Magnetic alignment

Industry

CPC
H01L2224/95144

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/95144Magnetic alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 11,732,362
- Issue date Aug 22, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,521,878
- Issue date Dec 6, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an LED carrier assembly having an embedded...
- Patent number 11,227,853
- Issue date Jan 18, 2022
- Lumileds LLC
- Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution deposited magnetically guided chiplet displacement
- Patent number 10,636,837
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 10,604,843
- Issue date Mar 31, 2020
- Xerox Corporation
- Yunda Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Transferring method, manufacturing method, device and electronic ap...
- Patent number 10,319,697
- Issue date Jun 11, 2019
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-suspended microcomponent harvest, distribution, and reclamation
- Patent number 10,242,977
- Issue date Mar 26, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling method, manufacturing method, device and electronic appa...
- Patent number 10,224,307
- Issue date Mar 5, 2019
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring method, manufacturing method, device and electronic ap...
- Patent number 10,224,308
- Issue date Mar 5, 2019
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of wafer—panel die package assembly technology
- Patent number 9,893,047
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,275,978
- Issue date Mar 1, 2016
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,099,568
- Issue date Aug 4, 2015
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging fixture using magnetic field for self-alignment
- Patent number 8,789,267
- Issue date Jul 29, 2014
- Chengdu Kiloway Electronics Inc.
- Jack Zezhong Peng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self assembly of elements for displays
- Patent number 8,711,063
- Issue date Apr 29, 2014
- The Invention Science Fund I, LLC
- W. Daniel Hillis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solar cell and magnetically self-assembled solar cell assembly
- Patent number 8,674,212
- Issue date Mar 18, 2014
- General Electric Company
- William Hullinger Huber
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Self assembly of elements for displays
- Patent number 8,669,703
- Issue date Mar 11, 2014
- The Invention Science Fund I, LLC
- W. Daniel Hillis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self assembly of elements for displays
- Patent number 8,570,482
- Issue date Oct 29, 2013
- The Invention Science Fund I, LLC
- W. Daniel Hillis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Actuator enhanced alignment of self-assembled microstructures
- Patent number 8,288,877
- Issue date Oct 16, 2012
- HRL Laboratories, LLC
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for magnetically-directed, self-assembly of th...
- Patent number 8,138,868
- Issue date Mar 20, 2012
- University of Florida Research Foundation, Inc.
- David Patrick Arnold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Xerographic micro-assembler
- Patent number 8,082,660
- Issue date Dec 27, 2011
- Palo Alto Research Center Incorporated
- Jeng Ping Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Functional blocks for assembly
- Patent number 8,022,416
- Issue date Sep 20, 2011
- General Electric Company
- William Hullinger Huber
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for magnetically assisted statistical assembly of...
- Patent number 7,956,382
- Issue date Jun 7, 2011
- Massachusetts Institute of Technology
- Clifton G. Fonstad, Jr.
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-addressable self-assembling microelectronic systems and device...
- Patent number 7,947,486
- Issue date May 24, 2011
- Gamida for Life B.V.
- Michael J. Heller
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor chips for TAG applications, devices for mounting the...
- Patent number 7,922,093
- Issue date Apr 12, 2011
- Infineon Technologies AG
- Gottfried Beer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic self-assembly for integrated circuit packages
- Patent number 7,888,140
- Issue date Feb 15, 2011
- Sensormatic Electronics, LLC
- Ming-Ren Lian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of assembly using array of programmable magnets
- Patent number 7,737,515
- Issue date Jun 15, 2010
- New Jersey Institute of Technology
- Nuggehalli M. Ravindra
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNET UNIT OF SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXE...
- Publication number 20240128401
- Publication date Apr 18, 2024
- LG ELECTRONICS INC.
- Yangwoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXEL AND DISPLAY D...
- Publication number 20240030182
- Publication date Jan 25, 2024
- LG ELECTRONICS INC.
- Wonjae CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY DEVICE COMPRISING THE SAME
- Publication number 20230395762
- Publication date Dec 7, 2023
- LG ELECTRONICS INC.
- Sunghyun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20230366093
- Publication date Nov 16, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ASSEMBLY DEVICE
- Publication number 20230361077
- Publication date Nov 9, 2023
- LG ELECTRONICS INC.
- Byungjun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF MICRO LIGHT-EMITTING DEVICE AND METHOD OF TRANSFERRING...
- Publication number 20220149236
- Publication date May 12, 2022
- Korea University Research and Business Foundation
- In Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20200173026
- Publication date Jun 4, 2020
- Xerox Corporation
- Yunda Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING AN LED CARRIER ASSEMBLY
- Publication number 20190304950
- Publication date Oct 3, 2019
- Lumileds LLC
- Casey ISRAEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR PARALLEL ASSEMBLY, TRANSFER, AND BONDING OF...
- Publication number 20180261570
- Publication date Sep 13, 2018
- SelfArray, Inc.
- Mark DURNIAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation
- Publication number 20180102352
- Publication date Apr 12, 2018
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transferring Method, Manufacturing Method, Device and Electronic Ap...
- Publication number 20170338199
- Publication date Nov 23, 2017
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPA...
- Publication number 20170330856
- Publication date Nov 16, 2017
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...
- Publication number 20170330857
- Publication date Nov 16, 2017
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF WAFER - PANEL DIE PACKAGE ASSEMBLY TECHNOLOGY
- Publication number 20170221872
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS
- Publication number 20140264460
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Chip Packaging Fixture And Method Of Using Magnetic Field Ass...
- Publication number 20110262258
- Publication date Oct 27, 2011
- Jack Zezhong Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Magnetically Driven Simultaneous Assembly
- Publication number 20110197429
- Publication date Aug 18, 2011
- Nuggehalli Ravindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEM...
- Publication number 20100170086
- Publication date Jul 8, 2010
- Agency for Science, Technology and Research
- Qasem Ramadan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-addressable self-assembling microelectronic systems and device...
- Publication number 20100173792
- Publication date Jul 8, 2010
- Nanogen
- Michael J. Heller
- C40 - COMBINATORIAL CHEMISTRY
Information Patent Application
THERMALLY CONTROLLED FLUIDIC SELF-ASSEMBLY
- Publication number 20100122654
- Publication date May 20, 2010
- Ravi Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self assembly of elements for displays
- Publication number 20100117952
- Publication date May 13, 2010
- Searete LLC
- W. Daniel Hillis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self assembly of elements for displays
- Publication number 20100065188
- Publication date Mar 18, 2010
- Searete LLC
- W. Daniel Hillis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic self-assembly for integrated circuit packages
- Publication number 20100015730
- Publication date Jan 21, 2010
- Sensormatic Electronics Corporation
- Ming-Ren Lian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLAR CELL AND MAGNETICALLY SELF-ASSEMBLED SOLAR CELL ASSEMBLY
- Publication number 20090178709
- Publication date Jul 16, 2009
- GENERAL ELECTRIC COMPANY
- William Hullinger Huber
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of Assembly Using Array of Programmable Magnets
- Publication number 20080315336
- Publication date Dec 25, 2008
- NEW JERSEY INSTITUTE OF TECHNOLOGY
- Nuggehalli M. Ravindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Magnetically-Directed, Self-Assembly of Th...
- Publication number 20080218299
- Publication date Sep 11, 2008
- David Patrick Arnold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Articles and assembly for magnetically directed self assembly and m...
- Publication number 20080135956
- Publication date Jun 12, 2008
- General Electric Company
- William Hullinger Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chips for TAG Applications, Devices for Mounting the...
- Publication number 20080121724
- Publication date May 29, 2008
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAGNETICALLY DIRECTED SELF-ASSEMBLY OF MOLECULAR ELECTRONIC JUNCTIONS
- Publication number 20080124550
- Publication date May 29, 2008
- THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETA...
- David P. Long
- B82 - NANO-TECHNOLOGY
Information Patent Application
MAGNETICALLY DIRECTED SELF-ASSEMBLY OF MOLECULAR ELECTRONIC JUNCTIONS
- Publication number 20080090021
- Publication date Apr 17, 2008
- The Goverment of the United States of America, as represented by the Secretar...
- David P. Long
- B82 - NANO-TECHNOLOGY

Magnetic alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure of micro light-emitting device and method of transferring...

Substrate bonding apparatus and method of manufacturing a semicondu...

High registration particles-transferring system

Adsorption device, transferring system having same, and transferrin...

Method of manufacturing an LED carrier assembly having an embedded...

Solution deposited magnetically guided chiplet displacement

High registration particles-transferring system

Transferring method, manufacturing method, device and electronic ap...

Fluid-suspended microcomponent harvest, distribution, and reclamation

Assembling method, manufacturing method, device and electronic appa...

Transferring method, manufacturing method, device and electronic ap...

Manufacture of wafer—panel die package assembly technology

Light emitting diodes and a method of packaging the same

Three-terminal printed devices interconnected as circuits

Light emitting diodes and a method of packaging the same

Three-terminal printed devices interconnected as circuits

Chip packaging fixture using magnetic field for self-alignment

Self assembly of elements for displays

Solar cell and magnetically self-assembled solar cell assembly

Self assembly of elements for displays

Self assembly of elements for displays

Actuator enhanced alignment of self-assembled microstructures

Method and structure for magnetically-directed, self-assembly of th...

Xerographic micro-assembler

Functional blocks for assembly

Method and system for magnetically assisted statistical assembly of...

Self-addressable self-assembling microelectronic systems and device...

Semiconductor chips for TAG applications, devices for mounting the...

Magnetic self-assembly for integrated circuit packages

Method of assembly using array of programmable magnets

Patents Applicationslast 30 patents

MAGNET UNIT OF SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXE...

SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXEL AND DISPLAY D...

LIGHT EMITTING DIODE AND DISPLAY DEVICE COMPRISING THE SAME

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

SELF-ASSEMBLY DEVICE

STRUCTURE OF MICRO LIGHT-EMITTING DEVICE AND METHOD OF TRANSFERRING...

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

METHOD OF MANUFACTURING AN LED CARRIER ASSEMBLY

METHODS AND SYSTEMS FOR PARALLEL ASSEMBLY, TRANSFER, AND BONDING OF...

Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation

Transferring Method, Manufacturing Method, Device and Electronic Ap...

ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPA...

TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...

MANUFACTURE OF WAFER - PANEL DIE PACKAGE ASSEMBLY TECHNOLOGY

THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS

Small Chip Packaging Fixture And Method Of Using Magnetic Field Ass...

Method of Magnetically Driven Simultaneous Assembly

DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEM...

Self-addressable self-assembling microelectronic systems and device...

THERMALLY CONTROLLED FLUIDIC SELF-ASSEMBLY

Self assembly of elements for displays

Self assembly of elements for displays

Magnetic self-assembly for integrated circuit packages

SOLAR CELL AND MAGNETICALLY SELF-ASSEMBLED SOLAR CELL ASSEMBLY

Method of Assembly Using Array of Programmable Magnets

Method and Structure for Magnetically-Directed, Self-Assembly of Th...

Articles and assembly for magnetically directed self assembly and m...

Semiconductor Chips for TAG Applications, Devices for Mounting the...

MAGNETICALLY DIRECTED SELF-ASSEMBLY OF MOLECULAR ELECTRONIC JUNCTIONS

MAGNETICALLY DIRECTED SELF-ASSEMBLY OF MOLECULAR ELECTRONIC JUNCTIONS