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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/3043
Making grooves
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Patents Grants
last 30 patents
Information
Patent Grant
High density low power interconnect using 3D die stacking
Patent number
11,942,409
Issue date
Mar 26, 2024
MARVELL ASIA PTE. LTD.
Ferran Martorell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Singulation of silicon carbide semiconductor wafers
Patent number
11,942,327
Issue date
Mar 26, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Aira Lourdes Villamor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
Patent number
11,901,171
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Tung Wu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabrication method of semiconductor die and chip-on-plastic packagi...
Patent number
11,901,322
Issue date
Feb 13, 2024
MagnaChip Semiconductor, Ltd.
Jin Won Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing same
Patent number
11,887,858
Issue date
Jan 30, 2024
Kabushiki Kaisha Toshiba
Shinji Nunotani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for transferring a useful layer to a carrier substrate
Patent number
11,876,015
Issue date
Jan 16, 2024
Soitec
Didier Landru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,862,469
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Die cleaning systems and related methods
Patent number
11,854,889
Issue date
Dec 26, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Splitting of a solid using conversion of material
Patent number
11,833,617
Issue date
Dec 5, 2023
Siltectra GmbH
Jan Richter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure
Patent number
11,798,898
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsiao-Wen Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet for heat bonding, and sheet for heat bonding having dicing tape
Patent number
11,786,966
Issue date
Oct 17, 2023
Nitto Denko Corporation
Satoshi Honda
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
Patent number
11,764,115
Issue date
Sep 19, 2023
Disco Corporation
Youngsuk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
Patent number
11,764,114
Issue date
Sep 19, 2023
Disco Corporation
Youngsuk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Peeling method for peeling off substrate from support plate
Patent number
11,764,066
Issue date
Sep 19, 2023
Disco Corporation
Katsuhiko Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
GaN-on-Si semiconductor device structures for high current/ high vo...
Patent number
RE49603
Issue date
Aug 8, 2023
GaN Systems Inc.
Thomas Macelwee
Information
Patent Grant
Wafer processing method
Patent number
11,712,747
Issue date
Aug 1, 2023
Disco Corporation
Ye Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processing apparatus including a water collection pan
Patent number
11,691,313
Issue date
Jul 4, 2023
Disco Corporation
Toshiyasu Rikiishi
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Wafer structure and trimming method thereof
Patent number
11,682,551
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Ning Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective sheet for use in processing wafer, handling system for w...
Patent number
11,676,833
Issue date
Jun 13, 2023
Disco Corporation
Karl Heinz Priewasser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite interposer structure and method of providing same
Patent number
11,652,059
Issue date
May 16, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing apparatus
Patent number
11,633,872
Issue date
Apr 25, 2023
Disco Corporation
Yoshimasa Kojima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer processing method including uniting wafer, ring frame and pol...
Patent number
11,545,393
Issue date
Jan 3, 2023
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,508,692
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kung-Chen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate dividing method
Patent number
11,488,866
Issue date
Nov 1, 2022
Disco Corporation
Wai Kit Choong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer structure and trimming method thereof
Patent number
11,456,169
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Ning Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-surface polishing device and dual-surface polishing method
Patent number
11,440,157
Issue date
Sep 13, 2022
Sumco Corporation
Keisuke Esaki
B24 - GRINDING POLISHING
Information
Patent Grant
Splitting of a solid using conversion of material
Patent number
11,407,066
Issue date
Aug 9, 2022
Siltectra GmbH
Jan Richter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
11,393,721
Issue date
Jul 19, 2022
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
Patent number
11,380,588
Issue date
Jul 5, 2022
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
11,380,550
Issue date
Jul 5, 2022
Disco Corporation
Masaru Nakamura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...
Publication number
20240145254
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
Publication number
20240136174
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Tung Wu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF
Publication number
20240128233
Publication date
Apr 18, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
CHIA-SHUAI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WAFER PROCESSING METHOD
Publication number
20240105458
Publication date
Mar 28, 2024
Disco Corporation
Masatoshi WAKAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
Publication number
20240096830
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Yi Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF
Publication number
20240087902
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chieh-Lung LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240087903
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...
Publication number
20240088095
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PROCESSING DEVICE WAFER
Publication number
20240079245
Publication date
Mar 7, 2024
Disco Corporation
Naoko YAMAMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING LAMINATED DEVICE CHIPS
Publication number
20240079261
Publication date
Mar 7, 2024
Disco Corporation
Zhiwen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
Publication number
20240079274
Publication date
Mar 7, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. SEDDON
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for Producing a Detachment Region in a Solid-state Body
Publication number
20240058899
Publication date
Feb 22, 2024
SILTECTRA GMBH
Jan Richter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SIGMA-SHAPED GROOVE
Publication number
20240055263
Publication date
Feb 15, 2024
Shanghai Huali Integrated Circuit Corporation
Lian Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME
Publication number
20240047423
Publication date
Feb 8, 2024
Micron Technology, Inc.
Seng Kim Ye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240030056
Publication date
Jan 25, 2024
DENSO CORPORATION
MASASHI UECHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240021442
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Ting Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...
Publication number
20240021584
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20240014063
Publication date
Jan 11, 2024
InnoLux Corporation
Kai Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20240006218
Publication date
Jan 4, 2024
INFINEON TECHNOLOGIES AG
Gregor Langer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD
Publication number
20240006241
Publication date
Jan 4, 2024
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240006343
Publication date
Jan 4, 2024
Mitsubishi Electric Corporation
Tomoaki NOGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WAFER PROCESSING METHOD AND PROCESSING APPARATUS
Publication number
20240006240
Publication date
Jan 4, 2024
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
Publication number
20230402324
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS
Publication number
20230373018
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Che Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS
Publication number
20230369117
Publication date
Nov 16, 2023
Disco Corporation
Kentaro ODANAKA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMBER MANUFACTURING METHOD
Publication number
20230307237
Publication date
Sep 28, 2023
Hamamatsu Photonics K.K.
Takeshi SAKAMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE, AND METHOD FOR MANUFACT...
Publication number
20230299055
Publication date
Sep 21, 2023
LG ELECTRONICS INC.
Changseo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING LIGHT DETECTION DEVICE, LIGHT DETECTION DE...
Publication number
20230300492
Publication date
Sep 21, 2023
Sony Semiconductor Solutions Corporation
TERUMI KAMBE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME
Publication number
20230245972
Publication date
Aug 3, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Manufacturing Semiconductor Device
Publication number
20230245926
Publication date
Aug 3, 2023
Nippon Telegraph and Telephone Corporation
Takuya Tsutsumi
H01 - BASIC ELECTRIC ELEMENTS