Making of isolation regions between components

Industry

CPC
H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76Making of isolation regions between components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 12,315,763
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Younghoon Goo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including spacer layer contacting bit line bot...
- Patent number 12,315,766
- Issue date May 27, 2025
- SK hynix Inc.
- Kyung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with fuse structure in scribe lane and method of...
- Patent number 12,315,800
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Donghwa Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having graphene-containing-structures
- Patent number 12,315,810
- Issue date May 27, 2025
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including a stair step structure adjacent a substantially p...
- Patent number 12,317,489
- Issue date May 27, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with isolation fea...
- Patent number 12,317,540
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via configurable edge-combiner with duty cycle correction
- Patent number 12,316,328
- Issue date May 27, 2025
- Altera Corporation
- Chooi Pei Lim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus and method for manufacturing the same
- Patent number 12,317,612
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,315,802
- Issue date May 27, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, memory devices, and electronic systems
- Patent number 12,315,803
- Issue date May 27, 2025
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric on wire structure to increase processing window for over...
- Patent number 12,315,817
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,315,758
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,315,759
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component device
- Patent number 12,315,760
- Issue date May 27, 2025
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lines and methods for fabricating the same
- Patent number 12,315,762
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,317,513
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shy-Jay Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deep trench isolation regions for a high-voltage fi...
- Patent number 12,317,557
- Issue date May 27, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kyong Jin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure
- Patent number 12,317,579
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power rail and signal conducting line arrangement
- Patent number 12,317,589
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 12,315,765
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 12,312,702
- Issue date May 27, 2025
- Applied Materials, Inc.
- Cameron Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and method of manufacturing the same
- Patent number 12,315,797
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric fin structures with varying height
- Patent number 12,317,549
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF TRENCHES IN A SUBSTRATE
- Publication number 20250174489
- Publication date May 29, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Thierry BERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES
- Publication number 20250174494
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...
- Publication number 20250176157
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174490
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor layout pattern and semiconductor stack structure suit...
- Publication number 20250174491
- Publication date May 29, 2025
- UNITED MICROELECTRONICS CORP.
- Wei Lun Oo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20250174523
- Publication date May 29, 2025
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174547
- Publication date May 29, 2025
- DENSO CORPORATION
- Eisuke BANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SVIA FORMATION USING VFTL SCHEME
- Publication number 20250174549
- Publication date May 29, 2025
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...
- Publication number 20250174551
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20250174553
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION
- Publication number 20250176206
- Publication date May 29, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR SEMICONDUCTOR DEVICE
- Publication number 20250176216
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250174546
- Publication date May 29, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Yukinori NOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN TRIM PLUG STRUCTURES HAVING AN OXIDATION CATALYST LAYER SURROUN...
- Publication number 20250176225
- Publication date May 29, 2025
- Intel Corporation
- Leonard GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250176254
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250174545
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...
- Publication number 20250174557
- Publication date May 29, 2025
- MEDIATEK INC.
- Cing-Yao Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...
- Publication number 20250176442
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE HAVING AIR GAP
- Publication number 20250174492
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Yun KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20250174493
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...
- Publication number 20250174548
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174584
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...
- Publication number 20250176240
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Tai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED BACKSIDE CONTACT ISOLATION
- Publication number 20250169172
- Publication date May 22, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK
- Publication number 20250169193
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- HENRY LITZMANN EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional memory device and method of making thereof using...

Semiconductor device including spacer layer contacting bit line bot...

Semiconductor chip with fuse structure in scribe lane and method of...

Integrated assemblies having graphene-containing-structures

Graphene barrier layer for reduced contact resistance

Devices including a stair step structure adjacent a substantially p...

Method for manufacturing semiconductor structure with isolation fea...

Via configurable edge-combiner with duty cycle correction

Semiconductor apparatus and method for manufacturing the same

Semiconductor device

Method for preparing semiconductor device with composite passivatio...

Memory device and fabrication method thereof

Microelectronic devices, memory devices, and electronic systems

Dielectric on wire structure to increase processing window for over...

Semiconductor device and method

FinFET device and method of forming same

Method for manufacturing electronic component device

Self-aligned lines and methods for fabricating the same

Microelectronics package comprising a package-on-package (POP) arch...

Semiconductor device and method for forming the same

Structures with deep trench isolation regions for a high-voltage fi...

Method for manufacturing semiconductor device structure

Power rail and signal conducting line arrangement

Method for manufacturing semiconductor device

Interconnection structure and manufacturing method thereof

Backside metal patterning die singulation systems and related methods

Plating systems having reduced air entrainment

Semiconductor substrate structure and method of manufacturing the same

Semiconductor device with liner structure

Dielectric fin structures with varying height

Patents Applicationslast 30 patents

Semiconductor Die Connection System and Method

FORMING OF TRENCHES IN A SUBSTRATE

BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor layout pattern and semiconductor stack structure suit...

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SVIA FORMATION USING VFTL SCHEME

SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION

SEAL RING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

FIN TRIM PLUG STRUCTURES HAVING AN OXIDATION CATALYST LAYER SURROUN...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...

INTERCONNECTION STRUCTURE HAVING AIR GAP

INTERLAYER DIELECTRIC LAYER

SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...

MERGED BACKSIDE CONTACT ISOLATION

ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK