Making grooves

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CPC
H01L21/3043

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3043Making grooves

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a pre-mold substrate
- Patent number 12,327,728
- Issue date Jun 10, 2025
- HAESUNG DS CO., LTD
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head for chemical mechanical polishing apparatus comprising...
- Patent number 12,285,839
- Issue date Apr 29, 2025
- Joon Mo Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device
- Patent number 12,283,614
- Issue date Apr 22, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser edge shaping for semiconductor wafers
- Patent number 12,269,123
- Issue date Apr 8, 2025
- Wolfspeed, Inc.
- Joseph Taylor Budd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for stripping gallium nitride substrate
- Patent number 12,243,746
- Issue date Mar 4, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 12,237,226
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer
- Patent number 12,170,224
- Issue date Dec 17, 2024
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method
- Patent number 12,106,967
- Issue date Oct 1, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method and machine
- Patent number 12,100,620
- Issue date Sep 24, 2024
- Disco Corporation
- Yoshinobu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip manufacturing method
- Patent number 12,087,630
- Issue date Sep 10, 2024
- Disco Corporation
- Kazuki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming thereof
- Patent number 12,051,624
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer structure and method of providing same
- Patent number 12,014,990
- Issue date Jun 18, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure, semiconductor structure and method of fabricat...
- Patent number 12,015,013
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density low power interconnect using 3D die stacking
- Patent number 11,942,409
- Issue date Mar 26, 2024
- MARVELL ASIA PTE. LTD.
- Ferran Martorell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of silicon carbide semiconductor wafers
- Patent number 11,942,327
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Aira Lourdes Villamor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
- Patent number 11,901,171
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of semiconductor die and chip-on-plastic packagi...
- Patent number 11,901,322
- Issue date Feb 13, 2024
- MagnaChip Semiconductor, Ltd.
- Jin Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 11,887,858
- Issue date Jan 30, 2024
- Kabushiki Kaisha Toshiba
- Shinji Nunotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer to a carrier substrate
- Patent number 11,876,015
- Issue date Jan 16, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Die cleaning systems and related methods
- Patent number 11,854,889
- Issue date Dec 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...
- Publication number 20250192005
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194209
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...
- Publication number 20250174555
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge structure of semiconductor wafer and manufacturing method thereof
- Publication number 20250166997
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Yu-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149423
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION
- Publication number 20250132205
- Publication date Apr 24, 2025
- Western Digital Technologies, Inc.
- Fan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...
- Publication number 20250105170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Substrates for Large, High Performance Power Packages
- Publication number 20250087566
- Publication date Mar 13, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SUBSTRATE STRUCTURE
- Publication number 20250089321
- Publication date Mar 13, 2025
- Taiwan-Asia Semiconductor Corporation
- Po-Jen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD
- Publication number 20250087492
- Publication date Mar 13, 2025
- Disco Corporation
- Tomoaki SUGIYAMA
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20250079150
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACT...
- Publication number 20250038062
- Publication date Jan 30, 2025
- Enkris Semiconductor (Wuxi), Ltd.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022809
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...
- Publication number 20250006496
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- CHIA CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED SEMICONDUCTOR WAFER SAMPLE PRE-PROCESSING SYSTEM
- Publication number 20240347385
- Publication date Oct 17, 2024
- PAMTEK Co., Ltd.
- Jae Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRIPPING GALLIUM NITRIDE SUBSTRATE
- Publication number 20240332021
- Publication date Oct 3, 2024
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297151
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
- Publication number 20240290730
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Sathyanarayanan Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240282576
- Publication date Aug 22, 2024
- Samsung Electronics Co.,Ltd.
- Hyungju RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME
- Publication number 20240274542
- Publication date Aug 15, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF AN ELECTRONIC POWER COMPONENT
- Publication number 20240266423
- Publication date Aug 8, 2024
- STMicroelectronics International N.V.
- Benjamin MORILLON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240258150
- Publication date Aug 1, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Making grooves

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a pre-mold substrate

Semiconductor die with tapered sidewall in package

Carrier head for chemical mechanical polishing apparatus comprising...

Semiconductor device

Semiconductor package and manufacturing method thereof

Laser edge shaping for semiconductor wafers

Method for stripping gallium nitride substrate

Dicing method for stacked semiconductor devices

Die cleaning systems and related methods

Wafer manufacturing method and laminated device chip manufacturing...

Integrated aligned stealth laser for wafer edge trimming process

Method of processing wafer

Methods of fabricating the same die stack structure and semiconduct...

Package structure

Wafer producing method

Wafer processing method and machine

Chip manufacturing method

Method for forming semiconductor die having edge with multiple grad...

Stacked semiconductor devices and methods of forming thereof

Composite interposer structure and method of providing same

Die stack structure, semiconductor structure and method of fabricat...

Semiconductor package and manufacturing method thereof

High density low power interconnect using 3D die stacking

Singulation of silicon carbide semiconductor wafers

Integrated aligned stealth laser with blade and grinding apparatus...

Fabrication method of semiconductor die and chip-on-plastic packagi...

Semiconductor device and method of manufacturing same

Method for transferring a useful layer to a carrier substrate

Package structure and method of manufacturing the same

Die cleaning systems and related methods

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...

Edge structure of semiconductor wafer and manufacturing method thereof

COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

DIE CLEANING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION

SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...

Advanced Substrates for Large, High Performance Power Packages

SILICON SUBSTRATE STRUCTURE

PROCESSING METHOD

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACT...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

WAFER PROCESSING METHOD

PACKAGE STRUCTURE

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

AUTOMATED SEMICONDUCTOR WAFER SAMPLE PRE-PROCESSING SYSTEM

METHOD FOR STRIPPING GALLIUM NITRIDE SUBSTRATE

METHODS OF FABRICATING PACKAGE STRUCTURE

DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

FORMING OF AN ELECTRONIC POWER COMPONENT

METHOD FOR MANUFACTURING ELECTRONIC DEVICE