Making of isolation regions between components

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H01L21/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76Making of isolation regions between components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with BioFETs
- Patent number 12,222,317
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- G01 - MEASURING TESTING
Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 12,224,203
- Issue date Feb 11, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binning system
- Patent number 12,225,312
- Issue date Feb 11, 2025
- Himax Imaging Limited
- Po-Chang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Single crystalline silicon stack formation and bonding to a cmos wafer
- Patent number 12,224,201
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,224,205
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,224,245
- Issue date Feb 11, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of buried wordline structure
- Patent number 12,224,323
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,225,720
- Issue date Feb 11, 2025
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods of the same
- Patent number 12,225,725
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- So Hyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for FinFet fabrication and structure thereof
- Patent number 12,224,210
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside air gap dielectric
- Patent number 12,224,212
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including active contacts and support conta...
- Patent number 12,224,240
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact structure for a trench power MOSFET with a split gate...
- Patent number 12,224,342
- Issue date Feb 11, 2025
- STMicroelectronics Pte Ltd
- Yean Ching Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure, semiconductor structure and manufacturing met...
- Patent number 12,224,206
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with power connect...
- Patent number 12,224,227
- Issue date Feb 11, 2025
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor
- Patent number 12,224,089
- Issue date Feb 11, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof including a c...
- Patent number 12,224,241
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load switch including back-to-back connected transistors
- Patent number 12,224,740
- Issue date Feb 11, 2025
- Nuvolta Technoloiges (Heifei) Co., Ltd.
- Jinbiao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered substrate structures for power and RF applications
- Patent number 12,217,957
- Issue date Feb 4, 2025
- QROMIS, Inc.
- Vladimir Odnoblyudov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE
- Publication number 20250054767
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20250056801
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...
- Publication number 20250056858
- Publication date Feb 13, 2025
- SOITEC
- Christelle Veytizou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054849
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054869
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PHYSICALLY UNCLONABLE FUNCTION DEVICE
- Publication number 20250054880
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Hung-Chan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION
- Publication number 20250056865
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SYSTEM
- Publication number 20250054857
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A DONOR SUBSTRATE
- Publication number 20250054745
- Publication date Feb 13, 2025
- SOITEC
- Sebastien Thibert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT
- Publication number 20250054811
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...
- Publication number 20250054812
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE/NANOSHEET DEVICE WITH CRYSTAL SPACER AND METHOD OF MANUFAC...
- Publication number 20250056850
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20250056851
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT
- Publication number 20250054858
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Kai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS
- Publication number 20250054887
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Guy BRIZAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-REDUCTION STRUCTURES FOR A COMPOUND SEMICONDUCTOR LAYER STACK
- Publication number 20250054908
- Publication date Feb 13, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Brett Cucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054808
- Publication date Feb 13, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES
- Publication number 20250054823
- Publication date Feb 13, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS
- Publication number 20250056871
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- San-Kuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON NITRIDE
- Publication number 20250054747
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP
- Publication number 20250054809
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...
- Publication number 20250054810
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250056862
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-Chuan YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...
- Publication number 20250054855
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS

Making of isolation regions between components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit with BioFETs

Air gap spacer formation for nano-scale semiconductor devices

Semiconductor circuit structure with direct die heat removal structure

Semiconductor chip and semiconductor package including the same

Binning system

Single crystalline silicon stack formation and bonding to a cmos wafer

Semiconductor device and method

Semiconductor memory device and manufacturing method thereof

Embedded die architecture and method of making

Fabrication method of buried wordline structure

Method of forming backside power rails

Three-dimensional memory device with doped semiconductor bridge str...

Semiconductor devices and manufacturing methods of the same

Method for producing 3D semiconductor devices and structures with t...

Method for FinFet fabrication and structure thereof

Semiconductor devices with backside air gap dielectric

Microelectronic devices including active contacts and support conta...

Semiconductor device and manufacturing method thereof

Gate contact structure for a trench power MOSFET with a split gate...

Forming an oxide volume within a fin

Conductive structure, semiconductor structure and manufacturing met...

Method for manufacturing semiconductor structure with power connect...

Dual metal silicide structures for advanced integrated circuit stru...

Thin film resistor

Metal heterojunction structure with capping metal layer

Method of manufacturing a via and a metal wiring for a semiconducto...

Semiconductor device and manufacturing method thereof including a c...

Load switch including back-to-back connected transistors

Engineered substrate structures for power and RF applications

Semiconductor package and method of fabricating semiconductor package

Patents Applicationslast 30 patents

SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE

VERTICAL MEMORY DEVICES

GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

FORMING LARGE CHIPS THROUGH STITCHING

METHOD FOR FABRICATING PHYSICALLY UNCLONABLE FUNCTION DEVICE

SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION

CONTROLLING FIN-THINNING THROUGH FEEDBACK

INTEGRATED CIRCUIT DEVICE AND SYSTEM

METHOD FOR FABRICATING A DONOR SUBSTRATE

SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT

SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...

NANOWIRE/NANOSHEET DEVICE WITH CRYSTAL SPACER AND METHOD OF MANUFAC...

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS

STRESS-REDUCTION STRUCTURES FOR A COMPOUND SEMICONDUCTOR LAYER STACK

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

METHOD FOR REDUCING WAFER EDGE DEFECTS

SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES

METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS

CONFORMAL DEPOSITION OF SILICON NITRIDE

FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP

SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...