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CPC
H01L2224/76733
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/76733
Magnetic holding means
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
Patent number
12,002,700
Issue date
Jun 4, 2024
Kioxia Corporation
Sho Kawadahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid-suspended microcomponent harvest, distribution, and reclamation
Patent number
10,242,977
Issue date
Mar 26, 2019
eLux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diodes and a method of packaging the same
Patent number
9,418,979
Issue date
Aug 16, 2016
Renssealer Polytechnic Institute
Robert F. Karlicek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diodes and a method of packaging the same
Patent number
9,245,875
Issue date
Jan 26, 2016
Rensselaer Polytechnic Institute
Robert F. Karlicek
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation
Publication number
20180102352
Publication date
Apr 12, 2018
eLux Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS