Making of isolation regions between components

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76Making of isolation regions between components

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell design architecture for reduced voltage droop utilizi...
- Patent number 12,205,897
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,205,816
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,205,889
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,205,911
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,206,010
- Issue date Jan 21, 2025
- Winbond Electronics Corp.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, display panel and manufacturing method of displa...
- Patent number 12,205,961
- Issue date Jan 21, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
FinFET semiconductor device
- Patent number 12,206,001
- Issue date Jan 21, 2025
- QUALCOMM Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,205,883
- Issue date Jan 21, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure for IC with epi regions sharing the same tank
- Patent number 12,205,944
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,207,459
- Issue date Jan 21, 2025
- SanDisk Technologies LLC
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,207,470
- Issue date Jan 21, 2025
- Kioxia Corporation
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with wrap around silicide and hybrid fin
- Patent number 12,205,998
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming microelectronic devices, and related electronic...
- Patent number 12,205,846
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid method for forming semiconductor interconnect structure
- Patent number 12,205,886
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure and method for manufac...
- Patent number 12,199,015
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATION BETWEEN DEVICE AREAS
- Publication number 20250022746
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022788
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING PROCESSES
- Publication number 20250022715
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
- Publication number 20250022881
- Publication date Jan 16, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250022902
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- KATSUNORI TOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20250024758
- Publication date Jan 16, 2025
- 1372934 B.C. Ltd.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250022876
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP
- Publication number 20250022936
- Publication date Jan 16, 2025
- Intel Corporation
- Seung Hoon SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIV...
- Publication number 20250022748
- Publication date Jan 16, 2025
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Method For Fabricating The Same
- Publication number 20250022749
- Publication date Jan 16, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jun WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250022825
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024681
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...
- Publication number 20250022747
- Publication date Jan 16, 2025
- SOITEC
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR VERTICAL FETS FABRICATED ON AN ENGINEERED SUB...
- Publication number 20250022937
- Publication date Jan 16, 2025
- QROMIS, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250024680
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Kang Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT LINER IN METAL FILL
- Publication number 20250022751
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Sang-Hyeob LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20250022804
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION THICK FILM RESIST COMPOSITION, A METHOD FOR MANUFA...
- Publication number 20250021004
- Publication date Jan 16, 2025
- MERCK ELECTRONICS LTD.
- TETSUMASA TAKAICHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...
- Publication number 20250022882
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Martin W. Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20250022750
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Shinjae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022753
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Masanori NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Body Contact Regions Proximate Transis...
- Publication number 20250024658
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING DIELECTRIC SLOT STRUCTURES
- Publication number 20250024673
- Publication date Jan 16, 2025
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods of forming the same

Standard cell design architecture for reduced voltage droop utilizi...

Electronic devices comprising a compressive dielectric material, an...

TSV as pad

Interconnect structure for semiconductor devices

Method of preparing semiconductor structure having low dielectric c...

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device and method of fabricating the same

Contact via formation

Bonding structure and method of forming same

Method for forming a semiconductor structure

Method for forming semiconductor structure and semiconductor structure

Display substrate, display panel and manufacturing method of displa...

FinFET semiconductor device

Sensor packages

Oversized via as through-substrate-via (TSV) stop layer

Semiconductor structure and fabrication method thereof

Three-dimensional memory device having staircase structure and meth...

Isolation structure for IC with epi regions sharing the same tank

Three-dimensional memory array with dual-level peripheral circuits...

Semiconductor device and method for manufacturing same

Semiconductor device with wrap around silicide and hybrid fin

Deposition of organic films

Methods of forming microelectronic devices, and related electronic...

Method to create MIMcap designs across changing MIMcap structures

Hybrid method for forming semiconductor interconnect structure

Plasma-damage-resistant interconnect structure and methods for form...

Electronic package and fabrication method thereof

Semiconductor device and a manufacturing method thereof

Semiconductor device including via structure and method for manufac...

Patents Applicationslast 30 patents

ISOLATION BETWEEN DEVICE AREAS

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PLASMA ETCHING PROCESSES

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

METHOD FOR TRANSFERRING BLOCKS FROM A DONOR SUBSTRATE ONTO A RECEIV...

Semiconductor Structure And Method For Fabricating The Same

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

SEAL RING STRUCTURE AND METHOD OF FORMING SAME

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

Conductive Structures Of Integrated Circuits

METHOD AND SYSTEM FOR VERTICAL FETS FABRICATED ON AN ENGINEERED SUB...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

GRADIENT LINER IN METAL FILL

BACKSIDE LOCAL INTERCONNECT

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

ION IMPLANTATION THICK FILM RESIST COMPOSITION, A METHOD FOR MANUFA...

TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...

METHODS OF FORMING INTERCONNECT STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

Integrated Assemblies Having Body Contact Regions Proximate Transis...

MEMORY DEVICES INCLUDING DIELECTRIC SLOT STRUCTURES