Making conductive layer thin

Industry

CPC
H05K2203/0353

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0353Making conductive layer thin

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 11,026,335
- Issue date Jun 1, 2021
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 10,757,818
- Issue date Aug 25, 2020
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,743,414
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 10,653,012
- Issue date May 12, 2020
- Gio Optoelectronics Corp.
- Chin-Tang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure comprising an inductor and resistor
- Patent number 10,586,774
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method for producing the same
- Patent number 10,426,031
- Issue date Sep 24, 2019
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Tadahiro Kaibuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, electronic device, catheter, and metallic mat...
- Patent number 10,194,534
- Issue date Jan 29, 2019
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,163,774
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vehicular panel and wiring structure for vehicle
- Patent number 10,017,133
- Issue date Jul 10, 2018
- Yazaki Corporation
- Mitsunori Tsunoda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for constructing an external circuit structure
- Patent number 10,015,889
- Issue date Jul 3, 2018
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Zhongyao Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and structure
- Patent number 9,900,996
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,661,748
- Issue date May 23, 2017
- FANUC CORPORATION
- Norihiro Saidou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board structure
- Patent number 9,622,354
- Issue date Apr 11, 2017
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device of manufacturing printed circuit board having a s...
- Patent number 9,585,258
- Issue date Feb 28, 2017
- LG Innotek Co., Ltd
- Yeong Uk Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,572,256
- Issue date Feb 14, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,549,465
- Issue date Jan 17, 2017
- LG Innotek Co., Ltd
- Chang Woo Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 9,516,764
- Issue date Dec 6, 2016
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,433,107
- Issue date Aug 30, 2016
- LG Innotek Co., Ltd
- Hyun Seok Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including an embedded electronic component
- Patent number 8,975,116
- Issue date Mar 10, 2015
- Technische Universitat Berlin
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240107667
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230113278
- Publication date Apr 13, 2023
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...
- Publication number 20220201853
- Publication date Jun 23, 2022
- Rohm and Haas Electronic Materials L.L.C.
- CHIH-LIANG CHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...
- Publication number 20220201852
- Publication date Jun 23, 2022
- Rohm and Haas Electronic Materials L.L.C.
- CHIH-LIANG CHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...
- Publication number 20210127503
- Publication date Apr 29, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20200077526
- Publication date Mar 5, 2020
- Nichia Corporation.
- Rie MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20170071061
- Publication date Mar 9, 2017
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTI-LAYERED PRINTED CIRCUIT BOARD
- Publication number 20150059173
- Publication date Mar 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Youn Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140360761
- Publication date Dec 11, 2014
- Hyun Seok Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140353006
- Publication date Dec 4, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- TAEKOO LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device of Manufacturing Printed Circuit Board
- Publication number 20140345913
- Publication date Nov 27, 2014
- Yeong Uk Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140332255
- Publication date Nov 13, 2014
- Chang Woo Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTUR...
- Publication number 20140311778
- Publication date Oct 23, 2014
- Mitsubishi Gas Chemical Company, Inc.
- Tomoko SUZUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20140059851
- Publication date Mar 6, 2014
- Imbera Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20130134127
- Publication date May 30, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING AN EMBEDDED ELECTRONIC COMPONENT
- Publication number 20130015572
- Publication date Jan 17, 2013
- Technische Universitat Berlin
- Andreas Ostmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120255769
- Publication date Oct 11, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20120216946
- Publication date Aug 30, 2012
- FUJIKURA LTD.
- Takaharu HONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE
- Publication number 20120137505
- Publication date Jun 7, 2012
- Raytheon Company
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PRINTED WIRING BOARD...
- Publication number 20120132464
- Publication date May 31, 2012
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20110127675
- Publication date Jun 2, 2011
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE
- Publication number 20110113618
- Publication date May 19, 2011
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110079421
- Publication date Apr 7, 2011
- Young Gwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...
- Publication number 20100328868
- Publication date Dec 30, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...
- Publication number 20100270646
- Publication date Oct 28, 2010
- GEORGIA TECH RESEARCH CORPORATION
- Cheong-Wo Hunter Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Making conductive layer thin

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and method for manufacturing wiring substrate

Redistribution plate

Circuit board structure and method for manufacturing a circuit boar...

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Redistribution plate

Circuit board structure and method for manufacturing a circuit boar...

Wiring board manufacturing method and wiring board

Protrusion bump pads for bond-on-trace processing

Wiring board manufacturing method and wiring board

Resin multilayer substrate and method of manufacturing the same

Electronic device and manufacturing method thereof

Structure comprising an inductor and resistor

Flexible printed circuit board and method for producing the same

Printed wiring board, electronic device, catheter, and metallic mat...

Protrusion bump pads for bond-on-trace processing

Vehicular panel and wiring structure for vehicle

Laminate electronic device

Method for constructing an external circuit structure

Package substrate and structure

Printed circuit board and method of manufacturing the same

Method for manufacturing a circuit board structure

Manufacturing method for component incorporated substrate and compo...

Method and device of manufacturing printed circuit board having a s...

Printed wiring board, method for manufacturing printed wiring board...

Printed circuit board and method of manufacturing the same

Method for manufacturing multilayer wiring substrate

Printed circuit board and method of manufacturing the same

Method of fabricating a wiring board

Method of fabricating a wiring board

Electronic assembly including an embedded electronic component

Patents Applicationslast 30 patents

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...

METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...

ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

Protrusion Bump Pads for Bond-on-Trace Processing

Circuit board structure and method for manufacturing a circuit boar...

METHOD FOR MANUFACTURING MULTI-LAYERED PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Method and Device of Manufacturing Printed Circuit Board

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTUR...

LAMINATE ELECTRONIC DEVICE

Circuit board structure and method for manufacturing a circuit boar...

WIRING BOARD AND METHOD OF FABRICATING THE SAME

ELECTRONIC ASSEMBLY INCLUDING AN EMBEDDED ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING WIRING SUBSTRATE

PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PRINTED WIRING BOARD...

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

LAMINATE ELECTRONIC DEVICE

PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...

THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...