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METHODS FOR WAFER BONDING
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Publication number 20250154000
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Publication date May 15, 2025
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TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chien-Wei CHANG
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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MEMS ELEMENT
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Publication number 20250145450
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Publication date May 8, 2025
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Nisshinbo Micro Devices Inc.
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Yoshimitsu Kuromaru
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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OPTICAL MICROPHONE ASSEMBLY
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Publication number 20250150763
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Publication date May 8, 2025
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SensiBel AS
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Matthieu LaColle
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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ANTI-STICTION LAYER DEPOSITION
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Publication number 20250145448
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Publication date May 8, 2025
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SPTS TECHNOLOGIES LIMITED
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Michael Grimes
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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MEMS ELEMENT
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Publication number 20250145449
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Publication date May 8, 2025
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Nisshinbo Micro Devices Inc.
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Takao Fukutome
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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ELECTRONIC DEVICE
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Publication number 20250142966
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Publication date May 1, 2025
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AUO Corporation
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Wei Ting Liu
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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MEMS DIE AND MEMS-BASED SENSOR
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Publication number 20250136433
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Publication date May 1, 2025
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KNOWLES ELECTRONICS, LLC
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Michael Pedersen
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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MEMS SWITCH AND ELECTRONIC DEVICE
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Publication number 20250136434
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Publication date May 1, 2025
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Beijing BOE Technology Development Co., Ltd.
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Yingli SHI
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Membrane Device Fabrication
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Publication number 20250136437
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Publication date May 1, 2025
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X-FAB Global Services GmbH
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Yves Dufour
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B81 - MICRO-STRUCTURAL TECHNOLOGY