Magnetic holding means

Industry

CPC
H01L2224/75733

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75733Magnetic holding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,521,878
- Issue date Dec 6, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming 3DIC package
- Patent number 9,073,158
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming 3DIC package
- Patent number 8,609,462
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip bonding apparatus
- Patent number 8,042,593
- Issue date Oct 25, 2011
- Samsung Electronics Co., Ltd.
- Cheal-Sang Yoon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor chips for TAG applications, devices for mounting the...
- Patent number 7,922,093
- Issue date Apr 12, 2011
- Infineon Technologies AG
- Gottfried Beer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer, an electronic component, and a component carri...
- Patent number 7,397,111
- Issue date Jul 8, 2008
- Infineon Technologies, AG
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20140091509
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20130095608
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS
- Publication number 20090020229
- Publication date Jan 22, 2009
- Samsung Electronics Co., Ltd.
- Cheal-Sang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chips for TAG Applications, Devices for Mounting the...
- Publication number 20080121724
- Publication date May 29, 2008
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor wafer, an electronic component, and a component carri...
- Publication number 20060131712
- Publication date Jun 22, 2006
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS

Magnetic holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing a semicondu...

Adsorption device, transferring system having same, and transferrin...

Light emitting diodes and a method of packaging the same

Light emitting diodes and a method of packaging the same

Methods for forming 3DIC package

Methods for forming 3DIC package

Semiconductor chip bonding apparatus

Semiconductor chips for TAG applications, devices for mounting the...

Semiconductor wafer, an electronic component, and a component carri...

Patents Applicationslast 30 patents

Methods for Forming 3DIC Package

Methods for Forming 3DIC Package

SEMICONDUCTOR CHIP BONDING APPARATUS

Semiconductor Chips for TAG Applications, Devices for Mounting the...

Semiconductor wafer, an electronic component, and a component carri...