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Magnesium [Mg] as principal constituent
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CPC
H01L2224/83423
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/83423
Magnesium [Mg] as principal constituent
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last 30 patents
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Patent Grant
Soldering a conductor to an aluminum layer
Patent number
11,424,217
Issue date
Aug 23, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS