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SUBSTRATE BONDING METHOD
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Publication number 20240145416
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Wonyoung CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP SIZE PACKAGE AND SYSTEM
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Publication number 20240128203
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Publication date Apr 18, 2024
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STMicroelectronics Pte Ltd
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Jing-En LUAN
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT STRUCTURE
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Publication number 20240128214
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Publication date Apr 18, 2024
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UNITED MICROELECTRONICS CORP.
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Aaron Chen
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H01 - BASIC ELECTRIC ELEMENTS
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CRUCIFORM BONDING STRUCTURE FOR 3D-IC
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Publication number 20240128216
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Publication date Apr 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hao-Lin Yang
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE
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Publication number 20240120300
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Publication date Apr 11, 2024
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Walton Advanced Engineering, Inc
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HONG-CHI YU
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H01 - BASIC ELECTRIC ELEMENTS
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BONDED STRUCTURES
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Publication number 20240120245
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Publication date Apr 11, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Rajesh Katkar
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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SEMICONDUCTOR PACKAGE
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Publication number 20240120299
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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JIHOON KIM
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H01 - BASIC ELECTRIC ELEMENTS
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