Marking

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CPC
B81C99/007

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C99/00Subject matter not provided for in other groups of this subclass

Current Industry

B81C99/007Marking

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Patents Grantslast 30 patents

Information Patent Grant
Plate
- Patent number 11,970,681
- Issue date Apr 30, 2024
- Ushio Denki Kabushiki Kaisha
- Daisuke Nomoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment mark and semiconductor device, and fabrication methods th...
- Patent number 11,049,816
- Issue date Jun 29, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component especially for horology with surface topology and method...
- Patent number 10,981,783
- Issue date Apr 20, 2021
- Nivarox-Far S.A.
- Alex Gandelhman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of arranging a plurality of semiconductor structural element...
- Patent number 10,381,311
- Issue date Aug 13, 2019
- Osram Opto Semiconductors GmbH
- Tobias Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment pattern for package singulation
- Patent number 10,163,807
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ju Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methodology and system for wafer-level testing of MEMS pressure sen...
- Patent number 9,527,731
- Issue date Dec 27, 2016
- NXP USA, INC.
- Bruno J. Debeurre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure
- Patent number 8,796,058
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Russell T. Herrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of aligning structures on opposite sides of a wafer
- Patent number 6,555,441
- Issue date Apr 29, 2003
- Dalsa Semiconductor Inc.
- Luc Ouellet
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280527
- Publication date Sep 9, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLATE
- Publication number 20210253988
- Publication date Aug 19, 2021
- Ushio Denki Kabushiki Kaisha
- Daisuke Nomoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...
- Publication number 20200161251
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ARRANGING A PLURALITY OF SEMICONDUCTOR STRUCTURAL ELEMENT...
- Publication number 20180247896
- Publication date Aug 30, 2018
- Osram Opto Semiconductors GmbH
- Tobias MEYER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODOLOGY AND SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SEN...
- Publication number 20160107887
- Publication date Apr 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- BRUNO J. DEBEURRE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING MAGNETICALLY ACTUATED ARTIFICIAL CILIA
- Publication number 20150097317
- Publication date Apr 9, 2015
- National Taiwan University of Science and Technology
- Chia-Yuan Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20130105920
- Publication date May 2, 2013
- International Business Machines Corporation
- Russell T. HERRIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of aligning structures on opposite sides of a wafer
- Publication number 20030032299
- Publication date Feb 13, 2003
- Luc Ouellet
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plate

Package-on-package (POP) type semiconductor packages

Alignment mark and semiconductor device, and fabrication methods th...

Component especially for horology with surface topology and method...

Method of arranging a plurality of semiconductor structural element...

Alignment pattern for package singulation

Methodology and system for wafer-level testing of MEMS pressure sen...

Semiconductor structure

Method of aligning structures on opposite sides of a wafer

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

PLATE

ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...

METHOD OF ARRANGING A PLURALITY OF SEMICONDUCTOR STRUCTURAL ELEMENT...

METHODOLOGY AND SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SEN...

METHOD OF FABRICATING MAGNETICALLY ACTUATED ARTIFICIAL CILIA

SEMICONDUCTOR STRUCTURE

Method of aligning structures on opposite sides of a wafer