Making grooves

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H01L21/3043

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3043Making grooves

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing wafer
- Patent number 12,170,224
- Issue date Dec 17, 2024
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method
- Patent number 12,106,967
- Issue date Oct 1, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method and machine
- Patent number 12,100,620
- Issue date Sep 24, 2024
- Disco Corporation
- Yoshinobu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip manufacturing method
- Patent number 12,087,630
- Issue date Sep 10, 2024
- Disco Corporation
- Kazuki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming thereof
- Patent number 12,051,624
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer structure and method of providing same
- Patent number 12,014,990
- Issue date Jun 18, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure, semiconductor structure and method of fabricat...
- Patent number 12,015,013
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density low power interconnect using 3D die stacking
- Patent number 11,942,409
- Issue date Mar 26, 2024
- MARVELL ASIA PTE. LTD.
- Ferran Martorell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of silicon carbide semiconductor wafers
- Patent number 11,942,327
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Aira Lourdes Villamor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
- Patent number 11,901,171
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of semiconductor die and chip-on-plastic packagi...
- Patent number 11,901,322
- Issue date Feb 13, 2024
- MagnaChip Semiconductor, Ltd.
- Jin Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 11,887,858
- Issue date Jan 30, 2024
- Kabushiki Kaisha Toshiba
- Shinji Nunotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer to a carrier substrate
- Patent number 11,876,015
- Issue date Jan 16, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Die cleaning systems and related methods
- Patent number 11,854,889
- Issue date Dec 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Splitting of a solid using conversion of material
- Patent number 11,833,617
- Issue date Dec 5, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for heat bonding, and sheet for heat bonding having dicing tape
- Patent number 11,786,966
- Issue date Oct 17, 2023
- Nitto Denko Corporation
- Satoshi Honda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling method for peeling off substrate from support plate
- Patent number 11,764,066
- Issue date Sep 19, 2023
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN-on-Si semiconductor device structures for high current/ high vo...
- Patent number RE49603
- Issue date Aug 8, 2023
- GaN Systems Inc.
- Thomas Macelwee
Information Patent Grant
Wafer processing method
- Patent number 11,712,747
- Issue date Aug 1, 2023
- Disco Corporation
- Ye Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus including a water collection pan
- Patent number 11,691,313
- Issue date Jul 4, 2023
- Disco Corporation
- Toshiyasu Rikiishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer structure and trimming method thereof
- Patent number 11,682,551
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Ning Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective sheet for use in processing wafer, handling system for w...
- Patent number 11,676,833
- Issue date Jun 13, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED SEMICONDUCTOR WAFER SAMPLE PRE-PROCESSING SYSTEM
- Publication number 20240347385
- Publication date Oct 17, 2024
- PAMTEK Co., Ltd.
- Jae Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRIPPING GALLIUM NITRIDE SUBSTRATE
- Publication number 20240332021
- Publication date Oct 3, 2024
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297151
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
- Publication number 20240290730
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Sathyanarayanan Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240282576
- Publication date Aug 22, 2024
- Samsung Electronics Co.,Ltd.
- Hyungju RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME
- Publication number 20240274542
- Publication date Aug 15, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF AN ELECTRONIC POWER COMPONENT
- Publication number 20240266423
- Publication date Aug 8, 2024
- STMicroelectronics International N.V.
- Benjamin MORILLON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240258150
- Publication date Aug 1, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240258151
- Publication date Aug 1, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING GROOVE INSPECTING METHOD AND DICING METHOD
- Publication number 20240242968
- Publication date Jul 18, 2024
- TOKYO SEIMITSU CO., LTD.
- Takashi TAMOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD...
- Publication number 20240240061
- Publication date Jul 18, 2024
- Resonac Corporation
- Tatsuya MAKINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SINGULATION OF SILICON CARBIDE SEMICONDUCTOR WAFERS
- Publication number 20240234155
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Aira Lourdes VILLAMOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Sigulating Semiconductor Devices and Package Device Incl...
- Publication number 20240222292
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240178000
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jesung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
- Publication number 20240170291
- Publication date May 23, 2024
- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...
- Publication number 20240157481
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240153777
- Publication date May 9, 2024
- Disco Corporation
- Kohei TSUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...
- Publication number 20240145254
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20240136174
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF
- Publication number 20240128233
- Publication date Apr 18, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WAFER PROCESSING METHOD
- Publication number 20240105458
- Publication date Mar 28, 2024
- Disco Corporation
- Masatoshi WAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
- Publication number 20240096830
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF
- Publication number 20240087902
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Lung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Making grooves

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing wafer

Methods of fabricating the same die stack structure and semiconduct...

Package structure

Wafer producing method

Wafer processing method and machine

Chip manufacturing method

Method for forming semiconductor die having edge with multiple grad...

Stacked semiconductor devices and methods of forming thereof

Composite interposer structure and method of providing same

Die stack structure, semiconductor structure and method of fabricat...

Semiconductor package and manufacturing method thereof

High density low power interconnect using 3D die stacking

Singulation of silicon carbide semiconductor wafers

Integrated aligned stealth laser with blade and grinding apparatus...

Fabrication method of semiconductor die and chip-on-plastic packagi...

Semiconductor device and method of manufacturing same

Method for transferring a useful layer to a carrier substrate

Package structure and method of manufacturing the same

Die cleaning systems and related methods

Splitting of a solid using conversion of material

Package structure

Sheet for heat bonding, and sheet for heat bonding having dicing tape

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Peeling method for peeling off substrate from support plate

GaN-on-Si semiconductor device structures for high current/ high vo...

Wafer processing method

Processing apparatus including a water collection pan

Wafer structure and trimming method thereof

Protective sheet for use in processing wafer, handling system for w...

Patents Applicationslast 30 patents

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

WAFER PROCESSING METHOD

PACKAGE STRUCTURE

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

AUTOMATED SEMICONDUCTOR WAFER SAMPLE PRE-PROCESSING SYSTEM

METHOD FOR STRIPPING GALLIUM NITRIDE SUBSTRATE

METHODS OF FABRICATING PACKAGE STRUCTURE

DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

FORMING OF AN ELECTRONIC POWER COMPONENT

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

DICING GROOVE INSPECTING METHOD AND DICING METHOD

RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD...

SINGULATION OF SILICON CARBIDE SEMICONDUCTOR WAFERS

Method for Sigulating Semiconductor Devices and Package Device Incl...

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE

SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...

WAFER PROCESSING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF

DEVICE WAFER PROCESSING METHOD

Adding Sealing Material to Wafer edge for Wafer Bonding

MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF

PACKAGE STRUCTURE