Making of isolation regions between components

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CPC
H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76Making of isolation regions between components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Singulation process for chiplets
- Patent number 11,972,970
- Issue date Apr 30, 2024
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor with top contact
- Patent number 11,973,020
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,973,027
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including correctin...
- Patent number 11,972,966
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure and manufacturing method thereof
- Patent number 11,972,972
- Issue date Apr 30, 2024
- Winbond Electronics Corp.
- Che-Jui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
1D vertical edge blocking (VEB) via and plug
- Patent number 11,972,979
- Issue date Apr 30, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 11,973,021
- Issue date Apr 30, 2024
- Vanguard International Semiconductor Corporation
- Kai-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized transistor structure with controlled dimensions of sou...
- Patent number 11,973,120
- Issue date Apr 30, 2024
- Etron Technology, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with inner spacer layer and method f...
- Patent number 11,973,129
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing a gap-fill layer by plasma-assisted deposition
- Patent number 11,972,944
- Issue date Apr 30, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition on 3D NAND structures
- Patent number 11,972,952
- Issue date Apr 30, 2024
- Lam Research Corporation
- Ruopeng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a three-dimensional memory device using composite...
- Patent number 11,972,954
- Issue date Apr 30, 2024
- SanDisk Technologies LLC
- Roshan Jayakhar Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor region for latch-up susceptibility improvement
- Patent number 11,973,080
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,113
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,973,149
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing a semiconductor...
- Patent number 11,972,973
- Issue date Apr 30, 2024
- Chun-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization system, planarization process, and method of manufact...
- Patent number 11,972,976
- Issue date Apr 30, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,972,978
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,972,984
- Issue date Apr 30, 2024
- United Microelectronics Corp.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Isolation structures for transistors
- Patent number 11,973,126
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,973,024
- Issue date Apr 30, 2024
- Kioxia Corporation
- Hisashi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and electronic system including the same
- Patent number 11,973,035
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Ha-Min Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and method for formin...
- Patent number 11,972,975
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,109
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PATTERNING UNDERLYING STRUCTURE
- Publication number 20240145244
- Publication date May 2, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE-ON-SILICON DEVICES
- Publication number 20240145587
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
- Publication number 20240145376
- Publication date May 2, 2024
- International Business Machines Corporation
- Rajiv Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
- Publication number 20240145435
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS
- Publication number 20240145297
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Tse Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...
- Publication number 20240145301
- Publication date May 2, 2024
- Soulbrain Co., LTD
- Chang Bong YEON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...
- Publication number 20240145312
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING CONDUCTING STRUCTURE AND METHODS...
- Publication number 20240145593
- Publication date May 2, 2024
- Peiching LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
- Publication number 20240145597
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED TRENCHES SURROUNDED BY WIDER TRENCH FOR ISOLATING SEMICONDUC...
- Publication number 20240145293
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
- Publication number 20240145377
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA WITH SACRIFICIAL STRESS BARRIER RING
- Publication number 20240145378
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240145436
- Publication date May 2, 2024
- Micron Technology, Inc.
- Hung Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
- Publication number 20240145477
- Publication date May 2, 2024
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240147725
- Publication date May 2, 2024
- KIOXIA Corporation
- Shinya ARAI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER
- Publication number 20240145459
- Publication date May 2, 2024
- Silicon Genesis Corporation
- Michael I. CURRENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ISOLATED STRAINED GATE-ALL-AROUND FIELD EFFECT TRANSISTOR
- Publication number 20240145468
- Publication date May 2, 2024
- Applied Materials, Inc.
- Shawn THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross-Wafer RDLs in Constructed Wafers
- Publication number 20240145257
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240145289
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR MANUFACTURING A SILICON-CARBIDE-BASED SEMICONDUCTOR STRU...
- Publication number 20240145294
- Publication date May 2, 2024
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20240145296
- Publication date May 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yu Ting ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...
- Publication number 20240145303
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sunhye HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...
- Publication number 20240145380
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Singulation process for chiplets

Self-aligned barrier for metal vias

Metal-insulator-metal capacitor with top contact

Stacked via structure

Semiconductor device and methods of forming the same

Method of manufacturing a semiconductor package including correctin...

Isolation structure and manufacturing method thereof

1D vertical edge blocking (VEB) via and plug

Semiconductor device and method forming the same

Miniaturized transistor structure with controlled dimensions of sou...

Semiconductor device structure with inner spacer layer and method f...

Method for depositing a gap-fill layer by plasma-assisted deposition

Atomic layer deposition on 3D NAND structures

Method of making a three-dimensional memory device using composite...

Fabrication of rigid close-pitch interconnects

Embedded semiconductor region for latch-up susceptibility improvement

Semiconductor device

Semiconductor device

Semiconductor device and method of forming the same

Semiconductor structure and method of manufacturing a semiconductor...

Planarization system, planarization process, and method of manufact...

Conductive via of integrated circuitry, memory array comprising str...

Semiconductor device and method for fabricating the same

Redistribution substrate, method of fabricating the same, and semic...

Nanotwin copper materials in semiconductor devices

Isolation structures for transistors

Semiconductor memory device

Semiconductor memory device and electronic system including the same

Semiconductor device structure having air gap and method for formin...

Semiconductor device

Patents Applicationslast 30 patents

METHOD OF PATTERNING UNDERLYING STRUCTURE

GALLIUM NITRIDE-ON-SILICON DEVICES

DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT

SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...

VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS

METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...

METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...

SEMICONDUCTOR STRUCTURES INCLUDING CONDUCTING STRUCTURE AND METHODS...

Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

MERGED TRENCHES SURROUNDED BY WIDER TRENCH FOR ISOLATING SEMICONDUC...

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

VIA WITH SACRIFICIAL STRESS BARRIER RING

COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER

SUBSTRATE ISOLATED STRAINED GATE-ALL-AROUND FIELD EFFECT TRANSISTOR

Cross-Wafer RDLs in Constructed Wafers

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

METHOD FOR MANUFACTURING A SILICON-CARBIDE-BASED SEMICONDUCTOR STRU...

STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE

SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS