PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS

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Patents Grantslast 30 patents

Information Patent Grant
Resonance device with substrate having oxide film containing throug...
- Patent number 12,365,583
- Issue date Jul 22, 2025
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for electronic device packaging
- Patent number 12,365,584
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a microstructured surface
- Patent number 12,365,585
- Issue date Jul 22, 2025
- The Regents of the University of California
- Muchen Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems, devices, and/or methods for images
- Patent number 12,365,619
- Issue date Jul 22, 2025
- Dylan Kelley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of glass cells for hermetic gas enclosures
- Patent number 12,366,831
- Issue date Jul 22, 2025
- mb-microtec ag
- Serge Lukas Zihlmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Compact enhanced sensitivity temperature sensor using an encapsulat...
- Patent number 12,365,580
- Issue date Jul 22, 2025
- King Fahd University of Petroleum & Minerals
- Xuecui Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temperature controllable bonder equipment for substrate bonding
- Patent number 12,368,129
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 12,358,783
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cross-scale structure feature surface machining method based on mul...
- Patent number 12,360,508
- Issue date Jul 15, 2025
- Harbin Institute Of Technology
- Yang Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a microstructure
- Patent number 12,358,784
- Issue date Jul 15, 2025
- MEMSSTAR LIMITED
- Anthony O'Hara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Comb electrode release process for MEMS structure
- Patent number 12,358,785
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Contact-type vibration photon sensor using Doppler effect and manuf...
- Patent number 12,359,963
- Issue date Jul 15, 2025
- OTN INTELLIGENT TECHNOLOGY (SUZHOU) CO., LTD
- Xiaohai Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for ultrasonic fabrication and sealing of microfluidics
- Patent number 12,358,786
- Issue date Jul 15, 2025
- NATIONAL CENTRE FOR SCIENTIFIC RESEARCH “DEMOKRITOS”
- Evangelos Gogolides
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of MEMS structures from fused silica for inertial sensors
- Patent number 12,351,451
- Issue date Jul 8, 2025
- Atlantic Inertial Systems Limited
- Christopher Paul Fell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attachment method for microfluidic device
- Patent number 12,350,662
- Issue date Jul 8, 2025
- Peter C. Lord
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducer and method of manufa...
- Patent number 12,350,710
- Issue date Jul 8, 2025
- Vermon S.A.
- Dominique Gross
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS with small-molecule barricade
- Patent number 12,351,452
- Issue date Jul 8, 2025
- SiTime Corporation
- Charles I. Grosjean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Liquid crystal diffractive devices with nano-scale pattern and meth...
- Patent number 12,353,101
- Issue date Jul 8, 2025
- Magic Leap, Inc.
- Chulwoo Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of fabricating semiconductor structures including cavities...
- Patent number 12,344,524
- Issue date Jul 1, 2025
- Soitec
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method of manufacturing the device
- Patent number 12,343,979
- Issue date Jul 1, 2025
- Canon Kabushiki Kaisha
- Noriyuki Nakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical infrared sensing device and fabrication meth...
- Patent number 12,345,571
- Issue date Jul 1, 2025
- Industrial Technology Research Institute
- Chin-Jou Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor structure, pressure sensor device, and method of ma...
- Patent number 12,345,593
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Kaoru Kishigui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Externally grounded printed circuit board
- Patent number 12,349,266
- Issue date Jul 1, 2025
- Knowles Electronics, LLC
- Joshua Watson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sealed force sensor with etch stop layer
- Patent number 12,332,127
- Issue date Jun 17, 2025
- NEXTINPUT, INC.
- Julius Minglin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection for monolithically integrated stacked devices and m...
- Patent number 12,330,189
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES SINGAPOREPTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 12,332,271
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded permeable polysilicon layer in MEMS device for multiple ca...
- Patent number 12,330,934
- Issue date Jun 17, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Federico Vercesi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric sensor with increased sensitivity and devices having...
- Patent number 12,329,033
- Issue date Jun 10, 2025
- Skyworks Solutions, Inc.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with out-of-plane stopper structure
- Patent number 12,325,628
- Issue date Jun 10, 2025
- STMicroelectronics S.r.l.
- Luca Guerinoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BOND FORCE CONCENTRATOR
- Publication number 20250236512
- Publication date Jul 24, 2025
- KYOCERA Technologies Oy
- Elmeri ÖSTERLUND
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-ELECTROMECHANICAL MICROPHONES AND METHODS OF FORMING THE SAME
- Publication number 20250240578
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES
- Publication number 20250239488
- Publication date Jul 24, 2025
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Alfons Dehé
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20250236506
- Publication date Jul 24, 2025
- Nanusens SL
- Josep Montanyà i Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALL-SILICON CARBIDE (SiC) ACCELERATION-PRESSURE INTEGRATED SENSOR C...
- Publication number 20250236507
- Publication date Jul 24, 2025
- XI'AN JIAOTONG UNIVERSITY
- Xudong FANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inertial Sensor And Electronic Component
- Publication number 20250236511
- Publication date Jul 24, 2025
- SEIKO EPSON CORPORATION
- Tomonaga KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS cavity with non-contaminating seal
- Publication number 20250236513
- Publication date Jul 24, 2025
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHEMICAL STOP STRUCTURES FOR MEMS DEVICES
- Publication number 20250236514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ko-Li Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES
- Publication number 20250236509
- Publication date Jul 24, 2025
- Microsoft Technology Licensing, LLC
- Di SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIERARCHICAL WAVY STRUCTURED SURFACES AND METHOD OF MAKING THEREOF
- Publication number 20250236510
- Publication date Jul 24, 2025
- University of Massachusetts
- Tingyi Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250230037
- Publication date Jul 17, 2025
- Vanguard International Semiconductor Corporation
- ROHIT PULIKKAL KIZHAKKEYIL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250230038
- Publication date Jul 17, 2025
- Vanguard International Semiconductor Corporation
- ROHIT PULIKKAL KIZHAKKEYIL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL CONTACTS USING AN ARRAY OF MICROMACHINED FLEXURES
- Publication number 20250233327
- Publication date Jul 17, 2025
- Atomic Machines, Inc.
- Fabian Goericke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...
- Publication number 20250229292
- Publication date Jul 17, 2025
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250230036
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-TUAN LO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM
- Publication number 20250230039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yu Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250223153
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hsun LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Flexible Microelectrode Arrays
- Publication number 20250213160
- Publication date Jul 3, 2025
- Nikon Corporation
- Wan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
USE OF MEMS PACKAGES AS ANTENNA SUBSTRATE
- Publication number 20250214832
- Publication date Jul 3, 2025
- Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...
- Publication number 20250214108
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NANO ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250206596
- Publication date Jun 26, 2025
- Seoul National University R&DB Foundation
- Woo Young CHOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL STRESS-SENSITIVE DEVICE
- Publication number 20250197194
- Publication date Jun 19, 2025
- Rosemount Aerospace Inc.
- John C. Christenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING PROCESS FOR MICROELECTROMECHANICAL DEVICES HAVING IMP...
- Publication number 20250197198
- Publication date Jun 19, 2025
- STMicroelectronics International N.V.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE
- Publication number 20250199414
- Publication date Jun 19, 2025
- ROBERT BOSCH GmbH
- Ralf NOLTEMEYER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH CHAMB...
- Publication number 20250197199
- Publication date Jun 19, 2025
- STMicroelectronics International N.V.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE
- Publication number 20250197196
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Emre TOPAL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PATTERNING WITHIN MEMS LAYER
- Publication number 20250197192
- Publication date Jun 19, 2025
- InvenSense, Inc.
- Sarah Nitzan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250197195
- Publication date Jun 19, 2025
- AAC TECHNOLOGIES PTE. LTD
- Veronica Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ANALYSIS DEVICES AND RELATED FABRICATION METHODS AND ANA...
- Publication number 20250197197
- Publication date Jun 19, 2025
- BIONANO GENOMICS, INC.
- Han Cao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20250187907
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Resonance device with substrate having oxide film containing throug...

Methods and apparatus for electronic device packaging

MEMS resonator integrated cicruit fabrication

Method of forming a microstructured surface

Systems, devices, and/or methods for images

Fabrication of glass cells for hermetic gas enclosures

Compact enhanced sensitivity temperature sensor using an encapsulat...

Temperature controllable bonder equipment for substrate bonding

Wire-bond damper for shock absorption

Cross-scale structure feature surface machining method based on mul...

Method of manufacturing a microstructure

Comb electrode release process for MEMS structure

Contact-type vibration photon sensor using Doppler effect and manuf...

Methods for ultrasonic fabrication and sealing of microfluidics

Fabrication of MEMS structures from fused silica for inertial sensors

Attachment method for microfluidic device

Capacitive micromachined ultrasonic transducer and method of manufa...

MEMS with small-molecule barricade

Liquid crystal diffractive devices with nano-scale pattern and meth...

Methods of fabricating semiconductor structures including cavities...

Device and method of manufacturing the device

Microelectromechanical infrared sensing device and fabrication meth...

Pressure sensor structure, pressure sensor device, and method of ma...

Externally grounded printed circuit board

Sealed force sensor with etch stop layer

Interconnection for monolithically integrated stacked devices and m...

Capacitive microelectromechanical device and method for forming a c...

Embedded permeable polysilicon layer in MEMS device for multiple ca...

Piezoelectric sensor with increased sensitivity and devices having...

Microelectromechanical device with out-of-plane stopper structure

Patents Applicationslast 30 patents

BOND FORCE CONCENTRATOR

MICRO-ELECTROMECHANICAL MICROPHONES AND METHODS OF FORMING THE SAME

HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

ALL-SILICON CARBIDE (SiC) ACCELERATION-PRESSURE INTEGRATED SENSOR C...

Inertial Sensor And Electronic Component

MEMS cavity with non-contaminating seal

CHEMICAL STOP STRUCTURES FOR MEMS DEVICES

MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES

HIERARCHICAL WAVY STRUCTURED SURFACES AND METHOD OF MAKING THEREOF

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

ELECTRICAL CONTACTS USING AN ARRAY OF MICROMACHINED FLEXURES

ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

Flexible Microelectrode Arrays

USE OF MEMS PACKAGES AS ANTENNA SUBSTRATE

SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...

NANO ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL STRESS-SENSITIVE DEVICE

MANUFACTURING PROCESS FOR MICROELECTROMECHANICAL DEVICES HAVING IMP...

MICROELECTROMECHANICAL DEVICE

PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH CHAMB...

PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE

ANTI-STICTION PATTERNING WITHIN MEMS LAYER

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED ANALYSIS DEVICES AND RELATED FABRICATION METHODS AND ANA...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE