Making of isolation regions between components

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CPC
H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76Making of isolation regions between components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Devices including a stair step structure adjacent a substantially p...
- Patent number 12,317,489
- Issue date May 27, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with fuse structure in scribe lane and method of...
- Patent number 12,315,800
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Donghwa Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having graphene-containing-structures
- Patent number 12,315,810
- Issue date May 27, 2025
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via configurable edge-combiner with duty cycle correction
- Patent number 12,316,328
- Issue date May 27, 2025
- Altera Corporation
- Chooi Pei Lim
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 12,315,763
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Younghoon Goo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including spacer layer contacting bit line bot...
- Patent number 12,315,766
- Issue date May 27, 2025
- SK hynix Inc.
- Kyung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with isolation fea...
- Patent number 12,317,540
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for manufacturing the same
- Patent number 12,317,612
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,315,758
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,315,759
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component device
- Patent number 12,315,760
- Issue date May 27, 2025
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lines and methods for fabricating the same
- Patent number 12,315,762
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,315,802
- Issue date May 27, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, memory devices, and electronic systems
- Patent number 12,315,803
- Issue date May 27, 2025
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric on wire structure to increase processing window for over...
- Patent number 12,315,817
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,317,513
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shy-Jay Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deep trench isolation regions for a high-voltage fi...
- Patent number 12,317,557
- Issue date May 27, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kyong Jin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure
- Patent number 12,317,579
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power rail and signal conducting line arrangement
- Patent number 12,317,589
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 12,312,702
- Issue date May 27, 2025
- Applied Materials, Inc.
- Cameron Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 12,315,765
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and method of manufacturing the same
- Patent number 12,315,797
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric fin structures with varying height
- Patent number 12,317,549
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE VIA STRUCTURE
- Publication number 20250167103
- Publication date May 22, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
- Publication number 20250167002
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED BACKSIDE CONTACT ISOLATION
- Publication number 20250169172
- Publication date May 22, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK
- Publication number 20250169193
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- HENRY LITZMANN EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEV...
- Publication number 20250169283
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- HIROMASA TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK
- Publication number 20250162342
- Publication date May 22, 2025
- Lauren Michelle Neubauer
- B43 - WRITING OR DRAWING IMPLEMENTS BUREAU ACCESSORIES
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20250163602
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOUNDARY DESIGN TO REDUCE MEMORY ARRAY EDGE CMP DISHING EFFECT
- Publication number 20250169076
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...
- Publication number 20250167041
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Fabrizio Fausto Renzo TOIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING CONTACT STRUCTURE
- Publication number 20250167045
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE TRANSISTOR DEVICE AND METHOD FOR FABRICATING A GR...
- Publication number 20250167116
- Publication date May 22, 2025
- Infineon Technologies Austria AG
- Herbert Gietler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...
- Publication number 20250166993
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION PROCESS FOR PATTERNING EDGE PLACEMENT ERROR IMPROVEMENT
- Publication number 20250166994
- Publication date May 22, 2025
- Applied Materials, Inc.
- Zhiyu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250167140
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167105
- Publication date May 22, 2025
- Chun-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20250167108
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURES INCLUDING A PASSIVE DEVICE
- Publication number 20250167109
- Publication date May 22, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250167111
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jisoo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME
- Publication number 20250167120
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE WITH OVERLAPPING ELECTRIC FIEL...
- Publication number 20250169127
- Publication date May 22, 2025
- DENSO CORPORATION
- SHINICHIROU MIYAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRC...
- Publication number 20250164873
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yonghoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON COMPOUNDS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT D...
- Publication number 20250163081
- Publication date May 22, 2025
- DNF CO., LTD.
- Hyunwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250167141
- Publication date May 22, 2025
- Samsung Electronics, Co., Ltd.
- YoungJun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices including a stair step structure adjacent a substantially p...

Semiconductor chip with fuse structure in scribe lane and method of...

Integrated assemblies having graphene-containing-structures

Graphene barrier layer for reduced contact resistance

Via configurable edge-combiner with duty cycle correction

Three-dimensional memory device and method of making thereof using...

Semiconductor device including spacer layer contacting bit line bot...

Method for manufacturing semiconductor structure with isolation fea...

Semiconductor apparatus and method for manufacturing the same

Semiconductor device and method

FinFET device and method of forming same

Method for manufacturing electronic component device

Self-aligned lines and methods for fabricating the same

Microelectronics package comprising a package-on-package (POP) arch...

Semiconductor device

Method for preparing semiconductor device with composite passivatio...

Memory device and fabrication method thereof

Microelectronic devices, memory devices, and electronic systems

Dielectric on wire structure to increase processing window for over...

Semiconductor device and method for forming the same

Structures with deep trench isolation regions for a high-voltage fi...

Method for manufacturing semiconductor device structure

Power rail and signal conducting line arrangement

Plating systems having reduced air entrainment

Method for manufacturing semiconductor device

Interconnection structure and manufacturing method thereof

Backside metal patterning die singulation systems and related methods

Semiconductor substrate structure and method of manufacturing the same

Semiconductor device with liner structure

Dielectric fin structures with varying height

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

LOW RESISTANCE VIA STRUCTURE

Selective Removal of an Etching Stop Layer for Improving Overlay Sh...

MERGED BACKSIDE CONTACT ISOLATION

ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK

LIGHT-EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEV...

DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

BOUNDARY DESIGN TO REDUCE MEMORY ARRAY EDGE CMP DISHING EFFECT

BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...

METHOD OF FABRICATING CONTACT STRUCTURE

VIAS WITH SELECTED GRAIN DISTRIBUTION

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

GROUP III NITRIDE TRANSISTOR DEVICE AND METHOD FOR FABRICATING A GR...

METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...

DEPOSITION PROCESS FOR PATTERNING EDGE PLACEMENT ERROR IMPROVEMENT

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL

STACKED SEMICONDUCTOR STRUCTURES INCLUDING A PASSIVE DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SILICON CARBIDE SEMICONDUCTOR DEVICE WITH OVERLAPPING ELECTRIC FIEL...

PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRC...

SILICON COMPOUNDS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT D...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE