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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device and method
Patent number
12,368,120
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding layer and process of making
Patent number
12,362,304
Issue date
Jul 15, 2025
Tokyo Electron Limited
Robert D. Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure with a porous structure
Patent number
12,362,290
Issue date
Jul 15, 2025
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,362,261
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Basin-shaped underbump plates and methods of forming the same
Patent number
12,362,299
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
12,362,344
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Juhyeon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor package
Patent number
12,362,329
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
12,362,291
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package circuit
Patent number
12,354,919
Issue date
Jul 8, 2025
INNOLUX CORPORATION
Yeong-E Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory devices with backside bond pads under a memory array
Patent number
12,354,982
Issue date
Jul 8, 2025
Eric N. Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fine-pitch joining pad structure
Patent number
12,354,983
Issue date
Jul 8, 2025
International Business Machines Corporation
Toyohiro Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
Patent number
12,347,798
Issue date
Jul 1, 2025
Sony Group Corporation
Masaki Haneda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad structure coupled to multiple interconnect conductive\ str...
Patent number
12,347,799
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming Chyi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad structure with reduced step height and increased electrica...
Patent number
12,341,115
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Pei Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming same
Patent number
12,334,465
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic core inductors on package substrates
Patent number
12,336,196
Issue date
Jun 17, 2025
Intel Corporation
Krishna Bharath
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display backboard and manufacturing method thereof and display device
Patent number
12,336,355
Issue date
Jun 17, 2025
BOE Technology Group Co., Ltd.
Zhiwei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
12,334,460
Issue date
Jun 17, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Takuya Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel, display device, and manufacturing method of display...
Patent number
12,336,413
Issue date
Jun 17, 2025
Chengdu BOE Optoelectronics Technology Co., Ltd.
Ping Wen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Curved light-emitting substrate
Patent number
12,328,941
Issue date
Jun 10, 2025
Shanghai Tianma Micro-Electronics Co., Ltd.
Zhenhai Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,322,729
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Weiming Chris Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
Patent number
12,322,717
Issue date
Jun 3, 2025
ams AG
Jens Hofrichter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming insulating layers around...
Patent number
12,322,725
Issue date
Jun 3, 2025
Semtech Corporation
Satyamoorthi Chinnusamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming integrated chip structure having slotted bond pad...
Patent number
12,322,715
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing die stack structure
Patent number
12,322,728
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passivation layers with rounded corners
Patent number
12,322,646
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Mingni Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
Patent number
12,322,654
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yuanhao Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
Patent number
12,315,833
Issue date
May 27, 2025
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroplated indium bump stacks for cryogenic electronics
Patent number
12,315,834
Issue date
May 27, 2025
Microsoft Technology Licensing, LLC
Christopher Cantaloube
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
Publication number
20250239500
Publication date
Jul 24, 2025
PANJIT INTERNATIONAL INC.
Chung Hsiung HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239544
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239546
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
Publication number
20250239549
Publication date
Jul 24, 2025
Mitsubishi Electric Corporation
Pierre-Yves PICHON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS
Publication number
20250239551
Publication date
Jul 24, 2025
STMicroelectronics International N.V.
Mohamed BOUFNICHEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
Publication number
20250239489
Publication date
Jul 24, 2025
Siemens Healthineers AG
Michael HOSEMANN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...
Publication number
20250239545
Publication date
Jul 24, 2025
Honeywell International Inc.
Bryan Roger Seppala
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239547
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
Publication number
20250233090
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh HSIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...
Publication number
20250233091
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Adarsh Rajashekhar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
Publication number
20250233095
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jaesic Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
Publication number
20250226342
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsi-Cheng HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250226296
Publication date
Jul 10, 2025
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
Publication number
20250226269
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
MING-CHUNG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
Publication number
20250218990
Publication date
Jul 3, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...
Publication number
20250218891
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Shih Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE OF STACKED DIES
Publication number
20250218987
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Han Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
Publication number
20250218933
Publication date
Jul 3, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGE ASSEMBLY HAVING POST CONNECTS WITH SOLDER-BASED J...
Publication number
20250218991
Publication date
Jul 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Rafael Jose Lizares GUEVARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
Publication number
20250210401
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
Publication number
20250210554
Publication date
Jun 26, 2025
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...
Publication number
20250210590
Publication date
Jun 26, 2025
SD Optics, Inc.
KYUNG PYO HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Publication number
20250210415
Publication date
Jun 26, 2025
WINBOND ELECTRONICS CORP.
Shih-Han Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20250210553
Publication date
Jun 26, 2025
UNITED MICROELECTRONICS CORP.
Yao-Hsien Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250210555
Publication date
Jun 26, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE WITH BOND PAD
Publication number
20250201738
Publication date
Jun 19, 2025
TEXAS INSTRUMENTS INCORPORATED
JEFFREY SOLAS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electroless Deposition Process for Semiconductor Devices
Publication number
20250201740
Publication date
Jun 19, 2025
Wolfspeed, Inc.
Meagan Lenore Coleman
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250201742
Publication date
Jun 19, 2025
RENESAS ELECTRONICS CORPORATION
Takashi TONEGAWA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250201739
Publication date
Jun 19, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS