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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/11Manufacturing methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor level interconnection methodologies utilizing 3D interco...
- Patent number 12,272,730
- Issue date Apr 8, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of flip chip package structure
- Patent number 12,266,620
- Issue date Apr 1, 2025
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device with chip to package interconnects from a copper metal in...
- Patent number 12,261,141
- Issue date Mar 25, 2025
- Texas Instruments Incorporated
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal and connection method
- Patent number 12,261,138
- Issue date Mar 25, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jo Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with vertical interc...
- Patent number 12,261,140
- Issue date Mar 25, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 12,243,837
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to control the solder thickness for double sid...
- Patent number 12,243,845
- Issue date Mar 4, 2025
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with bronze material to mitigate undercut
- Patent number 12,237,219
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly encapsulating light emitting diodes
- Patent number 12,230,743
- Issue date Feb 18, 2025
- ehux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bumps and method forming same
- Patent number 12,230,595
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic chips
- Patent number 12,230,602
- Issue date Feb 18, 2025
- STMicroelectronics (Tours) SAS
- Ludovic Fallourd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 12,224,268
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,218,090
- Issue date Feb 4, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 12,211,814
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive member cavities
- Patent number 12,205,871
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 12,207,569
- Issue date Jan 21, 2025
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...
- Publication number 20250113508
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Kronenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH CONNECTION PILLARS
- Publication number 20250105189
- Publication date Mar 27, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR FORMING FIRST PROTECTIVE MEMBRANE, METHOD FOR MANUFACTURI...
- Publication number 20250096173
- Publication date Mar 20, 2025
- LINTEC CORPORATION
- Tomotaka MORISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250096192
- Publication date Mar 20, 2025
- Kore Semiconductor Co., Ltd.
- Ghang-Chun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20250096199
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20250096174
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096181
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Changbo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
- Publication number 20250087611
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
- Publication number 20250087612
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- JUNHYUN AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH CONNECTING PILLARS FOR SINTERING ASSEMBLY
- Publication number 20250087610
- Publication date Mar 13, 2025
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Céline Feautrier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND A...
- Publication number 20250087613
- Publication date Mar 13, 2025
- ams-OSRAM International GmbH
- Fabian KOPP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20250087614
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079360
- Publication date Mar 6, 2025
- MEDIATEK INC.
- Cheng Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079416
- Publication date Mar 6, 2025
- PICO SEMICONDUCTOR INC.
- Yong Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE HAVING A NANOPOROUS BUMP AND CORRE...
- Publication number 20250079367
- Publication date Mar 6, 2025
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
- Publication number 20250079371
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Christopher Glancey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...
- Publication number 20250070067
- Publication date Feb 27, 2025
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND SEMICON...
- Publication number 20250070068
- Publication date Feb 27, 2025
- WINBOND ELECTRONICS CORP.
- Po-Chun SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20250062275
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062281
- Publication date Feb 20, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250054892
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20250056937
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
- Publication number 20250054895
- Publication date Feb 13, 2025
- Sekisui Chemical Co., Ltd
- Taro SHIOJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Manufacturing methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-bump sidewall protection

Transistor level interconnection methodologies utilizing 3D interco...

Manufacturing method of flip chip package structure

Substrate bonding method

IC device with chip to package interconnects from a copper metal in...

Semiconductor package having an encapulant comprising conductive fi...

Terminal and connection method

Stackable fully molded semiconductor structure with vertical interc...

Semiconductor packages with an intermetallic layer

Chip package structure

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Semiconductor device and method

Method and structure to control the solder thickness for double sid...

Contact with bronze material to mitigate undercut

Electronics assemblies employing copper in multiple locations

Fluidic assembly encapsulating light emitting diodes

Metal bumps and method forming same

Wafer chip scale packaging with ball attach before repassivation

Method for manufacturing electronic chips

Fan-out packages providing enhanced mechanical strength and methods...

Semiconductor packaging method, semiconductor assembly and electron...

Passivation structure with planar top surfaces

Barrier structures between external electrical connectors

Semiconductor interconnect structures with conductive elements, and...

Conductive member cavities

Microwave integrated quantum circuits with cap wafers and their met...

Semiconductor device and method of fabricating the same

Multi-die package structures including redistribution layers

Patents Applicationslast 30 patents

Method for Forming Semiconductor Package and Semiconductor Package

WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...

Power, Signaling and Thermal Path Co-optimization

ELECTRONIC CHIP WITH CONNECTION PILLARS

SHEET FOR FORMING FIRST PROTECTIVE MEMBRANE, METHOD FOR MANUFACTURI...

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...

ELECTRONIC CHIP WITH CONNECTING PILLARS FOR SINTERING ASSEMBLY

SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND A...

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

METHOD FOR PRODUCING A SUBSTRATE HAVING A NANOPOROUS BUMP AND CORRE...

SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...

ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND SEMICON...

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...