Magnesium [Mg]

Industry

CPC
H01L2924/01012

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01012Magnesium [Mg]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 11,631,790
- Issue date Apr 18, 2023
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of copper surfaces using copper sintering material
- Patent number 11,329,023
- Issue date May 10, 2022
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical-semiconductor device including a wavelength converting memb...
- Patent number 11,271,144
- Issue date Mar 8, 2022
- Nichia Corporation
- Masato Fujitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,971,656
- Issue date Apr 6, 2021
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory device structure
- Patent number 10,756,036
- Issue date Aug 25, 2020
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,686,102
- Issue date Jun 16, 2020
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,615,210
- Issue date Apr 7, 2020
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 10,504,864
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaging assembly and method of making the same
- Patent number 10,483,225
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
White light devices using non-polar or semipolar gallium containing...
- Patent number RE47711
- Issue date Nov 5, 2019
- Soraa, Inc.
- James W. Raring
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 10,431,521
- Issue date Oct 1, 2019
- Cubic Corporation
- Jean-Marc Rollin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,332,927
- Issue date Jun 25, 2019
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240312946
- Publication date Sep 19, 2024
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290744
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240105654
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
- Publication number 20210320082
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20210183661
- Publication date Jun 17, 2021
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20200357761
- Publication date Nov 12, 2020
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20200227462
- Publication date Jul 16, 2020
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE ASSEMBLY INCLUDING THE SAME
- Publication number 20200098712
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20190319001
- Publication date Oct 17, 2019
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...
- Publication number 20190273188
- Publication date Sep 5, 2019
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20190206919
- Publication date Jul 4, 2019
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190123253
- Publication date Apr 25, 2019
- Nichia Corporation.
- Masato FUJITOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Magnesium [Mg]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Semiconductor device and package assembly including the same

Semiconductor device, manufacturing method, solid state image senso...

Semiconductor memory device structure

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor substrate having a bond pad material based on aluminum

Interconnection of copper surfaces using copper sintering material

Optical-semiconductor device including a wavelength converting memb...

Semiconductor memory device structure

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor device and method for manufacturing the same

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device, manufacturing method, solid state image senso...

Chip arrangements

Semiconductor memory device structure

Bonding wire for semiconductor device

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device, manufacturing method, solid state image senso...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Adhesive composition, electronic-component-mounted substrate and se...

Packaging assembly and method of making the same

White light devices using non-polar or semipolar gallium containing...

Semiconductor device

Method for applying a bonding layer

Integrated electronic components and methods of formation thereof

Bonding wire for semiconductor device

Tooling for coupling multiple electronic chips

Semiconductor device, manufacturing method, solid state image senso...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

AI BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

REVERSABLE ATTACHMENT SYSTEM

METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

CHIP ARRANGEMENTS

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE AND PACKAGE ASSEMBLY INCLUDING THE SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

OPTICAL-SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

WIRE BONDING SYSTEMS AND RELATED METHODS

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...