Manganese [Mn] as principal constituent

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H01L2224/05149

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05149Manganese [Mn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with bonded substrates
- Patent number 12,002,777
- Issue date Jun 4, 2024
- Kioxia Corporation
- Kotaro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,769,747
- Issue date Sep 26, 2023
- Kioxia Corporation
- Genki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,152,334
- Issue date Oct 19, 2021
- TOSHIBA MEMORY CORPORATION
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having insulating layers containing oxygen and...
- Patent number 9,704,740
- Issue date Jul 11, 2017
- Fujitsu Semiconductor Limited
- Hirosato Ochimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bump structure with underbump metallization structure and integrate...
- Patent number 9,190,373
- Issue date Nov 17, 2015
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIFFUSION BARRIERS AND METHOD OF FORMING SAME
- Publication number 20230132632
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220302055
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Kotaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220189905
- Publication date Jun 16, 2022
- KIOXIA Corporation
- Genki SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200294971
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20140264869
- Publication date Sep 18, 2014
- Chao-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120049356
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES
- Publication number 20110281136
- Publication date Nov 17, 2011
- Jenq-Gong Duh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Manganese [Mn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with bonded substrates

Semiconductor device and method of manufacturing the same

Semiconductor substrate having a bond pad material based on aluminum

Semiconductor device and method of manufacturing the same

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Semiconductor device having insulating layers containing oxygen and...

Wafer to wafer bonding process and structures

Bump structure with underbump metallization structure and integrate...

Power semiconductor devices

Patents Applicationslast 30 patents

DIFFUSION BARRIERS AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device

POWER SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES