Magnesium [Mg] as principal constituent

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H01L2224/81423

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81423Magnesium [Mg] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,388,582
- Issue date Aug 20, 2019
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,941,180
- Issue date Apr 10, 2018
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate
- Patent number 9,425,066
- Issue date Aug 23, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating a circuit substrate
- Patent number 9,324,580
- Issue date Apr 26, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226312
- Publication date Aug 9, 2018
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20140077357
- Publication date Mar 20, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS