Manufacture of specific parts of devices defined in group H01L21/70

Industry

CPC
H01L21/71

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/71Manufacture of specific parts of devices defined in group H01L21/70

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 12,087,712
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor chip including crack propaga...
- Patent number 11,990,372
- Issue date May 21, 2024
- SK hynix Inc.
- In Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having electrically isolated warpage prevention structures
- Patent number 11,862,576
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Christlyn Faith Hobrero Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for designing thermal sensor arrangement
- Patent number 11,810,813
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jaw-Juinn Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices including separate upper and lower bit...
- Patent number 11,744,063
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding using layers with staggered trenches
- Patent number 11,626,366
- Issue date Apr 11, 2023
- Silicon Laboratories Inc.
- Thomas C. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and manufacturing method thereof
- Patent number 11,462,491
- Issue date Oct 4, 2022
- Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Xiaoli He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed substrates for transient electronic systems
- Patent number RE49059
- Issue date May 3, 2022
- Palo Alto Research Center Incorporated
- Scott J. H. Limb
Information Patent Grant
Semiconductor memory devices including separate upper and lower bit...
- Patent number 11,088,148
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically flexible interconnects, methods of making the same, an...
- Patent number 10,636,731
- Issue date Apr 28, 2020
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System reference with compensation of electrical and mechanical str...
- Patent number 10,438,835
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Mario Motz
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor integrated circuit device having electrostatic discha...
- Patent number 10,388,561
- Issue date Aug 20, 2019
- SK hynix Inc.
- Yun Seok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stressed substrates for transient electronic systems
- Patent number RE47570
- Issue date Aug 13, 2019
- Palo Alto Research Center Incorporated
- Scott J. H. Limb
Information Patent Grant
Semiconductor memory devices including separate upper and lower bit...
- Patent number 10,373,960
- Issue date Aug 6, 2019
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip part and manufacturing method thereof
- Patent number 10,342,138
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Yasuhiro Kondo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing thin film transistor, dehydrogenating appar...
- Patent number 10,325,928
- Issue date Jun 18, 2019
- LG Display Co., Ltd.
- Sung soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTPS array substrate, method for manufacturing the same, and displa...
- Patent number 10,312,130
- Issue date Jun 4, 2019
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yaru Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting diode and method for manufacturing the same
- Patent number 10,193,041
- Issue date Jan 29, 2019
- Advanced Optoelectronic Technology, Inc.
- Shih-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System reference with compensation of electrical and mechanical str...
- Patent number 10,103,050
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Mario Motz
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor package with stator set formed...
- Patent number 9,679,826
- Issue date Jun 13, 2017
- Amtek Semiconductors Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenched Faraday shielding
- Patent number 9,520,367
- Issue date Dec 13, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zihao M. Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stator set formed by circuits
- Patent number 9,390,959
- Issue date Jul 12, 2016
- Amtek Semiconductors Co., Ltd.
- Chien-Ping Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally tempered glass substrate using CTE mismatched layers and...
- Patent number 9,356,603
- Issue date May 31, 2016
- Palo Alto Research Center Incorporated
- Scott J. H. Limb
- B32 - LAYERED PRODUCTS
Information Patent Grant
IC wafer having electromagnetic shielding effects and method for ma...
- Patent number 9,331,024
- Issue date May 3, 2016
- Xintec Inc.
- Yao-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductors using a combination of electro...
- Patent number 9,219,000
- Issue date Dec 22, 2015
- Raytheon Company
- Paul J. Duval
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Stressed substrates for transient electronic systems
- Patent number 9,154,138
- Issue date Oct 6, 2015
- Palo Alto Research Center Incorporated
- Scott J. H. Limb
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,048,277
- Issue date Jun 2, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshiaki Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and method of manufacturing the same
- Patent number 8,987,867
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding two wafers
- Patent number 8,926,775
- Issue date Jan 6, 2015
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCA...
- Publication number 20250006659
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ji-Feng Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING REINFORCEMENT
- Publication number 20240379587
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240297127
- Publication date Sep 5, 2024
- Infineon Technologies Austria AG
- Mohamed Salleh Mohamed Saheed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED CHARGE BALANCE AND EDGE TERMINATION SURFACE PASSIVATION FO...
- Publication number 20240145532
- Publication date May 2, 2024
- IDEAL SEMICONDUCTOR DEVICES, INC.
- David Jauregui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES
- Publication number 20240128204
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith Hobrero Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20230230938
- Publication date Jul 20, 2023
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES
- Publication number 20230139898
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith Hobrero Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING REINFORCEMENT
- Publication number 20230043166
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure and Method of Fabricating the Same
- Publication number 20230036280
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING USING LAYERS WITH STAGGERED TRENCHES
- Publication number 20220406708
- Publication date Dec 22, 2022
- Silicon Laboratories Inc.
- Thomas C. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING CRACK PROPAGA...
- Publication number 20220319924
- Publication date Oct 6, 2022
- SK HYNIX INC.
- In Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...
- Publication number 20210343724
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20210335732
- Publication date Oct 28, 2021
- KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
- Xiaoli HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...
- Publication number 20190333918
- Publication date Oct 31, 2019
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM REFERENCE WITH COMPENSATION OF ELECTRICAL AND MECHANICAL STR...
- Publication number 20190013233
- Publication date Jan 10, 2019
- INFINEON TECHNOLOGIES AG
- Mario Motz
- G01 - MEASURING TESTING
Information Patent Application
MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF MAKING THE SAME, AN...
- Publication number 20190006271
- Publication date Jan 3, 2019
- Georgia Tech Research Corporation
- Muhannad S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grafting Design for Pattern Post-Treatment in Semiconductor Manufac...
- Publication number 20180337044
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Siao-Shan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...
- Publication number 20180286870
- Publication date Oct 4, 2018
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTPS ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLA...
- Publication number 20180144972
- Publication date May 24, 2018
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yaru JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING ELECTROSTATIC DISCHA...
- Publication number 20180025934
- Publication date Jan 25, 2018
- SK HYNIX INC.
- Yun Seok HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Thin Film Transistor, Dehydrogenating Appar...
- Publication number 20170352688
- Publication date Dec 7, 2017
- LG Display Co., Ltd.
- Sung soo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING I-SHAPED INTERCONNECT
- Publication number 20170323829
- Publication date Nov 9, 2017
- Twisden Ltd.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCHED FARADAY SHIELDING
- Publication number 20160056114
- Publication date Feb 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zihao M. Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR A METAL FINGER CAPACITOR WITH A TRIPLET REPEA...
- Publication number 20150054126
- Publication date Feb 26, 2015
- MaxLinear, Inc.
- Weizhong Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARK, PHOTOMASK, AND METHOD FOR FORMING ALIGNMENT MARK
- Publication number 20150008598
- Publication date Jan 8, 2015
- KABUSHIKI KAISHA TOSHIBA
- Yoshinori HAGIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140203450
- Publication date Jul 24, 2014
- AMTEK SEMICONDUCTORS CO., LTD.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTORS USING A COMBINATION OF ELECTRO...
- Publication number 20140206173
- Publication date Jul 24, 2014
- Raytheon Company
- Paul J. Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING TWO WAFERS
- Publication number 20140196846
- Publication date Jul 17, 2014
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC WAFER HAVING ELECTROMAGNETIC SHIELDING EFFECTS AND METHOD FOR MA...
- Publication number 20140091441
- Publication date Apr 3, 2014
- Xintec Inc.
- Yao-Hsiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Manufacture of specific parts of devices defined in group H01L21/70

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating an integrated circuit device

Methods of manufacturing semiconductor chip including crack propaga...

IC having electrically isolated warpage prevention structures

System for designing thermal sensor arrangement

Semiconductor memory devices including separate upper and lower bit...

Shielding using layers with staggered trenches

Array substrate and manufacturing method thereof

Stressed substrates for transient electronic systems

Semiconductor memory devices including separate upper and lower bit...

Mechanically flexible interconnects, methods of making the same, an...

System reference with compensation of electrical and mechanical str...

Semiconductor integrated circuit device having electrostatic discha...

Stressed substrates for transient electronic systems

Semiconductor memory devices including separate upper and lower bit...

Chip part and manufacturing method thereof

Method of manufacturing thin film transistor, dehydrogenating appar...

LTPS array substrate, method for manufacturing the same, and displa...

Transfer substrate for forming metal wiring and method for forming...

Light emitting diode and method for manufacturing the same

System reference with compensation of electrical and mechanical str...

Method for fabricating semiconductor package with stator set formed...

Trenched Faraday shielding

Semiconductor package with stator set formed by circuits

Thermally tempered glass substrate using CTE mismatched layers and...

IC wafer having electromagnetic shielding effects and method for ma...

Method for processing semiconductors using a combination of electro...

Stressed substrates for transient electronic systems

Semiconductor device and method for manufacturing semiconductor device

Wafer and method of manufacturing the same

Method and device for bonding two wafers

Patents Applicationslast 30 patents

METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCA...

SEAL RING REINFORCEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

COMBINED CHARGE BALANCE AND EDGE TERMINATION SURFACE PASSIVATION FO...

IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES

METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE

IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES

SEAL RING REINFORCEMENT

Seal Ring Structure and Method of Fabricating the Same

SHIELDING USING LAYERS WITH STAGGERED TRENCHES

METHODS OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING CRACK PROPAGA...

SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...

ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...

SYSTEM REFERENCE WITH COMPENSATION OF ELECTRICAL AND MECHANICAL STR...

MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF MAKING THE SAME, AN...

Grafting Design for Pattern Post-Treatment in Semiconductor Manufac...

SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...

LTPS ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLA...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING ELECTROSTATIC DISCHA...

Method of Manufacturing Thin Film Transistor, Dehydrogenating Appar...

INTEGRATED CIRCUIT PACKAGE HAVING I-SHAPED INTERCONNECT

TRENCHED FARADAY SHIELDING

METHOD AND SYSTEM FOR A METAL FINGER CAPACITOR WITH A TRIPLET REPEA...

ALIGNMENT MARK, PHOTOMASK, AND METHOD FOR FORMING ALIGNMENT MARK

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR PROCESSING SEMICONDUCTORS USING A COMBINATION OF ELECTRO...

METHOD AND DEVICE FOR BONDING TWO WAFERS

IC WAFER HAVING ELECTROMAGNETIC SHIELDING EFFECTS AND METHOD FOR MA...