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SEMICONDUCTOR PACKAGES
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Publication number 20240162181
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Publication date May 16, 2024
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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FLIP CHIP PACKAGE ASSEMBLY
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Publication number 20240153903
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Publication date May 9, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Katleen Fajardo Timbol
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240145418
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Junghoo Yun
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-CHIP PACKAGING
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Publication number 20240128256
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Publication date Apr 18, 2024
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Intel Corporation
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Robert L. Sankman
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP STRUCTURE
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Publication number 20240120277
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Publication date Apr 11, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hong-Seng SHUE
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H01 - BASIC ELECTRIC ELEMENTS
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HETEROGENEOUS SOLDER BUMP STRUCTURE
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Publication number 20240113060
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Publication date Apr 4, 2024
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Societe de commercialisation des produits de la recherche appliquee SOCPRA Sc...
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Abderrahim EL AMRANI
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
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Publication number 20240113066
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Publication date Apr 4, 2024
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Sony Semiconductor Solutions Corporation
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Takashi IMAHIGASHI
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H01 - BASIC ELECTRIC ELEMENTS
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