Making of isolation regions between components

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H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76Making of isolation regions between components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,334,395
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 12,334,396
- Issue date Jun 17, 2025
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,334,438
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Minsung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,334,440
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yongxiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,334,448
- Issue date Jun 17, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 12,334,475
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molybdenum deposition
- Patent number 12,334,351
- Issue date Jun 17, 2025
- Lam Research Corporation
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure including graphite and method forming same
- Patent number 12,334,397
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,334,433
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having a sodium stopper in an insulation layer gr...
- Patent number 12,336,255
- Issue date Jun 17, 2025
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source/drain contact having height b...
- Patent number 12,336,296
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Charles Chew-Yuen Young
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal oxide resists for EUV patterning and methods for developing t...
- Patent number 12,332,568
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Hamed Hajibabaeinajafabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure and a self-aligned capping layer formed thereon
- Patent number 12,334,388
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,334,390
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a substrate using photolithography
- Patent number 12,334,391
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric stack for damascene top-via integration
- Patent number 12,334,398
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for fabricating staircase regions of a three...
- Patent number 12,334,399
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiongyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 12,334,400
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming Hsun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSV) validation structure for an integrated...
- Patent number 12,334,416
- Issue date Jun 17, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,334,435
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 12,336,261
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,336,179
- Issue date Jun 17, 2025
- SK hynix Inc.
- Young Geun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate semiconductor device and method for forming the same
- Patent number 12,336,213
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Sheng Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Super junction structure and method for manufacturing the same
- Patent number 12,336,234
- Issue date Jun 17, 2025
- Shenzhen Sanrise-Tech Co., LTD
- Shengan Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits
- Patent number 12,334,459
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-height interconnect trenches for resistance and capacitance o...
- Patent number 12,334,392
- Issue date Jun 17, 2025
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,334,434
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250192036
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR-ON-INSULATOR MULTILAYER STRUCTURE
- Publication number 20250191967
- Publication date Jun 12, 2025
- SOITEC
- Isabelle Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME
- Publication number 20250191968
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR ORGANIZING DATA IN A MEMORY DEVICE
- Publication number 20250191969
- Publication date Jun 12, 2025
- Lodestar Licensing Group, LLC
- Glen E. Hush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES
- Publication number 20250191972
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20250191973
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194113
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PLACEHOLDER DIELECTRIC FILL
- Publication number 20250194213
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL BACKSIDE CONTACT ISOLATION FOR MERGED BACKSIDE CONTACT PATTER...
- Publication number 20250194152
- Publication date Jun 12, 2025
- International Business Machines Corporation
- GIDEON OYIBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP IN SINGLE DIFFUSION BREAK
- Publication number 20250194168
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS
- Publication number 20250194210
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250194233
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Donghoon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250194281
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250191974
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192038
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS
- Publication number 20250192054
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STI REGION
- Publication number 20250194085
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT
- Publication number 20250194120
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lu-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL STRUCTRUE WITH FD-SOI TRANSISTOR
- Publication number 20250194244
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE INTERCONNECT STRUCTURE
- Publication number 20250192028
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192044
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20250194169
- Publication date Jun 12, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Shesh Mani Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PMOS TRANSISTOR AND METHOD OF PREPARING PMOS TRANSISTOR, CMOS CIRCU...
- Publication number 20250194187
- Publication date Jun 12, 2025
- SwaySure Technology Co., Ltd.
- MING-HUNG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE LOGIC FOR FOCUSED ION BEAM CIRCUIT EDIT IN THE UPP...
- Publication number 20250192032
- Publication date Jun 12, 2025
- Intel Corporation
- Carlos Alberto JIMENEZ CHAVEZ
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Unit specific variable or adaptive metal fill and system and method...

Semiconductor device

Semiconductor structure and manufacturing method thereof

Front end of line interconnect structures and associated systems an...

3D trench capacitor for integrated passive devices

Molybdenum deposition

Interconnect structure including graphite and method forming same

Package with tilted interface between device die and encapsulating...

Semiconductor device and method of fabricating the same

Semiconductor die having a sodium stopper in an insulation layer gr...

Semiconductor device including source/drain contact having height b...

Metal oxide resists for EUV patterning and methods for developing t...

Isolation structure and a self-aligned capping layer formed thereon

Semiconductor device

Method for patterning a substrate using photolithography

Multilayer dielectric stack for damascene top-via integration

Structures and methods for fabricating staircase regions of a three...

Semiconductor structure and method of forming thereof

Through substrate via (TSV) validation structure for an integrated...

Semiconductor interconnection structures and methods of forming the...

Middle-of-line interconnect structure and manufacturing method

Remote plasma based deposition of silicon carbide films using silic...

Contacts for highly scaled transistors

Semiconductor device and manufacturing method of the semiconductor...

Multi-gate semiconductor device and method for forming the same

Super junction structure and method for manufacturing the same

Integrated circuits

Multi-height interconnect trenches for resistance and capacitance o...

Package structure and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

METHOD FOR PRODUCING A SEMICONDUCTOR-ON-INSULATOR MULTILAYER STRUCTURE

BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

APPARATUSES AND METHODS FOR ORGANIZING DATA IN A MEMORY DEVICE

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BACKSIDE PLACEHOLDER DIELECTRIC FILL

LOCAL BACKSIDE CONTACT ISOLATION FOR MERGED BACKSIDE CONTACT PATTER...

AIRGAP IN SINGLE DIFFUSION BREAK

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

INTEGRATED CIRCUIT DEVICE

MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

FLY-OVER METAL JUMPER CONNECTION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE HAVING STI REGION

METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT

THREE DIMENSIONAL STRUCTRUE WITH FD-SOI TRANSISTOR

BACK END OF LINE INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

INTEGRATED CHIP WITH CAVITY STRUCTURE

TERMINATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

PMOS TRANSISTOR AND METHOD OF PREPARING PMOS TRANSISTOR, CMOS CIRCU...

METHOD TO ENABLE LOGIC FOR FOCUSED ION BEAM CIRCUIT EDIT IN THE UPP...