Making of isolation regions between components

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H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76Making of isolation regions between components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and formation method thereof
- Patent number 12,293,971
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongdi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride device with field plate structure and method of man...
- Patent number 12,293,941
- Issue date May 6, 2025
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold through silicon mask plating
- Patent number 12,293,943
- Issue date May 6, 2025
- Lam Research Corporation
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure including discharge structures and method f...
- Patent number 12,293,918
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Jen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 12,293,970
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure including SiOCN layer and method of forming same
- Patent number 12,293,911
- Issue date May 6, 2025
- ASM IP Holding B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,293,914
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface oxidation control of metal gates using capping layer
- Patent number 12,293,916
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming a deep trench isolation structure between ph...
- Patent number 12,293,940
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor array with reduced warpage
- Patent number 12,294,033
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressed gas energy storage system
- Patent number 12,292,037
- Issue date May 6, 2025
- Hydrostor Inc.
- Cameron Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Substrate dividing method using an expansion tape and a roller
- Patent number 12,295,174
- Issue date May 6, 2025
- Disco Corporation
- Masamitsu Agari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,293,910
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-circuit Vias in interconnect structures
- Patent number 12,293,959
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,293,969
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Ta Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction semiconductor device and method for manufacturing same
- Patent number 12,295,160
- Issue date May 6, 2025
- DB HiTek Co., Ltd.
- Jae Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 12,293,967
- Issue date May 6, 2025
- SK hynix Inc.
- Sung Lae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworking process of a failed hard mask for fabricating a semicondu...
- Patent number 12,293,922
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,293,925
- Issue date May 6, 2025
- Renesas Electronics Corporation
- Yuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing gap filling fluids and related systems and d...
- Patent number 12,293,942
- Issue date May 6, 2025
- ASM IP Holding B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap patterning for metal-to-source/drain plugs in a semiconductor d...
- Patent number 12,293,947
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation having three portions with different materials, an...
- Patent number 12,295,161
- Issue date May 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Rong-Ting Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming integrated high density MIM capacitor
- Patent number 12,288,802
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact
- Patent number 12,288,822
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,288,717
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,723
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,288,729
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,289,904
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140687
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION
- Publication number 20250140692
- Publication date May 1, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Kiril B. Borisov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS
- Publication number 20250142901
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20250142942
- Publication date May 1, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...
- Publication number 20250142954
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250142958
- Publication date May 1, 2025
- UNITED MICROELECTRONICS CORP.
- Tai-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-PHOTON AVALANCHE DIODES WITH HYBRID TRENCH ISOLATION STRUCTURES
- Publication number 20250142983
- Publication date May 1, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ping Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stamping Surface Profile in Design Layer and Using Patterned Electr...
- Publication number 20250137159
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140602
- Publication date May 1, 2025
- SOITEC
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE
- Publication number 20250140604
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sefa Dag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20250140611
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION IN MIDDLE BEOL WIRING
- Publication number 20250140650
- Publication date May 1, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140694
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Ki-Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250140712
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
- Publication number 20250142855
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL CIRCUIT WITH SEMICONDUCTOR PILLAR CONTAINING LOCAL INTER...
- Publication number 20250142913
- Publication date May 1, 2025
- Western Digital Technologies, Inc.
- Hokuto KODATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140683
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Pu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140696
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Dielectric Material Treated with Microw...
- Publication number 20250140553
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH ISOLATION STRUCTURES
- Publication number 20250140599
- Publication date May 1, 2025
- GlobalFoundries U.S. INC.
- Jacob M. DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250140608
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsia-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION
- Publication number 20250140609
- Publication date May 1, 2025
- International Business Machines Corporation
- Nicholas Latham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...
- Publication number 20250140632
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140646
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250142882
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Seowoo NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20250142949
- Publication date May 1, 2025
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and formation method thereof

Gallium nitride device with field plate structure and method of man...

Gold through silicon mask plating

Semiconductor structure including discharge structures and method f...

Semiconductor device with self-aligned vias

Semiconductor structure and method for manufacturing thereof

Structure including SiOCN layer and method of forming same

Semiconductor device structure and method for preparing the same

Surface oxidation control of metal gates using capping layer

Techniques for forming a deep trench isolation structure between ph...

Deep trench capacitor array with reduced warpage

Compressed gas energy storage system

Substrate dividing method using an expansion tape and a roller

Interconnect structure for semiconductor devices

Through-circuit Vias in interconnect structures

Semiconductor structure and manufacturing method thereof

Superjunction semiconductor device and method for manufacturing same

Three-dimensional semiconductor device

Reworking process of a failed hard mask for fabricating a semicondu...

Semiconductor device and method of manufacturing the same

Methods for depositing gap filling fluids and related systems and d...

Gap patterning for metal-to-source/drain plugs in a semiconductor d...

Trench isolation having three portions with different materials, an...

Structure and method for forming integrated high density MIM capacitor

Semiconductor device with source/drain contact

Semiconductor device and manufacturing method thereof

Metal based hydrogen barrier

Semiconductor device and manufacturing method thereof

Integrated circuit package and method

Nitride-based semiconductor device and method for manufacturing the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION

HEAT DISSIPATION BY NANO PIPES

Integrated Assemblies and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SINGLE-PHOTON AVALANCHE DIODES WITH HYBRID TRENCH ISOLATION STRUCTURES

Stamping Surface Profile in Design Layer and Using Patterned Electr...

COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF

VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

VIA CONNECTION IN MIDDLE BEOL WIRING

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

PUNCH THROUGH STOPPER IN BULK FINFET DEVICE

PERIPHERAL CIRCUIT WITH SEMICONDUCTOR PILLAR CONTAINING LOCAL INTER...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Having Dielectric Material Treated with Microw...

DEVICE WITH ISOLATION STRUCTURES

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

INTEGRATED CIRCUIT STRUCTURE

NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

GATE CUT WITH INTEGRATED ETCH STOP LAYER