Male die used for patterning, punching or transferring

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CPC
H05K2203/0108

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0108Male die used for patterning, punching or transferring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
LED lamp having metal PCB bent polyhedrally and manufacturing metho...
- Patent number 11,480,328
- Issue date Oct 25, 2022
- ECOCAB.CO., LTD
- Young Cheon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing flexible printed interconnect board
- Patent number 11,245,237
- Issue date Feb 8, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Yoshiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,999,935
- Issue date May 4, 2021
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High-density soft-matter electronics
- Patent number 10,945,339
- Issue date Mar 9, 2021
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Preparation of electrical circuits by adhesive transfer
- Patent number 10,849,234
- Issue date Nov 24, 2020
- 3M Innovative Properties Company
- John D. Le
- B32 - LAYERED PRODUCTS
Information Patent Grant
High temperature resistant fabric and its use in flexible circuits
- Patent number 10,849,222
- Issue date Nov 24, 2020
- PIONEER CIRCUITS, INC.
- Dale McKeeby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezochromic stamp
- Patent number 10,813,223
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with heat sink
- Patent number 10,785,864
- Issue date Sep 22, 2020
- Amazon Technologies, Inc.
- William Mische
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic product and manufacturing method thereof
- Patent number 10,716,219
- Issue date Jul 14, 2020
- Lite-On Electronics (Guangzhou) Limited
- Yi-Feng Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper nanoparticle application processes for low temperature print...
- Patent number 10,701,804
- Issue date Jun 30, 2020
- Kuprion Inc.
- Alfred A. Zinn
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,672,928
- Issue date Jun 2, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Composite member and method of manufacturing the same, and aliphati...
- Patent number 10,634,996
- Issue date Apr 28, 2020
- Japan Advanced Institute of Science and Technology
- Satoshi Inoue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Enhanced protective layering process to accommodate circuit board h...
- Patent number 10,631,413
- Issue date Apr 21, 2020
- The United States of America as represented by the Secretary of the Army
- Nien-Hua Chao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Preparation method of flexible transparent circuit
- Patent number 10,588,217
- Issue date Mar 10, 2020
- DALIAN UNIVERSITY
- Jing Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roll-to-roll patterning of transparent and metallic layers
- Patent number 10,546,722
- Issue date Jan 28, 2020
- MicroContinuum, Inc.
- W. Dennis Slafer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of circuit board and stamp
- Patent number 10,512,166
- Issue date Dec 17, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multilayer ceramic substrate and method for manufacturing same
- Patent number 10,455,699
- Issue date Oct 22, 2019
- Hitachi Metals, Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,426,038
- Issue date Sep 24, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive patterns with wide line-width and methods f...
- Patent number 10,399,851
- Issue date Sep 3, 2019
- 3M Innovative Properties Company
- Chi-fan Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a substrate structured by nanowires, produced...
- Patent number 10,384,230
- Issue date Aug 20, 2019
- Universität Ulm
- Steffen Strehle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for recycling electronic systems
- Patent number 10,378,080
- Issue date Aug 13, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,362,682
- Issue date Jul 23, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal PCB assembly for vehicle lamp and manufacturing method thereof
- Patent number 10,337,687
- Issue date Jul 2, 2019
- SEJONG MATERIALS CO., LTD
- Jaedeok Sung
- F21 - LIGHTING
Information Patent Grant
Systems and methods for patterning composite materials and fabricat...
- Patent number 10,260,126
- Issue date Apr 16, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Mother ceramic substrate, ceramic substrate, mother module componen...
- Patent number 10,257,927
- Issue date Apr 9, 2019
- Murata Manufacturing Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,098,234
- Issue date Oct 9, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making glass core substrate for integrated circuit devices
- Patent number 10,070,524
- Issue date Sep 4, 2018
- Intel Corporation
- Qing Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- Publication number 20240098902
- Publication date Mar 21, 2024
- ZTE Corporation
- Da CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20220167499
- Publication date May 26, 2022
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Density Soft-Matter Electronics
- Publication number 20210204410
- Publication date Jul 1, 2021
- Carnegie Mellon University
- Carmel Majidi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING FLEXIBLE PRINTED INTERCONNECT BOARD
- Publication number 20210044067
- Publication date Feb 11, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Yoshiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LAMP HAVING METAL PCB BENT POLYHEDRALLY AND MANUFACUTRING METHO...
- Publication number 20200318826
- Publication date Oct 8, 2020
- ECOCAB CO., LTD.
- Young Cheon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL FILM, AND NANOIMPRINT LITHOGRAPHY MATERIAL
- Publication number 20200218148
- Publication date Jul 9, 2020
- Ushio Denki Kabushiki Kaisha
- Yohei NAWAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Preparation of Electrical Circuits by Adhesive Transfer
- Publication number 20200029443
- Publication date Jan 23, 2020
- 3M Innovative Properties Company
- John D. Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20190281703
- Publication date Sep 12, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PIEZOCHROMIC STAMP
- Publication number 20180376599
- Publication date Dec 27, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HIGH TEMPERATURE RESISTANT FABRIC AND ITS USE IN FLEXIBLE CIRCUITS
- Publication number 20180199434
- Publication date Jul 12, 2018
- PIONEER CIRCUITS, INC.
- Dale McKeeby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PCB ASSEMBLY FOR VEHICLE LAMP AND MANUFACTURING METHOD THEREOF
- Publication number 20180010775
- Publication date Jan 11, 2018
- SEJONG MATERIALS CO., LTD
- Jaedeok SUNG
- F21 - LIGHTING
Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20170358700
- Publication date Dec 14, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE STRUCTURED BY NANOWIRES, PRODUCED...
- Publication number 20170348727
- Publication date Dec 7, 2017
- UNIVERSITAT ULM
- Steffen STREHLE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STAMP FOR PRINTED CIRCUIT PROCESS AND METHOD OF FABRICATING THE SAM...
- Publication number 20170311452
- Publication date Oct 26, 2017
- WINBOND ELECTRONICS CORP.
- Yu-Hsuan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20170273186
- Publication date Sep 21, 2017
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FOR THERMAL IMPRINTING
- Publication number 20140339735
- Publication date Nov 20, 2014
- Takemori Toshifumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MAKING MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20140306382
- Publication date Oct 16, 2014
- Ronald Steven Cok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSPARENT CONDUCTIVE FILM AND PREPARATION METHOD THEREOF
- Publication number 20140290995
- Publication date Oct 2, 2014
- Yulong Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN PROTRUSION FORMING METHOD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20140295065
- Publication date Oct 2, 2014
- Fujitsu Limited
- Tomomi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SCREEN AND METHOD OF PRODUCING THE SAME
- Publication number 20140290980
- Publication date Oct 2, 2014
- SHENZHEN O-FILM TECH CO., LTD
- GENCHU TANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCHSCREEN AND CONDUCTIVE LAYER THEREOF
- Publication number 20140284082
- Publication date Sep 25, 2014
- Fei Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICALLY DIFFUSE MICRO-CHANNEL
- Publication number 20140284084
- Publication date Sep 25, 2014
- RONALD Steven COK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITRY WITH HIGH ASPECT RATIO TRACES
- Publication number 20140262444
- Publication date Sep 18, 2014
- George Gregoire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBOSSED MICRO-STRUCTURE WITH CURED TRANSFER MATERIAL METHOD
- Publication number 20140262452
- Publication date Sep 18, 2014
- RONALD STEVEN COK
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MICRO-CHANNEL CONNECTION METHOD
- Publication number 20140251673
- Publication date Sep 11, 2014
- RONALD STEVEN COK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO-CHANNEL STRUCTURE WITH VARIABLE DEPTHS
- Publication number 20140251661
- Publication date Sep 11, 2014
- Ronald Steven Cok
- G02 - OPTICS
Information Patent Application
MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20140239504
- Publication date Aug 28, 2014
- Hwei-Ling Yau
- G02 - OPTICS
Information Patent Application
FLIP CHIP PACKAGING METHOD, AND FLUX HEAD MANUFACTURING METHOD APPL...
- Publication number 20140242753
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Kyeong Min YEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Male die used for patterning, punching or transferring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned article including electrically conductive elements

Patterned conductive article

High-density soft-matter electronics

LED lamp having metal PCB bent polyhedrally and manufacturing metho...

Method of manufacturing flexible printed interconnect board

Manufacturing method of circuit board

High-density soft-matter electronics

Preparation of electrical circuits by adhesive transfer

High temperature resistant fabric and its use in flexible circuits

Piezochromic stamp

Printed circuit board with heat sink

Electronic product and manufacturing method thereof

Copper nanoparticle application processes for low temperature print...

Metal foil pattern layered body, metal foil layered body, metal foi...

Composite member and method of manufacturing the same, and aliphati...

Enhanced protective layering process to accommodate circuit board h...

Preparation method of flexible transparent circuit

Roll-to-roll patterning of transparent and metallic layers

Manufacturing method of circuit board and stamp

Multilayer ceramic substrate and method for manufacturing same

Manufacturing method of circuit board

Electrically conductive patterns with wide line-width and methods f...

Method for producing a substrate structured by nanowires, produced...

Systems and methods for recycling electronic systems

Manufacturing method of circuit board

Metal PCB assembly for vehicle lamp and manufacturing method thereof

Systems and methods for patterning composite materials and fabricat...

Mother ceramic substrate, ceramic substrate, mother module componen...

Manufacturing method of circuit board

Method of making glass core substrate for integrated circuit devices

Patents Applicationslast 30 patents

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

PATTERNED CONDUCTIVE ARTICLE

THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD

PATTERNED CONDUCTIVE ARTICLE

High-Density Soft-Matter Electronics

METHOD OF MANUFACTURING FLEXIBLE PRINTED INTERCONNECT BOARD

LED LAMP HAVING METAL PCB BENT POLYHEDRALLY AND MANUFACUTRING METHO...

METHOD FOR FORMING A METAL FILM, AND NANOIMPRINT LITHOGRAPHY MATERIAL

Preparation of Electrical Circuits by Adhesive Transfer

MANUFACTURING METHOD OF CIRCUIT BOARD

PIEZOCHROMIC STAMP

HIGH TEMPERATURE RESISTANT FABRIC AND ITS USE IN FLEXIBLE CIRCUITS

METAL PCB ASSEMBLY FOR VEHICLE LAMP AND MANUFACTURING METHOD THEREOF

METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...

METHOD FOR PRODUCING A SUBSTRATE STRUCTURED BY NANOWIRES, PRODUCED...

STAMP FOR PRINTED CIRCUIT PROCESS AND METHOD OF FABRICATING THE SAM...

MANUFACTURING METHOD OF CIRCUIT BOARD

RESIN FOR THERMAL IMPRINTING

MAKING MULTI-LAYER MICRO-WIRE STRUCTURE

TRANSPARENT CONDUCTIVE FILM AND PREPARATION METHOD THEREOF

RESIN PROTRUSION FORMING METHOD AND WIRING BOARD MANUFACTURING METHOD

TOUCH SCREEN AND METHOD OF PRODUCING THE SAME

TOUCHSCREEN AND CONDUCTIVE LAYER THEREOF

OPTICALLY DIFFUSE MICRO-CHANNEL

CIRCUITRY WITH HIGH ASPECT RATIO TRACES

EMBOSSED MICRO-STRUCTURE WITH CURED TRANSFER MATERIAL METHOD

MICRO-CHANNEL CONNECTION METHOD

MICRO-CHANNEL STRUCTURE WITH VARIABLE DEPTHS

MULTI-LAYER MICRO-WIRE STRUCTURE

FLIP CHIP PACKAGING METHOD, AND FLUX HEAD MANUFACTURING METHOD APPL...