Manufacturing methods of the redistribution layers

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H01L2224/0231

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0231Manufacturing methods of the redistribution layers

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,368,120
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,298
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure including a plurality of an...
- Patent number 12,362,275
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,354,969
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fault isolation, computer device, medium a...
- Patent number 12,347,093
- Issue date Jul 1, 2025
- China Electronics Reliability And Environmental Testing Institute
- Chao Pang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, semiconductor device, and redistribution layer structure...
- Patent number 12,347,797
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,334,433
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,334,434
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge removal for through-resist plating in an electro-plating cup a...
- Patent number 12,331,421
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,322,640
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,315,842
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,300,640
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
- Patent number 12,288,759
- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transformer module
- Patent number 12,272,638
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor between two passivation layers with different etching rates
- Patent number 12,255,131
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS
- Publication number 20250239551
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250233090
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226317
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20250218799
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250210415
- Publication date Jun 26, 2025
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20250201621
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20250183245
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES
- Publication number 20250183153
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250183204
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
- Publication number 20250183058
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...
- Publication number 20250167144
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
- Publication number 20250157922
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250157957
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112180
- Publication date Apr 3, 2025
- AOI ELECTRONICS CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...
- Publication number 20250096117
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Anshih TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20250079428
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP
- Publication number 20250062254
- Publication date Feb 20, 2025
- Shanghai Huali Integrated Circuit Corporation
- Tianquan SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
- Publication number 20250054886
- Publication date Feb 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR
- Publication number 20250038138
- Publication date Jan 30, 2025
- NXP B.V.
- Ting Hsun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods of the redistribution layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming semiconductor packages

Semiconductor device and method

Semiconductor device and method of manufacture

Method for fabricating a chip package

Package structure and method of forming the same

Method of fabricating package structure including a plurality of an...

Semiconductor device and method of manufacture

Method and apparatus for fault isolation, computer device, medium a...

Apparatus, semiconductor device, and redistribution layer structure...

Semiconductor device and method of manufacturing thereof

Semiconductor device and method of fabricating the same

Package structure and method of forming the same

Edge removal for through-resist plating in an electro-plating cup a...

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Device and method for UBM/RDL routing

Semiconductor package and manufacturing method thereof

Passivation layers with rounded corners

Package structure

Semiconductor device and method of manufacturing thereof

Semiconductor redistribution structure with integrated test pad and...

Semiconductor device including re-distribution pads disposed at dif...

Photonic integrated package and method forming same

Package structure and method of manufacturing the same

Integrated circuit structure

Integrated transformer module

Method of manufacturing semiconductor package, method of handling w...

Info structure with copper pillar having reversed profile

Semiconductor package with thermal relaxation block and manufacturi...

Capacitor between two passivation layers with different etching rates

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES

Semiconductor Device and Method

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...

PACKAGES FORMED USING RDL-LAST PROCESS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

Semiconductor Devices and Methods of Manufacturing

Method of Fabricating Redistribution Circuit Structure

METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

Heterogeneous Fan-Out Structure and Method of Manufacture

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...