TYPES OF ELECTRODE...
- Publication number 20230260712
- Publication date Aug 17, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20230245821
- Publication date Aug 3, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Eung Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE ELECTRONIC COM...
- Publication number 20230215656
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Yasuhiro NISHISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR
- Publication number 20230215660
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Marion Junghänel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CAPACITOR WITH THIN FILM DEPOSITION ON 3D STRUCTURE AND ITS...
- Publication number 20230197352
- Publication date Jun 22, 2023
- Elohim Incorporation
- Ji Hwan AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resonant Multilayer Ceramic Capacitors
- Publication number 20230187134
- Publication date Jun 15, 2023
- KEMET Electronics Corporation
- John Bultitude
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230137809
- Publication date May 4, 2023
- Taiyo Yuden Co., Ltd.
- Riki SUEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
- Publication number 20230095846
- Publication date Mar 30, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY CAPACITIVE DEVICE HAVING WELL-DEFINED INSULATING AREAS
- Publication number 20220399167
- Publication date Dec 15, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Thierry Claret
- B82 - NANO-TECHNOLOGY
Information Patent Application
CAPACITOR
- Publication number 20220384113
- Publication date Dec 1, 2022
- Taiyo Yuden Co., Ltd.
- Yoshinari TAKE
- H01 - BASIC ELECTRIC ELEMENTS

made by thin film techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer electronic component

Semiconductor device

Ceramic electronic component and method of manufacturing the same

Baking slurry composition, green sheet, method for manufacturing gr...

Resonant multilayer ceramic capacitors

Baking slurry composition, green sheet, method for manufacturing gr...

Dielectric thin film, capacitor element, and electronic circuit board

Three-dimensional capacitive structures and their manufacturing met...

Thin film capacitor

Method to form high capacitance thin film capacitors (TFCs) as embe...

Thin film high polymer laminated capacitor manufacturing method

Electronic device comprising a dielectric material and methods for...

Multilayer electronic component

Multilayer electronic component

Chip component

Multilayer capacitive element having aspect ratio modulation struct...

Thin film capacitor having a dielectric layer having a through hole...

High-energy density nanocomposite capacitor

Dielectric ceramic composition and ceramic capacitor using the same

Capacitor unit

Resonant multilayer ceramic capacitors

Multilayer capacitor and method of manufacturing the same

Multi-layered ceramic electronic component and manufacturing method...

Thin film capacitor, circuit board incorporating the same, and thin...

Thin film capacitor, manufacturing method therefor, and substrate w...

Method for forming a high-energy density nanocomposite film

Chip component

LC resonance element and resonance element array

Capacitor

Ceramic electronic device and manufacturing method of the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE BASED ON MULTILAYER THIN FILM AND METHOD FOR MANU...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...

MULTILAYER CERAMIC CAPACITOR

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MULTILA...

MULTI-LAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME

FILM FOR MANUFACTURING AN ELECTRONIC COMPONENT

ELECTRONIC DEVICE INCLUDING DIELECTRIC LAYER AND METHOD OF MANUFACT...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

THIN FILM HIGH POLYMER LAMINATED CAPACITOR

SEMICONDUCTOR DEVICE

MULTILAYER ELECTRONIC COMPONENT

DIELECTRIC, CAPACITOR, ELECTRICAL CIRCUIT, CIRCUIT BOARD, AND APPAR...

MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER C...

MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING TH...

ELECTRONIC DEVICE

MULTILAYER CERAMIC ELECTRONIC COMPONENT

FILM CAPACITOR, CONNECTED CAPACITOR, INVERTER, AND ELECTRIC VEHICLE

MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD

LAYERED CHARGE STORAGE DEVICE WITH TWO DIFFERENT TYPES OF ELECTRODE...

MULTILAYER ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE ELECTRONIC COM...

FILM CAPACITOR

SILICON CAPACITOR WITH THIN FILM DEPOSITION ON 3D STRUCTURE AND ITS...

Resonant Multilayer Ceramic Capacitors

CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...

HIGH-DENSITY CAPACITIVE DEVICE HAVING WELL-DEFINED INSULATING AREAS

CAPACITOR