Magnesium (Mg) as principal constituent

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CPC
H01L2224/85423

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85423Magnesium (Mg) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,172,240
- Issue date Jan 1, 2019
- Automated Assembly Corporation
- Robert Neuman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR