Manufacture and pre-treatment of the layer connector preform

Industry

CPC
H01L2224/271

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/271Manufacture and pre-treatment of the layer connector preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and bonding of devices
- Patent number 11,677,060
- Issue date Jun 13, 2023
- ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,139,265
- Issue date Oct 5, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having a mesh bond material and methods of fo...
- Patent number 10,861,816
- Issue date Dec 8, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,832,830
- Issue date Nov 10, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOUNTING MATERIAL FILLER AND METHOD FOR PRODUCING SEM...
- Publication number 20230352435
- Publication date Nov 2, 2023
- ADMATECHS CO., LTD.
- Shinta HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND...
- Publication number 20230187403
- Publication date Jun 15, 2023
- Hyundai Motor Company
- Kyoung-Kook Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220238489
- Publication date Jul 28, 2022
- KIOXIA Corporation
- Takahiro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...
- Publication number 20220139864
- Publication date May 5, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20200152352
- Publication date May 14, 2020
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FO...
- Publication number 20200126943
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20200020664
- Publication date Jan 16, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Manufacture and pre-treatment of the layer connector preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding member, method for producing bonding member and method for...

Low pressure sintering powder

Connection structure and manufacturing method therefor

Semiconductor device and method of manufacturing semiconductor device

Anisotropic conductive film and connected structure

Multilayer substrate

Connection structure

Anisotropic conductive film and display device using the same

Method for transferring and bonding of devices

Electroconductive film, roll, connected structure, and process for...

Adhesive bonding composition and method of use

Ultra-thin embedded semiconductor device package and method of manu...

Multilayered transient liquid phase bonding

Sintering materials and attachment methods using same

Semiconductor device and a method of manufacturing the same

Anisotropic conductive film and connected structure

Connection structure

Member for semiconductor device

Low pressure sintering powder

Selectively cross-linked thermal interface materials

Anisotropic electrically conductive film and connection structure

Multi-layered composite bonding materials and power electronics ass...

Electronic assemblies having a mesh bond material and methods of fo...

Anisotropic conductive film and production method of the same

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film, method for producing same...

Connection structure

Method for producing a silver sintering agent having silver oxide s...

Wafer-level packaging methods using a photolithographic bonding mat...

Semiconductor device and a method of manufacturing the same

Patents Applicationslast 30 patents

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

SINTERING FILM FRAMES AND RELATED METHODS

SEMICONDUCTOR MOUNTING MATERIAL FILLER AND METHOD FOR PRODUCING SEM...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND...

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

CONNECTION STRUCTURE

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

ANISOTROPIC CONDUCTIVE FILM

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FO...

CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES