Making of isolation regions between components

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H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76Making of isolation regions between components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Guard ring structure
- Patent number 12,354,975
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous integration scheme for III-V/Si and Si CMOS integrated...
- Patent number 12,355,024
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,354,882
- Issue date Jul 8, 2025
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-doped trenches for memory
- Patent number 12,354,912
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) employing multi-pattern metallization to...
- Patent number 12,354,952
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Bed Raj Kandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures
- Patent number 12,354,953
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,354,961
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with contact via structures that are latera...
- Patent number 12,356,704
- Issue date Jul 8, 2025
- SanDisk Technologies, Inc.
- Kouta Onogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including standard cells and at least one capaci...
- Patent number 12,356,725
- Issue date Jul 8, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the production of a single-crystal film, in particular p...
- Patent number 12,356,858
- Issue date Jul 8, 2025
- Soitec
- Bruno Ghyselen
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,356,611
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a strained structure and structure formed
- Patent number 12,356,674
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate and locos dielectrics grown using locos processing
- Patent number 12,354,905
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Mark Francis Arendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,354,910
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 12,354,911
- Issue date Jul 8, 2025
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing substrate having through-silicon vias, substra...
- Patent number 12,354,914
- Issue date Jul 8, 2025
- Resonac Corporation
- Yoshinori Ejiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout for reducing loading at line sockets and/or for increasing o...
- Patent number 12,354,951
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with different metal materials
- Patent number 12,354,957
- Issue date Jul 8, 2025
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacture
- Patent number 12,356,867
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Hua Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices and method of forming the same
- Patent number 12,356,633
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing integrated deep trench optically sensitive defec...
- Patent number 12,354,904
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 12,354,907
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,354,913
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of formation
- Patent number 12,354,958
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 12,354,962
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...
- Publication number 20250226217
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Martin Christopher Holland
- C30 - CRYSTAL GROWTH
Information Patent Application
GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...
- Publication number 20250226261
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20250226263
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...
- Publication number 20250226231
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BA...
- Publication number 20250226262
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE
- Publication number 20250226291
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STRUCTURE FOR COUPLING BOILING ENHANCED LAYER TO SUBS...
- Publication number 20250226216
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chihting Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250227979
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SUPER POWER RAIL (SPR) ANALOG CELLS DESIGN
- Publication number 20250228010
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Cheng Syu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE
- Publication number 20250226324
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20250226310
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS
- Publication number 20250226322
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ren Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GATE SEPARATION REGION
- Publication number 20250227987
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250227910
- Publication date Jul 10, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Daochu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR
- Publication number 20250227942
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD
- Publication number 20250227953
- Publication date Jul 10, 2025
- Parabellum Strategic Opportunities Fund LLC
- Jia-Rui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DIFFUSION BREAK
- Publication number 20250227997
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-BASED OPTICAL DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250224629
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHUN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20250226177
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...
- Publication number 20250226307
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...
- Publication number 20250226308
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HYBRID SUBSTRATE OF SOI WAFER
- Publication number 20250226260
- Publication date Jul 10, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zifang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
- Publication number 20250226304
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM CELL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226316
- Publication date Jul 10, 2025
- ETRON TECHNOLOGY, INC.
- Ming-Hong KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226317
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226355
- Publication date Jul 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250227969
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guard ring structure

Semiconductor device and method for manufacturing the same

Heterogenous integration scheme for III-V/Si and Si CMOS integrated...

Semiconductor structure and method for forming the same

Plasma-doped trenches for memory

Wafer structure including probe marked test pads

Integrated circuits (ICs) employing multi-pattern metallization to...

Via structures

Cobalt based interconnects and methods of fabrication thereof

Semiconductor structure and manufacturing method thereof

Field effect transistor with contact via structures that are latera...

Integrated circuit including standard cells and at least one capaci...

Method for the production of a single-crystal film, in particular p...

Semiconductor device and method for fabricating the same

Method for fabricating a strained structure and structure formed

Gate and locos dielectrics grown using locos processing

Bi-layer alloy liner for interconnect metallization and methods of...

Cu3Sn via metallization in electrical devices for low-temperature 3...

Method for producing substrate having through-silicon vias, substra...

Package structure and manufacturing method thereof

Layout for reducing loading at line sockets and/or for increasing o...

Interconnect structures with different metal materials

Semiconductor structure and method of manufacture

Semiconductor devices and method of forming the same

Methods of etching metals in semiconductor devices

Method of reducing integrated deep trench optically sensitive defec...

Electron migration control in interconnect structures

Contact structure for semiconductor device

Semiconductor devices and methods of formation

Standard cell layout for better routability

Patents Applicationslast 30 patents

FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...

GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...

Contact Structure For Semiconductor Device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...

FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BA...

BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE

METALLIZATION STRUCTURE FOR COUPLING BOILING ENHANCED LAYER TO SUBS...

SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF

SYSTEMS AND METHODS FOR SUPER POWER RAIL (SPR) ANALOG CELLS DESIGN

DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS

SEMICONDUCTOR DEVICE INCLUDING GATE SEPARATION REGION

SEMICONDUCTOR STRUCTURE

STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR

SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD

BACKSIDE DIFFUSION BREAK

SILICON-BASED OPTICAL DEVICE AND METHOD OF FABRICATING THE SAME

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...

SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...

INTERCONNECT LINES WITH LINE WIDTH PROFILE

METHOD FOR FORMING HYBRID SUBSTRATE OF SOI WAFER

DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...

DRAM CELL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT WITH TOPVIA

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY DEVICE