Magnesium [Mg] as principal constituent

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H01L2224/05123

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05123Magnesium [Mg] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 7,262,126
- Issue date Aug 28, 2007
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chemical etch control of noble metals in the presence of...
- Patent number 6,979,647
- Issue date Dec 27, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 6,927,493
- Issue date Aug 9, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION
- Publication number 20180286826
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050245076
- Publication date Nov 3, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050073048
- Publication date Apr 7, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for chemical etch control of noble metals in the presence of...
- Publication number 20050048798
- Publication date Mar 3, 2005
- Christo P. Bojkov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...