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APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION
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Publication number 20240339310
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Publication date Oct 10, 2024
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Taiwan Semiconductor Manufacturing Company Limited
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SPUTTERING APPARATUS
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Publication number 20240258088
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Publication date Aug 1, 2024
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SAMSUNG DISPLAY CO., LTD.
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HYUN-WOO KIM
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PLASMA PROCESS APPARATUS
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Publication number 20240212980
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Publication date Jun 27, 2024
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Samsung Electronics Co., Ltd.
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Jaesuk KIM
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H01 - BASIC ELECTRIC ELEMENTS
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SPUTTERING APPARATUS
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Publication number 20240194462
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Publication date Jun 13, 2024
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EMD CORPORATION
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Akinori EBE
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PERMEANCE MAGNETIC ASSEMBLY
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Publication number 20240087861
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Co., LTD
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Tsung-Jen YANG
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SEMICONDUCTOR PROCESS APPARATUS AND PROCESS CHAMBER
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Publication number 20230411132
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Publication date Dec 21, 2023
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Beijing NAURA Microelectronics Equipment Co., Ltd.
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Shiru WANG
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SEMICONDUCTOR TOOL FOR COPPER DEPOSITION
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Publication number 20230386809
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Publication date Nov 30, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chia-Hung TSAI
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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DEPOSITION SYSTEM AND METHOD
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Publication number 20230352350
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Publication date Nov 2, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Wen-Hao CHENG
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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