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Magnetic holding means
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CPC
H01L2224/77733
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/77733
Magnetic holding means
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Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
Patent number
12,002,700
Issue date
Jun 4, 2024
Kioxia Corporation
Sho Kawadahara
H01 - BASIC ELECTRIC ELEMENTS