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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of flip chip package structure
Patent number
12,266,620
Issue date
Apr 1, 2025
Amazing Cool Technology Corp
Shiann-Tsong Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding method
Patent number
12,266,623
Issue date
Apr 1, 2025
SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
Yunzhi Ling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel, method of manufacturing display panel, and display d...
Patent number
12,266,621
Issue date
Apr 1, 2025
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Jinming Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor package
Patent number
12,266,639
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die with solder restraining wall
Patent number
12,266,624
Issue date
Apr 1, 2025
Texas Instruments Incorporated
John Carlo Cruz Molina
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package, method of handling w...
Patent number
12,266,559
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Shiuan Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structure and method for forming the same
Patent number
12,261,137
Issue date
Mar 25, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
12,261,136
Issue date
Mar 25, 2025
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
Yi-Wang Jhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,255,161
Issue date
Mar 18, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
Patent number
12,255,163
Issue date
Mar 18, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
12,255,168
Issue date
Mar 18, 2025
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor between two passivation layers with different etching rates
Patent number
12,255,131
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Ming Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
Patent number
12,255,162
Issue date
Mar 18, 2025
Infineon Technologies Austria AG
Carsten von Koblinski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film structure for bond pad
Patent number
12,249,586
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Julie Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor structure
Patent number
12,249,531
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit substrate structure and manufacturing method thereof
Patent number
12,243,838
Issue date
Mar 4, 2025
Unimicron Technology Corp.
Tzyy-Jang Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
12,243,837
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure havbing an enhanced E-fuse and a method mak...
Patent number
12,243,816
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
An-Jiao Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
12,237,282
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure comprising dummy feature interposed between...
Patent number
12,237,284
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluidic assembly encapsulating light emitting diodes
Patent number
12,230,743
Issue date
Feb 18, 2025
ehux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bumps and method forming same
Patent number
12,230,595
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed package and method of making the same
Patent number
12,230,594
Issue date
Feb 18, 2025
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for registration of circuit dies and electrical interconnects
Patent number
12,224,184
Issue date
Feb 11, 2025
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,224,257
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing same
Patent number
12,218,086
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yongbum Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,218,087
Issue date
Feb 4, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure having molding layer
Patent number
12,218,095
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device And Method Of Manufacturing The Same
Publication number
20250105180
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
Publication number
20250105181
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Jumyong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATE MANUFACTURING METHOD AND LAMINATE
Publication number
20250105205
Publication date
Mar 27, 2025
Resonac Corporation
Yuki IMAZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor structure and alignment method thereof
Publication number
20250105166
Publication date
Mar 27, 2025
UNITED MICROELECTRONICS CORP.
Chiao-Yi Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...
Publication number
20250105207
Publication date
Mar 27, 2025
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250105077
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20250105172
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AN...
Publication number
20250105178
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
MinKi AHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PAD SURFACE LEVELING DEVICE
Publication number
20250105033
Publication date
Mar 27, 2025
Shine Optics Technology Company Limited
KUNG-AN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250105176
Publication date
Mar 27, 2025
Kabushiki Kaisha Toshiba
Teppei TSUKAMOTO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METH...
Publication number
20250096170
Publication date
Mar 20, 2025
SK HYNIX INC.
Byung Ho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
Publication number
20250096168
Publication date
Mar 20, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS
Publication number
20250096190
Publication date
Mar 20, 2025
TOKYO ELECTRON LIMITED
Adam GILDEA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20250087543
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
Publication number
20250087611
Publication date
Mar 13, 2025
QUALCOMM Incorporated
Yujen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
Publication number
20250087612
Publication date
Mar 13, 2025
Samsung Electronics Co., Ltd.
JUNHYUN AN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURES FOR LOW TEMPERATURE DEVICE BONDING
Publication number
20250087616
Publication date
Mar 13, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
Publication number
20250087614
Publication date
Mar 13, 2025
Micron Technology, Inc.
Ko Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
Publication number
20250087581
Publication date
Mar 13, 2025
Infineon Technologies Austria AG
Sergey Yuferev
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
Publication number
20250087648
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250079360
Publication date
Mar 6, 2025
MEDIATEK INC.
Cheng Lin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
Publication number
20250079354
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company Limited
Steven Sze Hang Poon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250079369
Publication date
Mar 6, 2025
Rohm Co., Ltd.
Bungo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20250079376
Publication date
Mar 6, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION
Publication number
20250079388
Publication date
Mar 6, 2025
TEXAS INSTRUMENTS INCORPORATED
JOHN CARLO CRUZ MOLINA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250070078
Publication date
Feb 27, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyun Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND JOINING METHOD
Publication number
20250065440
Publication date
Feb 27, 2025
ROHM CO., LTD.
Kazunori FUJI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250070060
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP
Publication number
20250062254
Publication date
Feb 20, 2025
Shanghai Huali Integrated Circuit Corporation
Tianquan SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
Publication number
20250062263
Publication date
Feb 20, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. SEDDON
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR