Making of isolation regions between components

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H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76Making of isolation regions between components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer chuck structure with holes in upper surface to improve temper...
- Patent number 12,272,585
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact features in field-effect transistors
- Patent number 12,272,605
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,606
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Sangmin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried conductive structure in semiconductor substrate
- Patent number 12,272,621
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure having air gap and method for manufacturi...
- Patent number 12,272,636
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source resistor
- Patent number 12,272,640
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Zeng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reflectance isolation structure to increase image sensor perfo...
- Patent number 12,272,715
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side type image sensors
- Patent number 12,272,720
- Issue date Apr 8, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,272,597
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with top electrode via
- Patent number 12,274,183
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ku
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor level interconnection methodologies utilizing 3D interco...
- Patent number 12,272,730
- Issue date Apr 8, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anchor-shaped backside via
- Patent number 12,272,634
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclical deposition method and apparatus for filling a recess forme...
- Patent number 12,272,593
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Zecheng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of fabricating the same having a se...
- Patent number 12,272,594
- Issue date Apr 8, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yu-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for fabrication of nickel interconnects
- Patent number 12,270,121
- Issue date Apr 8, 2025
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with identification structure, method for manu...
- Patent number 12,272,643
- Issue date Apr 8, 2025
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal and smooth titanium nitride layers and methods of forming...
- Patent number 12,272,599
- Issue date Apr 8, 2025
- Eugenus, Inc.
- Hyunchol Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective metal removal with flowable polymer
- Patent number 12,272,551
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a substrate for the epitaxial growth of a laye...
- Patent number 12,270,123
- Issue date Apr 8, 2025
- Soitec
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 12,272,547
- Issue date Apr 8, 2025
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,272,561
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20250118597
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250118631
- Publication date Apr 10, 2025
- WINBOND ELECTRONICS CORP.
- Jin-Neng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER
- Publication number 20250118654
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118664
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...
- Publication number 20250118711
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...
- Publication number 20250118547
- Publication date Apr 10, 2025
- IMEC vzw
- Sana Rachidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFEC...
- Publication number 20250120115
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi Ning Ju
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A THROUGH VIA AND A WIRING LAYER
- Publication number 20250118662
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Dohyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118596
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250118600
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20250120170
- Publication date Apr 10, 2025
- ROHM CO., LTD.
- Hirotaka OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118658
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250118659
- Publication date Apr 10, 2025
- Murata Manufacturing Co., Ltd.
- Takaaki MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Trace Substrate...
- Publication number 20250118599
- Publication date Apr 10, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND RELATED APPARATUS FOR REDUCING GATE-INDUCED DRAIN LEAKAG...
- Publication number 20250120153
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH ISOLATION PROCESSING WITH LOCAL OXIDATION OF SILICON
- Publication number 20250120169
- Publication date Apr 10, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Robert Martin Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118598
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118671
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Su Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT
- Publication number 20250118674
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF ORGANIC FILMS
- Publication number 20250118562
- Publication date Apr 10, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250120083
- Publication date Apr 10, 2025
- KIOXIA Corporation
- Shinya ARAI
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD OF FIELD EFFECT TRANSISTOR STRUCTURE
- Publication number 20250120171
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250120172
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Chuan YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Thinning a Semiconductor Substrate
- Publication number 20250118564
- Publication date Apr 10, 2025
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250118595
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250118625
- Publication date Apr 10, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118656
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer chuck structure with holes in upper surface to improve temper...

Contact features of semiconductor device and method of forming same

Methods of forming contact features in field-effect transistors

Semiconductor device

Buried conductive structure in semiconductor substrate

Interconnection structure having air gap and method for manufacturi...

Semiconductor device with source resistor

Method of making electrostatic discharge protection cell and antenn...

High reflectance isolation structure to increase image sensor perfo...

Package and manufacturing method thereof

Semiconductor memory device

Front-side type image sensors

Semiconductor interconnection structures and methods of forming the...

Conductive feature of a semiconductor device

Memory cell with top electrode via

Transistor level interconnection methodologies utilizing 3D interco...

Semiconductor structure having an anchor-shaped backside via

Semiconductor device package with conductive pillars and reinforcin...

Cyclical deposition method and apparatus for filling a recess forme...

Semiconductor device and method of fabricating the same having a se...

Method of manufacturing semiconductor devices

Composition and method for fabrication of nickel interconnects

Low warpage high density trench capacitor

Semiconductor device with identification structure, method for manu...

Conformal and smooth titanium nitride layers and methods of forming...

Selective metal removal with flowable polymer

3D semiconductor memory device and structure with memory and metal...

Method for producing a substrate for the epitaxial growth of a laye...

Conformal deposition of silicon carbide films

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER

CUT SHAPES FOR BACKSIDE METALS

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...

METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...

ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFEC...

SEMICONDUCTOR DEVICE INCLUDING A THROUGH VIA AND A WIRING LAYER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

NITRIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

Semiconductor Device and Method of Forming Embedded Trace Substrate...

METHOD AND RELATED APPARATUS FOR REDUCING GATE-INDUCED DRAIN LEAKAG...

SHALLOW TRENCH ISOLATION PROCESSING WITH LOCAL OXIDATION OF SILICON

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT

DEPOSITION OF ORGANIC FILMS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MANUFACTURING METHOD OF FIELD EFFECT TRANSISTOR STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Method for Thinning a Semiconductor Substrate

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME