Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof

Industry

CPC
H05K2203/0186

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0186Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Printing device, solder management system, and printing managing me...
- Patent number 10,773,326
- Issue date Sep 15, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuji Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board interconnect decals
- Patent number 10,743,419
- Issue date Aug 11, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board interconnect decals
- Patent number 10,531,568
- Issue date Jan 7, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless telemetry electronic circuit board for high temperature en...
- Patent number 8,525,036
- Issue date Sep 3, 2013
- SIEMENS ENERGY, INC.
- David J. Mitchell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit for high temperature and high g-...
- Patent number 8,458,899
- Issue date Jun 11, 2013
- SIEMENS ENERGY, INC.
- David J. Mitchell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal display module
- Patent number 8,149,349
- Issue date Apr 3, 2012
- Samsung Electronics Co., Ltd.
- Ji-Hwan Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless telemetry electronic circuit board for high temperature en...
- Patent number 8,023,269
- Issue date Sep 20, 2011
- SIEMENS ENERGY, INC.
- David J. Mitchell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode assembly and light emitting diode display device
- Patent number 7,897,983
- Issue date Mar 1, 2011
- Foxsemicon Intergrated Technology, Inc.
- Kun-Sheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode assembly and light emitting diode display device
- Patent number 7,728,337
- Issue date Jun 1, 2010
- Foxsemicon Integrated Technology, Inc.
- Kun-Sheng Kuo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Smart card and method for manufacturing a smart card
- Patent number 7,237,724
- Issue date Jul 3, 2007
- Robert Singleton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing system using solder self-alignment with optical compo...
- Patent number 6,543,114
- Issue date Apr 8, 2003
- Axsun Technologies, Inc.
- Walid A. Atia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for verification of assembled printed circuit...
- Patent number 6,489,586
- Issue date Dec 3, 2002
- Cad-Tech, Inc.
- Abimael Corral
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for verification of assembled printed circuit boards
- Patent number 6,429,401
- Issue date Aug 6, 2002
- Cad-Tech, Inc.
- Abimael Corral
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting circuit components on a flexible substrate
- Patent number 5,898,992
- Issue date May 4, 1999
- Pressac Limited
- Garth Annable
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment method and apparatus for mounting electronic components
- Patent number 5,895,554
- Issue date Apr 20, 1999
- Thomas A. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for connecting integrated circuit dies to a printed wiring b...
- Patent number 5,109,320
- Issue date Apr 28, 1992
- Westinghouse Electric Corp.
- Robert A. Bourdelaise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component location device and method for surface-mount printed circ...
- Patent number 4,985,107
- Issue date Jan 15, 1991
- SCI Systems, Inc.
- Walter J. Conroy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless printed wiring board module and multi-module assembly
- Patent number 4,933,808
- Issue date Jun 12, 1990
- Westinghouse Electric Corp.
- Roald N. Horton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering component on printed circuit board
- Patent number 4,735,354
- Issue date Apr 5, 1988
- Toyo Electronics Corp.
- Kinsaku Yagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask and solder form
- Patent number 4,728,022
- Issue date Mar 1, 1988
- Hughes Aircraft Company
- John W. Jamison
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jigs for locating electrical components
- Patent number 4,582,309
- Issue date Apr 15, 1986
- Plessey Overseas Limited
- Michael Moxon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount component
- Patent number 4,542,439
- Issue date Sep 17, 1985
- AT&T Technologies, Inc.
- Bernard M. Dick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for bonding a chip carrier to a metallized substrate
- Patent number 4,512,509
- Issue date Apr 23, 1985
- AT&T Technologies, Inc.
- Roland Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling magnetic pins into printed circuit boards
- Patent number 4,510,685
- Issue date Apr 16, 1985
- International Business Machines Corporation
- Richard Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3738639
- Patent number 3,738,639
- Issue date Jun 12, 1973
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3594899
- Patent number 3,594,899
- Issue date Jul 27, 1971
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215158
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INTERCONNECT DECALS
- Publication number 20200236788
- Publication date Jul 23, 2020
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Stephen McGarry Hatch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTING DEVICE, SOLDER MANAGEMENT SYSTEM, AND PRINTING MANAGING ME...
- Publication number 20170348786
- Publication date Dec 7, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- YUJI NAKAMURA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE EN...
- Publication number 20120009056
- Publication date Jan 12, 2012
- DAVID J. MITCHELL
- G01 - MEASURING TESTING
Information Patent Application
WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE EN...
- Publication number 20120005891
- Publication date Jan 12, 2012
- David J. Mitchell
- G01 - MEASURING TESTING
Information Patent Application
FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION
- Publication number 20100186226
- Publication date Jul 29, 2010
- UNIVERSITY OF WASHINGTON, THE
- Babak Amirparviz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LIGHT EMITTING DIODE ASSEMBLY AND LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20100155751
- Publication date Jun 24, 2010
- FOXSEMICON INTEGRATED TECHNOLOGY, INC.
- KUN-SHENG KUO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Wireless Telemetry Electronic Circuit Board for High Temperature En...
- Publication number 20100039779
- Publication date Feb 18, 2010
- SIEMENS POWER GENERATION, INC.
- DAVID J. MITCHELL
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DIODE ASSEMBLY AND LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20080277677
- Publication date Nov 13, 2008
- FOXSEMICON INTEGRATED TECHNOLOGY, INC.
- KUN-SHENG KUO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
LIQUID CRYSTAL DISPLAY MODULE
- Publication number 20080239193
- Publication date Oct 2, 2008
- Samsung Electronics Co., Ltd.
- Ji-Hwan JANG
- G02 - OPTICS
Information Patent Application
Method for inspecting manually inserted components
- Publication number 20070068999
- Publication date Mar 29, 2007
- Inventec Corporation
- Jun-Hua Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Smart card and method for manufacturing a smart card
- Publication number 20060226240
- Publication date Oct 12, 2006
- Innovatier, Inc.
- Robert Singleton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for aligning a component on a printed circuit board
- Publication number 20060156540
- Publication date Jul 20, 2006
- Hewlett-Packard Development Company, L.P.
- Daniel Cromwell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacturing system using solder self-alignment with optical compo...
- Publication number 20030162003
- Publication date Aug 28, 2003
- Axsun Technologies, Inc.
- Walid A. Atia
- G02 - OPTICS
Information Patent Application
Manufacturing system using solder self-alignment with optical compo...
- Publication number 20020124375
- Publication date Sep 12, 2002
- Walid A. Atia
- G02 - OPTICS

Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printing device, solder management system, and printing managing me...

Circuit board interconnect decals

Circuit board interconnect decals

Wireless telemetry electronic circuit board for high temperature en...

Method for manufacturing a circuit for high temperature and high g-...

Liquid crystal display module

Wireless telemetry electronic circuit board for high temperature en...

Light emitting diode assembly and light emitting diode display device

Light emitting diode assembly and light emitting diode display device

Smart card and method for manufacturing a smart card

Manufacturing system using solder self-alignment with optical compo...

Method and apparatus for verification of assembled printed circuit...

Apparatus for verification of assembled printed circuit boards

Method of mounting circuit components on a flexible substrate

Alignment method and apparatus for mounting electronic components

System for connecting integrated circuit dies to a printed wiring b...

Component location device and method for surface-mount printed circ...

Solderless printed wiring board module and multi-module assembly

Method of soldering component on printed circuit board

Mask and solder form

Jigs for locating electrical components

Surface mount component

Technique for bonding a chip carrier to a metallized substrate

Method of assembling magnetic pins into printed circuit boards

3738639

3594899

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

CIRCUIT BOARD INTERCONNECT DECALS

PRINTING DEVICE, SOLDER MANAGEMENT SYSTEM, AND PRINTING MANAGING ME...

WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE EN...

WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE EN...

FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

LIGHT EMITTING DIODE ASSEMBLY AND LIGHT EMITTING DIODE DISPLAY DEVICE

Wireless Telemetry Electronic Circuit Board for High Temperature En...

LIGHT EMITTING DIODE ASSEMBLY AND LIGHT EMITTING DIODE DISPLAY DEVICE

LIQUID CRYSTAL DISPLAY MODULE

Method for inspecting manually inserted components

Smart card and method for manufacturing a smart card

Method for aligning a component on a printed circuit board

Manufacturing system using solder self-alignment with optical compo...

Manufacturing system using solder self-alignment with optical compo...