Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Industry

CPC
H05K3/4682

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4682Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and component fabrication apparatus
- Patent number 11,919,227
- Issue date Mar 5, 2024
- DST INNOVATIONS, LTD.
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate, metal foil-clad laminate, laminate having patterned metal...
- Patent number 11,877,396
- Issue date Jan 16, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,812,556
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil with carrier
- Patent number 11,765,840
- Issue date Sep 19, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board
- Patent number 11,715,680
- Issue date Aug 1, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate substrate and fabrication method thereof
- Patent number 11,658,104
- Issue date May 23, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic package comprising the same
- Patent number 11,627,659
- Issue date Apr 11, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,553,601
- Issue date Jan 10, 2023
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising pillars on a coreless substrate
- Patent number 11,553,599
- Issue date Jan 10, 2023
- AT&S(Chongqing) Company Limited
- Yu-Hui Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board insulating sheet, multilayer board, and method of...
- Patent number 11,546,989
- Issue date Jan 3, 2023
- TDK Corporation
- Seiko Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package stack structure and method for manufacturing the same
- Patent number 11,516,925
- Issue date Nov 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,503,709
- Issue date Nov 15, 2022
- Ibiden Co., Ltd.
- Shota Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,469,166
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil, copper foil having carrier, laminated...
- Patent number 11,401,612
- Issue date Aug 2, 2022
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing coreless substrate
- Patent number 11,399,440
- Issue date Jul 26, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate and method for manufacturing the same
- Patent number 11,398,421
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a three dimensionally printed wiring struc...
- Patent number 11,388,824
- Issue date Jul 12, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic component-incorporating substrate
- Patent number 11,367,626
- Issue date Jun 21, 2022
- TDK Corporation
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method
- Patent number 11,317,522
- Issue date Apr 26, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,297,714
- Issue date Apr 5, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young-Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 11,284,515
- Issue date Mar 22, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package apparatus
- Patent number 11,246,223
- Issue date Feb 8, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, laminate, printed wiring board, coreless substrate, semico...
- Patent number 11,214,660
- Issue date Jan 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with high-capacity copper circuit
- Patent number 11,160,166
- Issue date Oct 26, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Fang-Bo Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with component embedded in cavity and with double...
- Patent number 11,160,169
- Issue date Oct 26, 2021
- AT&S (Chongqing) Company Limited
- Yu-Hui Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
- Publication number 20230395395
- Publication date Dec 7, 2023
- TOPPAN INC.
- Takashi KIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FLEXIBLE SUBSTRATE
- Publication number 20230345644
- Publication date Oct 26, 2023
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Protruding Portions and Manufacturing Method
- Publication number 20230262892
- Publication date Aug 17, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM
- Publication number 20230240022
- Publication date Jul 27, 2023
- IO TECH GROUP LTD.
- Ralph S. Birnbaum
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20230137841
- Publication date May 4, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coreless Component Carrier With Embedded Components
- Publication number 20230128938
- Publication date Apr 27, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Allen ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20220375839
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359361
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...
- Publication number 20220295646
- Publication date Sep 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20220285257
- Publication date Sep 8, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220199506
- Publication date Jun 23, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE COMPRISING THE SAME
- Publication number 20220104347
- Publication date Mar 31, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC LEAD ASSEMBLY AND METHODS OF MICROFABRICATING A MONOLITH...
- Publication number 20220037054
- Publication date Feb 3, 2022
- Verily Life Sciences LLC
- Annapurna Karicherla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...
- Publication number 20210410297
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210345491
- Publication date Nov 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE
- Publication number 20210298184
- Publication date Sep 23, 2021
- Unimicron Technology Corp.
- Chien-Chen LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210289614
- Publication date Sep 16, 2021
- Unimicron Technology Corp.
- Chang-Fu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD
- Publication number 20210282277
- Publication date Sep 9, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BODY
- Publication number 20210274650
- Publication date Sep 2, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210259106
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Shota TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...
- Publication number 20210243903
- Publication date Aug 5, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD
- Publication number 20210219435
- Publication date Jul 15, 2021
- Unimicron Technology Corp.
- Chun-Hsien Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, METAL FOIL-CLAD LAMINATE, LAMINATE HAVING PATTERNED METAL...
- Publication number 20210204404
- Publication date Jul 1, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20210185822
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210136929
- Publication date May 6, 2021
- IBIDEN CO., LTD.
- Kazuyuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210068267
- Publication date Mar 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER
- Publication number 20210059057
- Publication date Feb 25, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and component fabrication apparatus

Manufacturing method of package structure

Laminate, metal foil-clad laminate, laminate having patterned metal...

Printed circuit board and manufacturing method thereof

Packages with Si-substrate-free interposer and method forming same

Copper foil with carrier

Printed circuit board

Intermediate substrate and fabrication method thereof

Printed circuit board and electronic package comprising the same

Wiring board and method for manufacturing the same

Component carrier comprising pillars on a coreless substrate

Multilayer board insulating sheet, multilayer board, and method of...

Package stack structure and method for manufacturing the same

Module installation on printed circuit boards with embedded trace t...

Printed wiring board and method for manufacturing printed wiring board

Packages with Si-substrate-free interposer and method forming same

Surface-treated copper foil, copper foil having carrier, laminated...

Method for manufacturing coreless substrate

Semiconductor substrate and method for manufacturing the same

Component carrier having a three dimensionally printed wiring struc...

Electronic component-incorporating substrate

Semiconductor chip with patterned underbump metallization and polym...

Wiring board manufacturing method

Printed circuit board

Electronic component embedded substrate

Package apparatus

Supporting substrate, supporting substrate-attached laminate and me...

Prepreg, laminate, printed wiring board, coreless substrate, semico...

Printed circuit board with high-capacity copper circuit

Component carrier with component embedded in cavity and with double...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...

METHOD OF MANUFACTURING FLEXIBLE SUBSTRATE

Component Carrier With Protruding Portions and Manufacturing Method

HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM

CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE

Coreless Component Carrier With Embedded Components

Packages with Si-Substrate-Free Interposer and Method Forming Same

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...

INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE COMPRISING THE SAME

MONOLITHIC LEAD ASSEMBLY AND METHODS OF MICROFABRICATING A MONOLITH...

TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE

CIRCUIT CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

MULTILAYER BODY

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

LAMINATE, METAL FOIL-CLAD LAMINATE, LAMINATE HAVING PATTERNED METAL...

MANUFACTURING METHOD OF PACKAGE STRUCTURE

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER FOIL WITH CARRIER