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REUSABLE MODULAR SUBSTRATE
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NXP USA, Inc.
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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WIRING SUBSTRATE
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Resonac Corporation
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Laser Platable Thermoplastic Compositions
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Publication number 20220227930
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Publication date Jul 21, 2022
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SHPP Global Technologies B.V.
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ELECTRONIC CIRCUIT
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Publication date Feb 4, 2021
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Teknologian Tutkimuskeskus VTT Oy
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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MATERIAL DEPOSITION IN A MAGNETIC FIELD
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Publication number 20200024741
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Publication date Jan 23, 2020
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Coventry University
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POWER CONVERTER MODULE
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ELECTRICAL COMPONENT
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Publication number 20160037641
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Publication date Feb 4, 2016
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Micronas GmbH
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Joerg FRANKE
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR