Patent Application
20190150296
Radio frequency (RF) and electromagnetic circuits may be manufactured using conventional printed circuit board (PCB) processes. Some RF and electromagnetic circuits may include interconnections between layers (e.g., laminates, substrates, etc.) of a circuit, such as a circuit board, for example to convey a signal from one layer of the circuit to another. Conventional PCB manufacturing processes may include an electroplating process to provide an electrical conductor between layers, e.g., a via, which may require multiple differing steps, including baths in hazardous materials, and may require multiple iterations, extensive labor, etc., all leading to higher cost and slower turnaround time. Additionally, conventional PCB manufacturing processes have limited ability to allow for small feature sizes, such as signal trace dimensions and dimensions of dielectric materials between conductors (e.g., dielectric thickness, inter-via spacing, etc.), thereby limiting the range of highest frequency signals that may be supported by such devices.
Aspects and embodiments described herein provide simplified circuit structures, and manufacturing methods thereof, for conveyance of electrical signals, especially radio frequency signals, between layers (e.g., vertically) of a circuit. Various embodiments of circuits in accord with those described herein may be constructed of, e.g., laminate or dielectric substrates, and may have circuit features, signal layers, ground planes, or other circuit structures therebetween. Further, various signal conductors and circuit structures may be fabricated more simply and with smaller feature sizes than conventional techniques. Such circuit structures are suitable for higher frequency operation into the millimeter wave range, as well as conventional microwave ranges. Circuits, structures, and fabrication methods described herein use subtractive and additive manufacturing technology to achieve smaller sizes and higher frequency operation.
According to one aspect, a circuit board is provided that includes a first substrate having a first surface, a second substrate having a second surface; the second surface facing the first surface, a hole disposed through the first substrate (e.g., the hole may be substantially normal to the first surface), an electrical component disposed adjacent each of the first surface and the second surface, the electrical component being at least partially encapsulated (e.g., sandwiched) between the first substrate and the second substrate, the electrical component having a portion substantially aligned with the hole, and an electrical conductor disposed within the hole, the electrical conductor having a first terminal end and a second terminal end, the first terminal end soldered to the portion of the electrical component.
In certain embodiments, the electrical conductor is a solid wire. The solid wire may be a copper wire.
Some embodiments include bonding material configured to bond the first substrate to the second substrate, directly or indirectly, at each of the first surface and the second surface. Accordingly, the first and second substrates may be bonded together to substantially encapsulate the electrical component. Various portions of the electrical component may extend to an exterior of one or more of the first substrate and/or the second substrate in various embodiments.
According to certain embodiments, the electrical component is a signal trace line formed of an electrically conductive material, and the portion substantially aligned with the hole forms a terminal covering to the hole. In some embodiments, the signal trace line may provide an input or an output for a radio frequency signal, and may extend to an exterior of one or more of the first substrate and/or the second substrate.
Various embodiments include a second electrical component having a portion soldered to the second terminal end of the electrical conductor. In some embodiments, the second electrical component may be one of a signal terminal, an electrical connector, a cable, and an electromagnetic radiator. The second electrical component may be surface mounted to a third surface. In some embodiments, the second electrical component may substantially encapsulated between two substrates, either or neither of which may be one of the first substrate or the second substrate.
Some embodiments include a ground plane disposed adjacent an opposing surface of the second substrate, the ground plane configured to provide an electromagnetic boundary condition to the signal trace line.
According to another aspect, a method of manufacturing an electromagnetic circuit is provided. The method includes providing a circuit feature upon a surface of at least one of a first substrate or a second substrate, forming a hole in at least one of the first substrate or the second substrate, the hole positioned to substantially align with a portion of the circuit feature, applying solder to at least one of an electrical conductor and the portion of the circuit feature, bonding the first substrate, directly or indirectly, to the second substrate, a bonded orientation of the first substrate and the second substrate being configured to at least partially encapsulate (e.g., sandwich) the circuit feature between the first substrate and the second substrate and to substantially align the hole with the portion of the circuit feature, the hole being positioned to provide access to the portion of the circuit feature, inserting the electrical conductor in the hole, and reflowing the solder to form an electrical connection between the electrical conductor and the portion of the circuit feature.
In certain embodiments, inserting the electrical conductor in the hole comprises inserting a segment of solid wire into the hole. The wire may be copper.
In various embodiments, providing the circuit feature upon a surface comprises milling an electrically conductive material from the surface to form the circuit feature. Milling the electrically conductive material from the surface to form the circuit feature may include milling the electrically conductive material to form a signal trace line.
According to various embodiments, the circuit feature is a first circuit feature, and the method further includes providing a second circuit feature having a second portion positioned to substantially align with an opposing opening of the hole, and applying solder to form an electrical connection between the electrical conductor and the second portion. In some embodiments, providing the second circuit feature includes milling an electrically conductive material to form an electromagnetic radiator. In some embodiments, providing the second circuit feature includes milling an electrically conductive material to form a signal terminal pad configured to be coupled to at least one of an electrical connector or an electrical cable.
According to another aspect, a circuit board is provided that includes a first dielectric substrate bonded directly or indirectly to a second dielectric substrate, a signal trace line formed of an electrically conductive material disposed adjacent an interior surface, the interior surface being between the first dielectric substrate and the second dielectric substrate, a hole disposed through the second dielectric substrate, the hole substantially aligned with a portion of the signal trace line, an electrical conductor disposed within the hole, and a solder joint formed between a first terminal end of the electrical conductor and the portion of the signal trace line.
In some embodiments, the electrical conductor is a segment of solid wire having a loose fit relative to a wall of the hole. The wire may be copper.
Some embodiments include an electrical component having a portion soldered to a second terminal end of the electrical conductor, the electrical component being at least one of a signal terminal, an electrical connector, a cable, and an electromagnetic radiator. In various embodiments, the signal trace line is configured to convey a radio frequency signal to or from the electrical component via the electrical conductor. In various embodiments, the electrical component is surface mounted to an exterior surface of one of the second dielectric substrate or a further substrate bonded directly or indirectly to the second dielectric substrate.
Still other aspects, examples, and advantages are discussed in detail below. Embodiments disclosed herein may be combined with other embodiments in any manner consistent with at least one of the principles disclosed herein, and references to “an embodiment,” “some embodiments,” “an alternate embodiment,” “various embodiments,” “one embodiment” or the like are not necessarily mutually exclusive and are intended to indicate that a particular feature, structure, or characteristic described may be included in at least one embodiment. The appearances of such terms herein are not necessarily all referring to the same embodiment. Various aspects and embodiments described herein may include means for performing any of the described methods or functions.
Various aspects of at least one embodiment are discussed below with reference to the accompanying figures, which are not intended to be drawn to scale. The figures are included to provide illustration and a further understanding of the various aspects and embodiments, and are incorporated in and constitute a part of this specification, but are not intended as a definition of the limits of the disclosure. In the figures, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every figure. In the figures:
Aspects and examples described herein provide inter-layer signal conveyance within various circuits, suitable for various circuit board manufacturing, including radio frequency circuit embodiments. The aspects and examples described herein advantageously apply additive and subtractive manufacturing techniques to provide structures for conveyance of a signal between layers, which may convey a signal from various circuit components or features to other circuit components or features. In some embodiments, a vertical launch structure may feed a signal to a radiator (e.g., an antenna), and likewise receive a signal from the radiator, which may be part of an array of radiating elements. In some embodiments, a vertical launch structure may feed a signal to a connector, a waveguide, a cable, etc. to be conveyed to further circuit components or features. In some embodiments, a vertical launch structure may feed a signal to (or receive a signal from) a signal divider (or combiner), which may be part of a beamformer for an array of radiating elements. Various embodiments may employ a vertical launch structure to convey a signal to various other circuit components or features.
Manufacturing processes described herein may be particularly suitable for fabrication of such circuit structures having small circuit features capable of supporting electromagnetic signals in the range of 8 to 75 GHz or more, for example, and up to 300 GHz or more, using suitable subtractive (e.g., milling, drilling) and additive (e.g., 3-D printing, filling) manufacturing equipment. Electromagnetic circuit structures in accord with systems and methods described herein may be particularly suitable for application in 28 to 70 GHz systems, including millimeter wave communications, sensing, ranging, etc. Aspects and embodiments described may also be suitable for lower frequency applications, such as in the S-band (2-4 GHz), X-band (8-12 GHz), or others.
It is to be appreciated that embodiments of the methods and apparatuses discussed herein are not limited in application to the details of construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. The methods and apparatuses are capable of implementation in other embodiments and of being practiced or of being carried out in various ways. Examples of specific implementations are provided herein for illustrative purposes only and are not intended to be limiting. Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use herein of “including,” “comprising,” “having,” “containing,” “involving,” and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. References to “or” may be construed as inclusive so that any terms described using “or” may indicate any of a single, more than one, and all of the described terms. Any references to front and back, left and right, top and bottom, upper and lower, end, side, vertical and horizontal, and the like, are intended for convenience of description, not to limit the present systems and methods or their components to any one positional or spatial orientation.
The term “radio frequency” as used herein is not intended to be limited to a particular frequency, range of frequencies, band, spectrum, etc., unless explicitly stated and/or specifically indicated by context. Similarly, the terms “radio frequency signal” and “electromagnetic signal” are used interchangeably and may refer to a signal of various suitable frequency for the propagation of information-carrying signals, for any particular implementation. Such radio frequency signals may generally be bound at the low end by frequencies in the kilohertz (kHz) range, and bound at the high end by frequencies of up to hundreds of gigahertz (GHz), and explicitly includes signals in the microwave or millimeter wave ranges. Generally, systems and methods in accord with those described herein may be suitable for handling non-ionizing radiation, at frequencies below those conventionally handled in the field of optics, e.g., of lower frequency than, e.g., infrared signals.
Various embodiments of radio frequency circuits may be designed with dimensions selected and/or nominally manufactured to operate at various frequencies. The selection of appropriate dimensions may be had from general electromagnetic principles and are not presented in detail herein.
The methods and apparatuses described herein may support smaller arrangements and dimensions than conventional processes are capable. Conventional circuit boards may be limited to frequencies below about 30 GHz. The methods and apparatuses described herein may allow or accommodate the manufacture of electromagnetic circuits of smaller dimensions, suitable for radio frequency circuits intended to be operated at higher frequencies, using safer and less complex manufacturing, at lower cost.
Electromagnetic circuits and methods of manufacture in accord with those described herein include various additive and subtractive manufacturing techniques to produce electromagnetic circuits and components capable of handling higher frequencies, with lower profiles, and at reduced costs, cycle times, and design risks, than conventional circuits and methods. Examples of techniques include machining (e.g., milling) of conductive material from a surface of a substrate to form signal traces (e.g., signal conductors, striplines) or apertures, which may be of significantly smaller dimensions than allowed by conventional PCB processes, machining of one or more substrates to form a trench, using 3-dimensional printing techniques to deposit printed conductive inks into the trench to form a continuous electric barrier (e.g., a Faraday wall) (e.g., as opposed to a series of ground vias that require minimum spacing), “vertical launch” signal paths formed by machining (such as milling, drilling, or punching) a hole through a portion of substrate and in which a wire is placed (and/or conductive ink is printed) to make electrical contact to a signal trace disposed on a surface of the substrate (or an opposing substrate), and using 3-dimensional printing techniques to deposit printed resistive inks to form resistive components.
Any of the above example techniques and/or others (e.g., soldering and/or solder reflow), may be combined to make various electromagnetic components and/or circuits. Aspects and examples of such techniques are described and illustrated herein with respect to a radio frequency interconnect to contain and convey an electromagnetic signal along a layer of an electromagnetic circuit in one dimension and vertically through to other layers of the circuit in another dimension. The techniques described herein may be used to form various electromagnetic components, connectors, circuits, assemblies, and systems.
In various embodiments, the conductor 110 is inserted into an opening in one or more substrates and/or layers of the circuit structure 100, and may be physically and electrically secured by a solder joint, such as by direct application of a solder joint (e.g., solder 190) and/or by application of a solder bump (e.g., tinning) at one or more locations or surfaces followed by a solder reflow operation at some point during the manufacturing process. Accordingly, the conductor 110 is not required to be compression or force fit inside the opening (hole), and may have a loose fit relative to the wall(s) of the opening. In the example of
In various embodiments, one or more openings in one or more substrates to accommodate the conductor 110 may be formed by milling or drilling a hole appropriately sized to accommodate the conductor 110. The conductor 110 may be a wire, such as a copper or other conductive wire, which may be solid, hollow, single-stranded, or multi-stranded. As illustrated in
In various embodiments there may be circuit components between various intermediate substrates 140, 150, such as the ground plane 160 shown in
The example shown in
In some embodiments, further ground planes or structures may be included in the circuit structure 100, not in the plane of
Various manufacturing methods to provide a “vertical launch” inter-layer signal connection, disposed among various substrates and circuit layers in accord with aspects and embodiments herein, are described with respect to
The substrate 140 may then be bonded to the substrate 180, via a bonding material (e.g., adhesive) of various types and bonding methods. A hole 142 is milled through the substrate 140 to provide access to the terminal end of the signal trace 120 (and the solder bump 192). In various embodiments, the hole 142 may be milled before bonding the substrate 140 to the substrate 180, or after.
The substrate 150 may be provided with electrical conducting material disposed on opposing faces, similar to the substrate 180 as described above. One face of conducting material may become the ground plane 160. A portion of conducting material on the opposing face of the substrate 150 may become the signal terminal 130. In some embodiments, the signal terminal 130 may be formed by milling away some conducting material from the respective face of the substrate 150. In other embodiments, the signal terminal 130 may be formed by other means. In some embodiments, as described above, the signal terminal 130 may be or include differing structures and/or circuit components. For example, the signal terminal 130 may be a radiator having any of various shapes disposed on the surface of the substrate 150, such as a linear or spiral signal trace configured to radiate electromagnetic energy, e.g., when fed with an appropriate signal by the conductor 110. In other embodiments, the signal terminal 130 may be a surface mounting point for a connector or a cable, or may be or form a portion of a second signal trace, such as the signal trace 220 of the circuit structure 200, for example. In various embodiments, differing structures may be included at or near the position of the signal terminal 130 illustrated in
With continued reference to the example of an assembly process illustrated by
The substrate 150 (and/or an exterior surface of the ground plane 160) may be bonded to the substrate 140. The ground plane 160 may thereby be encapsulated between the substrate 140 and the substrate 150. Once bonded, the holes 142, 152 may form a substantially continuous opening through the substrates 140, 150 to provide access to the terminal end of the signal trace 120 (and the solder bump 192). The conductor 110 may be inserted into the holes 142, 152. Heat 194 (e.g., from a soldering tool) may be applied to the solder 190 to form a secure electrical connection between one end of the conductor 110 and the signal terminal 130. The applied heat 194 may be conveyed through the conductor 110 to the other end of the conductor 110, which may reflow the solder bump 192 applied to terminal end of the signal trace 120 or, optionally, may reflow a solder bump that was previously applied to the other end of the conductor 110. Accordingly, reflowed solder may form a secure electrical connection between the terminal end of the signal trace 120 and the conductor 110.
Numerous variations to the above method of manufacture (or assembly) of the electromagnetic circuit structure 100 may be included among various embodiments. For example, the substrates 140, 150 may be bonded together prior to milling holes 142, 152, such that a single hole may be milled through the bonded combination of the substrates 140, 150. Further, the substrates 180, 140, 150 may all be bonded together prior to milling a hole through the substrate 140, 150 to provide access to the terminal end of the signal trace 120. The ground plane 160 may be formed as a conductive material disposed upon the substrate 140 rather than upon the substrate 150, or the ground plane 160 may be a laminate layer bonded to each of the substrates 140, 150 during manufacture, e.g., not previously disposed upon either of the substrates 140, 150. In other embodiments, a ground plane 160 may be excluded. The signal trace 120 may be formed out of a conductive material disposed upon the substrate 140 rather than upon the substrate 120. As described above, a solder bump may be placed on the conductor 110 where it is to make electrical contact with the signal trace 120, instead of or in addition to the solder bump 192 illustrated on the signal trace 120. Those of skill in the art, with the benefit of this disclosure, may identify numerous variations to the various components and methods that may yield a “vertical launch” conductor, configured to convey signals between layers of a circuit, in keeping with aspects and embodiments described herein.
Further, as in the above described method options with respect to
In various embodiments, bonding may include a heating process, and a solder reflow may be achieved with the same heating process in some embodiments. For example, two or more substrates may be positioned and/or aligned for bonding, with an adhesive or bonding material disposed between, and an electrical conductor may be inserted through one or more holes, and such an assembly may be heated to complete both bonding and solder reflow. In some embodiments, additional substrates may be positioned and/or aligned before heating, such that an electrical conductor (with solder tinning on the conductor or on portions of various circuit features) may be disposed within or encapsulated by a multi-layer electromagnetic circuit structure, and bonding of various layers and reflow of various solder bumps/tinning may be achieved with one or more heating steps or processes.
Further advantages of systems and methods described herein may be realized. For example, conventional PCB manufacturing may impose limitations on circuit feature sizes, such as the width of signal traces and the diameter of through-holes for inter-layer connections which, in comparison with systems and method described herein, may limit the highest frequencies for which conventionally made electromagnetic circuits may be suitable. Aspects and embodiments herein, however, allow substantially smaller signal traces and smaller “vertical launch” connections, formed using less complex manufacturing methods, than conventional PCB manufacturing techniques.
Further, substrate thicknesses impact characteristic impedance (e.g., due to the distance to ground planes disposed upon opposing surfaces), in relation to width of signal traces, such that wider traces required by conventional PCB processes cause selection of thicker substrates, which may limit how thin the circuit can be manufactured. For example, general recommendations under conventional PCB manufacturing include total thicknesses of about 60 mil (0.060 inches). By comparison, electromagnetic circuits in accord with aspects and embodiments described, using subtractive and additive manufacturing techniques, can result in circuit boards having a low profile down to a thickness of about 10 mil or less, with signal line traces having widths of about 4.4 mil, or 2.7 mil, or less, with inter-layer “vertical launch” connections being accordingly small diameters, and interconnect geometries substantially flush with a surface of the board.
Various electromagnetic circuits and methods in accord with aspects and embodiments described herein, using various subtractive and additive manufacturing techniques, allow for electrically continuous structures to connect ground planes. Accordingly, an electrically continuous structure may be provided and disposed vertically through one or more substrates, (e.g., between opposing surfaces of the substrate) to form “Faraday walls” that confine electric fields. In various embodiments, such Faraday walls may electrically couple two or more ground planes. Further in various embodiments, such Faraday walls may confine and isolate electromagnetic fields from neighboring circuit components. In some embodiments, such Faraday walls may enforce a boundary condition to limit electromagnetic signals to be locally transverse electric-magnetic (TEM) fields, e.g., limiting signal propagation via a signal trace line to a TEM mode.
In various embodiments, various subtractive (milling, drilling), additive (printing, filling, inserting), and adherent (bonding) steps may be carried out, in various orders, with soldering and reflow operations as necessary, to form an electromagnetic circuit having one or any number of substrate layers, that may include one or more vertical (e.g., inter-layer) signal connections in accord with those described herein, and may include radiators, receptors, Faraday walls, signal traces, terminal pads, or other features.
A generalized method for making any of various electromagnetic circuits includes milling a conductive material disposed on a substrate to form circuit features, printing (or depositing, e.g., via 3-D printing, additive manufacturing techniques) additional circuit features, such as resistors formed of resistive ink, for example, depositing solder on any feature, as necessary, milling (or drilling) through substrate material (and/or conductive materials) to form openings, such as holes, voids, or trenches, and depositing or printing (e.g., via 3-D printing, additive manufacturing techniques) conductive material (such as conductive ink or a wire conductor) into the holes, voids, trenches, for example to form vertical signal launches as described herein, or to form Faraday walls or other circuit structures. Any of these steps may be done in different orders, repeated, or omitted as necessary for a given circuit design, and to build up layers such as may include bonding steps to adhere one substrate or layer to the next, and continuing with repeated steps as necessary. Accordingly, in some embodiments, multiple substrates may be involved in the manufacture of an electromagnetic circuit, and the method includes bonding further substrates as necessary, further milling and filling operations, and further soldering and/or reflow operations.
Having described several aspects of at least one embodiment of a vertical signal launch and a method for manufacturing the same or other electromagnetic circuits, the above descriptions may be employed to produce various electromagnetic circuits having very low profiles, such as thicknesses of 10 mils (0.010 inches, 254 microns) or less, and may include signal traces as narrow as 4.4 mils (111.8 microns), 2.7 mils (68.6 microns), or even as narrow as 1.97 mils (50 microns) or less, depending upon tolerances and accuracy of various milling and additive manufacturing equipment used. Accordingly, electromagnetic circuits in accord with those described herein may be suitable for X-Band and higher frequencies, with various embodiments capable of accommodating frequencies over 28 GHz, and up to 70 GHz or higher. Some embodiments may be suitable for frequency ranges up to 300 GHz or more.
Additionally, electromagnetic circuits in accord with those described herein may have a low enough profile, with accordant light weight, to be suitable for outer space applications, including folding structures to be deployed by unfolding when positioned in outer space.
Further, electromagnetic circuits manufactured in accord with methods described herein accommodate less expensive and faster prototyping, without the necessity for caustic chemicals, masking, etching, bathing, electroplating, etc. Simple substrates with pre-plated conductive material disposed on one or both surfaces (sides) may form the core starting material(s), and all elements of an electromagnetic circuit may be formed by milling (subtractive, drilling), filling (additive, inserting, printing of conductive and/or resistive inks), and bonding one or more substrates. Simple solder reflow operations and insertion of simple conductors (e.g., copper wire) are accommodated by methods and systems described herein.
Further, electromagnetic circuits manufactured in accord with methods described herein may accommodate deployment on, or designs calling for, non-planar surfaces. Thin, low-profile electromagnetic circuits, such as described herein and others, may be manufactured using mill, fill, and bond techniques as described herein to produce electromagnetic circuits having various contours to accommodate changing applications, to conform to a surface (such as a vehicle) or to support complex array structures, for example.
Having thus described several aspects of at least one embodiment, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the scope of the disclosure. Accordingly, the foregoing description and drawings are by way of example only.
This application claims the benefit under 35 U.S.C. § 119(e) of co-pending U.S. Provisional Patent Application No. 62/584,260 titled SPIRAL ANTENNA AND RELATED FABRICATION TECHNIQUES filed on Nov. 10, 2017, U.S. Provisional Patent Application No. 62/584,264 titled ADDITIVE MANUFACTURING TECHNOLOGY (AMT) LOW PROFILE RADIATOR filed on Nov. 10, 2017, U.S. Provisional Patent Application No. 62/636,364 titled SNAP-RF INTERCONNECTIONS filed on Feb. 28, 2018, and U.S. Provisional Patent Application No. 62/636,375 titled ADDITIVE MANUFACTURING TECHNOLOGY (AMT) LOW PROFILE SIGNAL DIVIDER filed on Feb. 28, 2018, each of which is herein incorporated by reference in its entirety for all purposes.
| Number | Date | Country | |
|---|---|---|---|
| 62636364 | Feb 2018 | US | |
| 62636375 | Feb 2018 | US | |
| 62584260 | Nov 2017 | US | |
| 62584264 | Nov 2017 | US |
