Marking devices

Industry

CPC
H01L21/67282

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67282Marking devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing system and method for dicing semiconductor structure i...
- Patent number 12,106,985
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Template, manufacturing method of template, and manufacturing metho...
- Patent number 12,087,604
- Issue date Sep 10, 2024
- Kioxia Corporation
- Kazuhiro Takahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable and wire bondable part marking
- Patent number 12,021,038
- Issue date Jun 25, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with circuit-locating mechanism
- Patent number 11,967,390
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-operation tool for photovoltaic cell processing
- Patent number 11,955,577
- Issue date Apr 9, 2024
- Maxeon Solar Pte. Ltd.
- Nathan Phillips Beckett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die-level unique authentication and serialization of sem...
- Patent number 11,862,497
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
- Patent number 11,804,411
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mark printing device and method of printing mark using the same
- Patent number 11,791,187
- Issue date Oct 17, 2023
- Semes Co., Ltd.
- Gon Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High registration particles-transferring system
- Patent number 11,732,362
- Issue date Aug 22, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Front surface and back surface orientation detection of transparent...
- Patent number 11,728,191
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Michelle Alejandra Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer notch leveling device
- Patent number 11,721,570
- Issue date Aug 8, 2023
- Sanwa Engineering Corp.
- Min-Chih Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
- Patent number 11,652,009
- Issue date May 16, 2023
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser marking device and laser marking method
- Patent number 11,621,184
- Issue date Apr 4, 2023
- EO Technics Co., LTD
- Sung Beom Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for lithographically forming wafer identification marks a...
- Patent number 11,562,968
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with circuit-locating mechanism
- Patent number 11,551,777
- Issue date Jan 10, 2023
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 11,538,787
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dividing apparatus including an imaging unit for detecting defects...
- Patent number 11,476,137
- Issue date Oct 18, 2022
- Disco Corporation
- Hironari Ohkubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anchoring dies using 3D printing to form reconstructed wafer
- Patent number 11,329,003
- Issue date May 10, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of adhesive residue on a wafer
- Patent number 11,309,196
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Robert Muhr
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer table with dynamic support pins
- Patent number 11,302,566
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hung Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,267,237
- Issue date Mar 8, 2022
- Kioxia Corporation
- Hayato Terai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection system and method for inspecting semiconductor package,...
- Patent number 11,257,723
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Do-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method and cutting apparatus
- Patent number 11,217,466
- Issue date Jan 4, 2022
- Disco Corporation
- Yunfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer table with dynamic support pins
- Patent number 11,217,475
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hung Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and manufacturing process
- Patent number 11,189,610
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing apparatus
- Patent number 11,177,148
- Issue date Nov 16, 2021
- Disco Corporation
- Tsutomu Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for die-level unique authentication and serialization of sem...
- Patent number 11,133,206
- Issue date Sep 28, 2021
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate, laminated substrate, laminated substrate manufactu...
- Patent number 11,133,215
- Issue date Sep 28, 2021
- AGC Inc.
- Yu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for characterization of an x-ray beam with high...
- Patent number 11,073,487
- Issue date Jul 27, 2021
- KLA-Tencor Corporation
- Alexander Bykanov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING
- Publication number 20240387222
- Publication date Nov 21, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Solder Mask Having Curved Sidewalls Interact...
- Publication number 20240332048
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Thomas Kristl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20240312926
- Publication date Sep 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MARKING METHOD, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEV...
- Publication number 20240274452
- Publication date Aug 15, 2024
- Shin-Etsu Handotai Co., Ltd.
- Kazunori HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH CIRCUIT-LOCATING MECHANISM
- Publication number 20240265990
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE...
- Publication number 20240231234
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Yasuhiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE ONE-TIME WAFER IDENTIFICATION IN SPLIT MANUFACTURING
- Publication number 20240170313
- Publication date May 23, 2024
- International Business Machines Corporation
- Carl Radens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
- Publication number 20240105538
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SangHo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20230366093
- Publication date Nov 16, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230138460
- Publication date May 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Che-Ting LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION DEVICE AND INSPECTION METHOD
- Publication number 20230113051
- Publication date Apr 13, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH CIRCUIT-LOCATING MECHANISM
- Publication number 20230087823
- Publication date Mar 23, 2023
- Micron Technology, Inc.
- Itamar Lavy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20230073693
- Publication date Mar 9, 2023
- Disco Corporation
- Tsubasa OBATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE ROLL AND TAPE MOUNTER
- Publication number 20230010011
- Publication date Jan 12, 2023
- Disco Corporation
- Yoshinori KAKINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20220399280
- Publication date Dec 15, 2022
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER MACHINING APPARATUS AND LASER MACHINING METHOD
- Publication number 20220384219
- Publication date Dec 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Heung Yeol NA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRONT OPENING UNIFIED POD, WAFER TRANSFER SYSTEM AND WAFER TRANSFER...
- Publication number 20220351996
- Publication date Nov 3, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yanbin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING SYSTEM AND METHOD FOR DICING SEMICONDUCTOR STRUCTURE
- Publication number 20220319888
- Publication date Oct 6, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Liquan CAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPLATE, MANUFACTURING METHOD OF TEMPLATE, AND MANUFACTURING METHO...
- Publication number 20220301908
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Kazuhiro TAKAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...
- Publication number 20220238395
- Publication date Jul 28, 2022
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL PROCESSING METHOD AND MATERIAL PROCESSING SYSTEM FOR PERFO...
- Publication number 20220193819
- Publication date Jun 23, 2022
- CARL ZEISS MICROSCOPY GMBH
- Stephan Hiller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-Based Method and System for Marking a Workpiece
- Publication number 20220186356
- Publication date Jun 16, 2022
- JVIS-USA, LLC
- Shawn Murray
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220139872
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Che-Ting LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20220118547
- Publication date Apr 21, 2022
- Disco Corporation
- Hironari OHKUBO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Notch Leveling Device
- Publication number 20220028717
- Publication date Jan 27, 2022
- Sanwa Engineering Corp.
- Min-Chih Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE, LAMINATED SUBSTRATE, LAMINATED SUBSTRATE MANUFACTU...
- Publication number 20210366760
- Publication date Nov 25, 2021
- AGC Inc.
- Yu Hanawa
- B32 - LAYERED PRODUCTS
Information Patent Application
FRONT SURFACE AND BACK SURFACE ORIENTATION DETECTION OF TRANSPARENT...
- Publication number 20210351050
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Michelle Alejandra Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...
- Publication number 20210351053
- Publication date Nov 11, 2021
- TOKYO ELECTRON LIMITED
- H. Jim FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Method and System for Marking a Workpiece
- Publication number 20210285084
- Publication date Sep 16, 2021
- JVIS-USA, LLC
- Shawn Murray
- H01 - BASIC ELECTRIC ELEMENTS

Marking devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for manufacturing a semiconductor package structure

Laser dicing system and method for dicing semiconductor structure i...

Template, manufacturing method of template, and manufacturing metho...

Solderable and wire bondable part marking

Apparatus with circuit-locating mechanism

Multi-operation tool for photovoltaic cell processing

Method for die-level unique authentication and serialization of sem...

Secure inspection and marking of semiconductor wafers for trusted m...

Mark printing device and method of printing mark using the same

High registration particles-transferring system

Front surface and back surface orientation detection of transparent...

Wafer notch leveling device

Secure inspection and marking of semiconductor wafers for trusted m...

Laser marking device and laser marking method

Apparatus for lithographically forming wafer identification marks a...

Apparatus with circuit-locating mechanism

Method and system for manufacturing a semiconductor package structure

Dividing apparatus including an imaging unit for detecting defects...

Anchoring dies using 3D printing to form reconstructed wafer

Detection of adhesive residue on a wafer

Wafer table with dynamic support pins

Substrate bonding apparatus

Inspection system and method for inspecting semiconductor package,...

Wafer processing method and cutting apparatus

Wafer table with dynamic support pins

Substrate structure and manufacturing process

Laser processing apparatus

Method for die-level unique authentication and serialization of sem...

Glass substrate, laminated substrate, laminated substrate manufactu...

Methods and systems for characterization of an x-ray beam with high...

Patents Applicationslast 30 patents

PROCESSING METHOD AND PROCESSING SYSTEM

METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING

Component Carrier With Solder Mask Having Curved Sidewalls Interact...

SOLDERABLE AND WIRE BONDABLE PART MARKING

WAFER MARKING METHOD, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEV...

APPARATUS WITH CIRCUIT-LOCATING MECHANISM

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE...

SECURE ONE-TIME WAFER IDENTIFICATION IN SPLIT MANUFACTURING

METHOD FOR MAKING AN ELECTRONIC PACKAGE

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE

INSPECTION DEVICE AND INSPECTION METHOD

APPARATUS WITH CIRCUIT-LOCATING MECHANISM

LASER PROCESSING APPARATUS

TAPE ROLL AND TAPE MOUNTER

SOLDERABLE AND WIRE BONDABLE PART MARKING

LASER MACHINING APPARATUS AND LASER MACHINING METHOD

FRONT OPENING UNIFIED POD, WAFER TRANSFER SYSTEM AND WAFER TRANSFER...

LASER DICING SYSTEM AND METHOD FOR DICING SEMICONDUCTOR STRUCTURE

TEMPLATE, MANUFACTURING METHOD OF TEMPLATE, AND MANUFACTURING METHO...

SECURE INSPECTION AND MARKING OF SEMICONDUCTOR WAFERS FOR TRUSTED M...

MATERIAL PROCESSING METHOD AND MATERIAL PROCESSING SYSTEM FOR PERFO...

Laser-Based Method and System for Marking a Workpiece

METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE

LASER PROCESSING APPARATUS

Wafer Notch Leveling Device

GLASS SUBSTRATE, LAMINATED SUBSTRATE, LAMINATED SUBSTRATE MANUFACTU...

FRONT SURFACE AND BACK SURFACE ORIENTATION DETECTION OF TRANSPARENT...

METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...

Laser-Based Method and System for Marking a Workpiece