Manufacturing methods

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H01L24/11

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/11Manufacturing methods

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,368,079
- Issue date Jul 22, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,368,132
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,368,124
- Issue date Jul 22, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition and photosensitive resin multilaye...
- Patent number 12,353,130
- Issue date Jul 8, 2025
- Asahi Kasei Kabushiki Kaisha
- Tonami Tajiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First layer interconnect first on carrier approach for EMIB patch
- Patent number 12,354,992
- Issue date Jul 8, 2025
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine-pitch joining pad structure
- Patent number 12,354,983
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thinning a semiconductor die
- Patent number 12,341,130
- Issue date Jun 24, 2025
- Western Digital Technologies, Inc.
- Meiqin Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 12,315,834
- Issue date May 27, 2025
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar, method for manufacturing the same, and method fo...
- Patent number 12,293,983
- Issue date May 6, 2025
- DIC Corporation
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,293,952
- Issue date May 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pitch ball grid array
- Patent number 12,288,741
- Issue date Apr 29, 2025
- Juniper Networks, Inc.
- Granthana Kattehalli Rangaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly having post connects with solder-based j...
- Patent number 12,288,763
- Issue date Apr 29, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 12,288,758
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250239516
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kana ISERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS
- Publication number 20250239551
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250239561
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT REWORK METHOD AND DEVICE
- Publication number 20250233101
- Publication date Jul 17, 2025
- Innostar Service Inc.
- Chih-Meng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250226342
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226343
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226344
- Publication date Jul 10, 2025
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250218993
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER COMPOSITION, METHOD OF PREPARING THE SAME, AND METHOD OF MAN...
- Publication number 20250214181
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Yuho Won
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250219001
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JongTae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY HAVING POST CONNECTS WITH SOLDER-BASED J...
- Publication number 20250218991
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250210415
- Publication date Jun 26, 2025
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER
- Publication number 20250201748
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari Austria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR LEVEL INTERCONNECTION METHODOLOGIES UTILIZING 3D INTERCO...
- Publication number 20250204006
- Publication date Jun 19, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...
- Publication number 20250201751
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250183204
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS
- Publication number 20250174590
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- HIROSHI FUSE
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing electronic device

Package structure including stacked pillar portions and method for...

Joint structure in semiconductor package and manufacturing method t...

Electronic package comprising conductive layer connected electrode...

Method for forming semiconductor package and semiconductor package

Fan out package with integrated peripheral devices and methods

Thermocompression bonding with passivated silver-based contacting m...

Thermocompression bonding with passivated gold contacting metal

Cobalt based interconnects and methods of fabrication thereof

Photosensitive resin composition and photosensitive resin multilaye...

First layer interconnect first on carrier approach for EMIB patch

Fine-pitch joining pad structure

Thermocompression bonding with passivated tin-based contacting metal

Semiconductor device structure with a protection cap at an end port...

Method of thinning a semiconductor die

Forming recesses in molding compound of wafer to reduce stress

Semiconductor structure having copper pillar within solder bump and...

Chip packaging structure and related inner lead bonding method

Device and method for UBM/RDL routing

Passivation layers with rounded corners

Electroplated indium bump stacks for cryogenic electronics

Interconnection structure of a semiconductor chip having pads of di...

Package structure and method of fabricating the same

Conductive pillar, method for manufacturing the same, and method fo...

Integrated circuit package and method of forming same

Electronic package and manufacturing method thereof

Multi-pitch ball grid array

Flip chip package assembly having post connects with solder-based j...

Polyimide profile control

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

ELECTRONIC COMPONENT REWORK METHOD AND DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

Semiconductor Device and Method of Making a Molded IPD-CoW

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

ELECTRONIC DEVICE

CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SOLDER COMPOSITION, METHOD OF PREPARING THE SAME, AND METHOD OF MAN...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FLIP CHIP PACKAGE ASSEMBLY HAVING POST CONNECTS WITH SOLDER-BASED J...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER

TRANSISTOR LEVEL INTERCONNECTION METHODOLOGIES UTILIZING 3D INTERCO...

IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

Semiconductor Device and Method

SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS