Manufacturing methods

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H01L2224/27

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27Manufacturing methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining material, production method for joining material, and joine...
- Patent number 12,257,622
- Issue date Mar 25, 2025
- Senju Metal Industry Co., Ltd.
- Jinting Jiu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,243,844
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus with parallel first and second parts o...
- Patent number 12,217,986
- Issue date Feb 4, 2025
- Screen Semiconductor Solutions Co., Ltd.
- Hiroyuki Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing electronic component
- Patent number 12,191,278
- Issue date Jan 7, 2025
- CONNECTEC AMERICA, INC.
- Katsunori Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
- Patent number 12,094,849
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,082,350
- Issue date Sep 3, 2024
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film adhesive
- Patent number 12,053,934
- Issue date Aug 6, 2024
- Ormet Circuits, Inc.
- Catherine A. Shearer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250118697
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT IN...
- Publication number 20250105195
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOHN CARLO MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS
- Publication number 20250105089
- Publication date Mar 27, 2025
- Diamond Foundry Inc.
- Jeroen Van Duren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
- Publication date Mar 20, 2025
- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250096185
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20250084286
- Publication date Mar 13, 2025
- OSAKA SODA CO., LTD.
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250079414
- Publication date Mar 6, 2025
- Universal Global Technology (Kunshan) Co., Ltd.
- KUO-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250079395
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT ELECTRICAL INTERCONNECT ARRAYS USING COPPER NANO-WIRES (C...
- Publication number 20250079384
- Publication date Mar 6, 2025
- Board of Trustees of the University of Arkansas
- David Huitink
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20250079401
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
- Publication number 20250054895
- Publication date Feb 13, 2025
- Sekisui Chemical Co., Ltd
- Taro SHIOJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038056
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive coupling in a direct-bonded interface for microelectroni...

Method of manufacturing substrate layered body and layered body

Joining material, production method for joining material, and joine...

Electronic device with multi-layer contact and system

Semiconductor structure and forming method thereof

Packaged electronic device with film isolated power stack

Display device and method of manufacturing the same

Circuits including micropatterns and using partial curing to adhere...

Substrate treating apparatus with parallel first and second parts o...

Semiconductor package and method for fabricating a semiconductor pa...

Selective micro device transfer to receiver substrate

Method for manufacturing electronic component

Method of manufacturing an electronic device

Dicing die attach film, and semiconductor package using the same an...

Bonding member, method for producing bonding member and method for...

Bonding structures of integrated circuit devices and method forming...

Bridge interconnection with layered interconnect structures

Die on die bonding structure

Low pressure sintering powder

Method of forming semiconductor packages having through package vias

Connection structure and manufacturing method therefor

Atomic layer deposition bonding layer for joining two semiconductor...

Molded packaging for wide band gap semiconductor devices

Semiconductor device

Selective transfer of micro devices

Non-conductive film sheet and semiconductor package including the same

Conductive film adhesive

Integrated circuit packages

Contact and die attach metallization for silicon carbide based devi...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT IN...

HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

HIGH-PRECISION HETEROGENEOUS INTEGRATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

ELECTRONIC COMPONENT

THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES

ELECTROCONDUCTIVE ADHESIVE

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

COMPLIANT ELECTRICAL INTERCONNECT ARRAYS USING COPPER NANO-WIRES (C...

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

Heat Dissipating Structure and Methods of Forming The Same

SEMICONDUCTOR PACKAGE

Advanced Device Assembly Structures And Methods

Manufacturing method of a system in package having several layers a...

Submounts with Stud Protrusions for Semiconductor Packages

Reducing warpage in a package of stacked integrated circuit dies

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

UNDERFILL MATERIAL

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

3D-INTERCONNECT

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES