Manganese (Mn) as principal constituent

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H01L2224/45149

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45149Manganese (Mn) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,998,295
- Issue date May 4, 2021
- Denso Corporation
- Hiromasa Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin coated bonding wire, method of manufacturing the same, and se...
- Patent number 5,396,104
- Issue date Mar 7, 1995
- Nippon Steel Corporation
- Masao Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AL BONDING WIRE
- Publication number 20230142531
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190221549
- Publication date Jul 18, 2019
- DENSO CORPORATION
- Hiromasa HAYASHI
- G01 - MEASURING TESTING
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR