made from inorganic insulating material

Industry

CPC
H05K3/4605

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4605made from inorganic insulating material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,041,729
- Issue date Jul 16, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor module including the same
- Patent number 11,903,145
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seung-Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,729,911
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Akinori Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,570,883
- Issue date Jan 31, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for hybrid glass and organic packaging for radi...
- Patent number 11,503,704
- Issue date Nov 15, 2022
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered ceramic substrate and method for manufacturing same
- Patent number 11,419,218
- Issue date Aug 16, 2022
- DIT CO., LTD.
- Tae Hyung Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,363,714
- Issue date Jun 14, 2022
- Ibiden Co., Ltd.
- Akinori Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor built-in substrate
- Patent number 11,197,373
- Issue date Dec 7, 2021
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed wiring board
- Patent number 11,197,379
- Issue date Dec 7, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki Kawashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip package substrate and method for fabricating the same
- Patent number 11,183,447
- Issue date Nov 23, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting layers and traces
- Patent number 11,114,602
- Issue date Sep 7, 2021
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, manufacturing method, imaging device, and ele...
- Patent number 11,043,436
- Issue date Jun 22, 2021
- Sony Corporation
- Susumu Hogyoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, stacked wiring substrate, and manufacturing metho...
- Patent number 10,959,328
- Issue date Mar 23, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature cofired ceramic material, ceramic sintered body, an...
- Patent number 10,906,839
- Issue date Feb 2, 2021
- Murata Manufacturing Co., Ltd.
- Yasutaka Sugimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Highly thermally conductive dielectric structure for heat spreading...
- Patent number 10,880,988
- Issue date Dec 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate
- Patent number 10,856,412
- Issue date Dec 1, 2020
- TDK ELECTRONICS AG
- Thomas Feichtinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit substrate, semiconductor device, method of producing...
- Patent number 10,790,209
- Issue date Sep 29, 2020
- Toppan Printing Co., Ltd.
- Koji Imayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LC composite device, processor, and method for manufacturing LC com...
- Patent number 10,790,792
- Issue date Sep 29, 2020
- MURATA MANUFACTURING CO., LTD.
- Toshiyuki Nakaiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,765,011
- Issue date Sep 1, 2020
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and manufacturing method thereof
- Patent number 10,755,996
- Issue date Aug 25, 2020
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate for electronic component inspection apparatus
- Patent number 10,729,006
- Issue date Jul 28, 2020
- NGK Spark Plug Co., Ltd.
- Takakuni Nasu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical waveguide having aluminum nitride thin film
- Patent number 10,667,388
- Issue date May 26, 2020
- II-VI Delaware Inc.
- Henry Meyer Daghighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting apparatus including superconducti...
- Patent number 10,651,362
- Issue date May 12, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
- Patent number 10,523,253
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Changhan Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer wiring board
- Patent number 10,477,702
- Issue date Nov 12, 2019
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aluminum nitride substrate with graphite foil
- Patent number 10,470,302
- Issue date Nov 5, 2019
- Finisar Corporation
- Henry Meyer Daghighian
- G02 - OPTICS
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, compone...
- Patent number 10,410,884
- Issue date Sep 10, 2019
- Sony Corporation
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20240365477
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240284606
- Publication date Aug 22, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240260178
- Publication date Aug 1, 2024
- KIOXIA Corporation
- Motoshi SETO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240196546
- Publication date Jun 13, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240179853
- Publication date May 30, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND I...
- Publication number 20230422409
- Publication date Dec 28, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Dae Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20230276575
- Publication date Aug 31, 2023
- Shinko Electric Industries Co., Ltd.
- Yukinori HATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230125928
- Publication date Apr 27, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377873
- Publication date Nov 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20220210925
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Seung-Yeol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220174815
- Publication date Jun 2, 2022
- IBIDEN CO., LTD.
- Akinori YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE, AND...
- Publication number 20220039261
- Publication date Feb 3, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20210251087
- Publication date Aug 12, 2021
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR HYBRID GLASS AND ORGANIC PACKAGING FOR RADI...
- Publication number 20210204397
- Publication date Jul 1, 2021
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR BUILT-IN SUBSTRATE
- Publication number 20210185818
- Publication date Jun 17, 2021
- IBIDEN CO., LTD.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210098351
- Publication date Apr 1, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210092841
- Publication date Mar 25, 2021
- IBIDEN CO., LTD.
- Akinori YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...
- Publication number 20210007220
- Publication date Jan 7, 2021
- Shinko Electric Industries Co., Ltd.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate
- Publication number 20200296829
- Publication date Sep 17, 2020
- TDK Electronics AG
- Thomas Feichtinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY FLEXIBLE INTERCONNECT DESIGN FOR MULTI-MODE SIGNALING
- Publication number 20200170113
- Publication date May 28, 2020
- Chaitanya Sreerama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200084894
- Publication date Mar 12, 2020
- DIT Co., Ltd.
- Tae Hyung NOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL WAVEGUIDE HAVING ALUMINUM NITRIDE THIN FILM
- Publication number 20200068706
- Publication date Feb 27, 2020
- Finisar Corporation
- Henry Meyer Daghighian
- G02 - OPTICS
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20200015363
- Publication date Jan 9, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki KAWASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190394886
- Publication date Dec 26, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER BODY AND ELECTRONIC COMPONENT
- Publication number 20180319129
- Publication date Nov 8, 2018
- Murata Manufacturing Co., Ltd.
- Sadaaki Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...
- Publication number 20180146559
- Publication date May 24, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded RF Transmission Lines in Low Temperature Co-fired Ceramic...
- Publication number 20160174419
- Publication date Jun 16, 2016
- University of Windsor
- Sazzadur CHOWDHURY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

made from inorganic insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded printed circuit board

Printed wiring board

Method of fabricating a substrate with metal reflection layer

Method for manufacturing a substrate structure with high reflectance

Wiring board and semiconductor module including the same

Printed wiring board and method for manufacturing the same

Method for manufacturing a circuit board

Systems and methods for hybrid glass and organic packaging for radi...

Multilayered ceramic substrate and method for manufacturing same

Printed wiring board and method for manufacturing the same

Inductor built-in substrate

Method for producing printed wiring board

Flip-chip package substrate and method for fabricating the same

Method of forming superconducting layers and traces

Semiconductor device, manufacturing method, imaging device, and ele...

Wiring substrate, stacked wiring substrate, and manufacturing metho...

Low temperature cofired ceramic material, ceramic sintered body, an...

Highly thermally conductive dielectric structure for heat spreading...

Substrate

Wiring circuit substrate, semiconductor device, method of producing...

LC composite device, processor, and method for manufacturing LC com...

Multilayer wiring board

Through electrode substrate and manufacturing method thereof

Wiring substrate for electronic component inspection apparatus

Optical waveguide having aluminum nitride thin film

Method of forming superconducting apparatus including superconducti...

Glass substrate including passive-on-glass device and semiconductor...

Multilayer wiring board

Aluminum nitride substrate with graphite foil

Wiring substrate, method of manufacturing wiring substrate, compone...

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

WIRING SUBSTRATE

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

WIRING SUBSTRATE

PRINTED WIRING BOARD

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND I...

EMBEDDED PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE, AND...

PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR HYBRID GLASS AND ORGANIC PACKAGING FOR RADI...

INDUCTOR BUILT-IN SUBSTRATE

FLIP-CHIP PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...

Substrate

HIGH DENSITY FLEXIBLE INTERCONNECT DESIGN FOR MULTI-MODE SIGNALING

MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

OPTICAL WAVEGUIDE HAVING ALUMINUM NITRIDE THIN FILM

METHOD FOR PRODUCING PRINTED WIRING BOARD

MULTILAYER WIRING BOARD

MULTILAYER BODY AND ELECTRONIC COMPONENT

METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...

Shielded RF Transmission Lines in Low Temperature Co-fired Ceramic...