Mask-wafer alignment

Industry

CPC
H01L21/682

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/682Mask-wafer alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alignment mask, metal mask assembly, and preparation method therefor
- Patent number 12,183,617
- Issue date Dec 31, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ju Mei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system, processing method, measurement apparatus, substr...
- Patent number 12,140,878
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Shinichi Egashira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-depth film for optical devices
- Patent number 12,084,761
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Karl J. Armstrong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 12,080,554
- Issue date Sep 3, 2024
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metrology data correction
- Patent number 12,020,970
- Issue date Jun 25, 2024
- International Business Machines Corporation
- Daniel Schmidt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lithographic overlay correction and lithographic process
- Patent number 11,966,170
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ai-Jen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pellicle removal tool
- Patent number 11,948,824
- Issue date Apr 2, 2024
- Photronics, Inc.
- Hilario Ar-Miguel Alvarez
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer notch positioning detection
- Patent number 11,942,348
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-An Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed exposure for large die
- Patent number 11,929,347
- Issue date Mar 12, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement system, substrate processing system, and device manufac...
- Patent number 11,915,961
- Issue date Feb 27, 2024
- Nikon Corporation
- Go Ichinose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling a position of a first object relative to a se...
- Patent number 11,774,865
- Issue date Oct 3, 2023
- ASML Netherlands B.V.
- Thijs Adriaan Cornelis Van Keulen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system, processing method, measurement apparatus, substr...
- Patent number 11,726,412
- Issue date Aug 15, 2023
- Canon Kabushiki Kaisha
- Shinichi Egashira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer bonding method and wafer bonding apparatus
- Patent number 11,721,662
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thinning wafer thereof
- Patent number 11,721,555
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Position measuring apparatus and measuring method
- Patent number 11,715,660
- Issue date Aug 1, 2023
- Kioxia Corporation
- Manabu Takakuwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for correcting overlay errors in a lithographic p...
- Patent number 11,687,010
- Issue date Jun 27, 2023
- Onto Innovation Inc.
- Zhiyang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pellicle removal tool
- Patent number 11,682,573
- Issue date Jun 20, 2023
- Photronics, Inc.
- Hilario Ar-Miguel Alvarez
- B32 - LAYERED PRODUCTS
Information Patent Grant
Workpiece referencing system for referencing workpieces
- Patent number 11,660,853
- Issue date May 30, 2023
- ASMPT SMT SINGAPORE PTE. LTD.
- Tom Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment system and alignment mark
- Patent number 11,651,985
- Issue date May 16, 2023
- United Microelectronics Corp.
- Yu-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transporting method and substrate processing system
- Patent number 11,545,381
- Issue date Jan 3, 2023
- Tokyo Electron Limited
- Keisuke Kondoh
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor device and method of fabrication the same
- Patent number 11,527,428
- Issue date Dec 13, 2022
- United Microelectronics Corp.
- Nuo Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposure apparatus, manufacturing method of flat-panel display, dev...
- Patent number 11,520,242
- Issue date Dec 6, 2022
- Nikon Corporation
- Yasuo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer notch positioning detection
- Patent number 11,521,882
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-An Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed substrate aligner apparatus
- Patent number 11,508,597
- Issue date Nov 22, 2022
- Brook Automation US, LLC
- Jairo T. Moura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective step coverage for micro-fabricated structures
- Patent number 11,499,218
- Issue date Nov 15, 2022
- Si-Ware Systems
- Mostafa Medhat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vapor deposition mask and method for manufacturing same, vapor depo...
- Patent number 11,501,992
- Issue date Nov 15, 2022
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement system, substrate processing system, and device manufac...
- Patent number 11,430,684
- Issue date Aug 30, 2022
- Nikon Corporation
- Go Ichinose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for wafer processing
- Patent number 11,373,892
- Issue date Jun 28, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Sung-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for correcting non-ideal wafer topography
- Patent number 11,367,644
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Mu Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APP...
- Publication number 20240347470
- Publication date Oct 17, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME
- Publication number 20240266199
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Je Hyeon YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PELLICLE REMOVAL TOOL
- Publication number 20240242996
- Publication date Jul 18, 2024
- PHOTRONICS, INC.
- Hilario Ar-Miguel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240234151
- Publication date Jul 11, 2024
- Jusung Engineering Co., Ltd.
- Eick Hyun LIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER NOTCH POSITIONING DETECTION
- Publication number 20240194513
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-An CHUANG
- G01 - MEASURING TESTING
Information Patent Application
COMPACT OPTICAL MICROSCOPE, METROLOGY DEVICE COMPRISING THE OPTICAL...
- Publication number 20240184089
- Publication date Jun 6, 2024
- Nearfield Instruments B.V.
- Hamed SADEGHIAN MARNANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240136190
- Publication date Apr 25, 2024
- Jusung Engineering Co., Ltd.
- Eick Hyun LIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME
- Publication number 20240096679
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- JUNHYEUK KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PITCH GRID OVERLAY TARGET FOR SCANNING OVERLAY METROLOGY
- Publication number 20240068804
- Publication date Feb 29, 2024
- KLA Corporation
- Yuval Lubashevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION APPARATUS
- Publication number 20240068082
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- JUNHYEUK KO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230374647
- Publication date Nov 23, 2023
- Canon Kabushiki Kaisha
- Masumi Itabashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, PROCESSING METHOD, MEASUREMENT APPARATUS, SUBSTR...
- Publication number 20230359134
- Publication date Nov 9, 2023
- Canon Kabushiki Kaisha
- Shinichi Egashira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PELLICLE REMOVAL TOOL
- Publication number 20230274965
- Publication date Aug 31, 2023
- PHOTRONICS, INC.
- Hilario Ar-Miguel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
- Publication number 20230215837
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER NOTCH POSITIONING DETECTION
- Publication number 20230096018
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-An CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY DATA CORRECTION
- Publication number 20230101448
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Daniel SCHMIDT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230073022
- Publication date Mar 9, 2023
- United Microelectronics Corp.
- Nuo Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS MONITORING AND TUNING USING PREDICTION MODELS
- Publication number 20220404711
- Publication date Dec 22, 2022
- ASML NETHERLANDS B.V.
- Ning GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20220399282
- Publication date Dec 15, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC ELEMENTS
- Publication number 20220384234
- Publication date Dec 1, 2022
- ASTI GLOBAL INC., TAIWAN
- YING-CHIEH CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFAC...
- Publication number 20220367224
- Publication date Nov 17, 2022
- Nikon Corporation
- Go ICHINOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT DEVICE
- Publication number 20220364218
- Publication date Nov 17, 2022
- V TECHNOLOGY CO., LTD.
- Tadashi WAKABAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESSING SYSTEM, PROCESSING METHOD, MEASUREMENT APPARATUS, SUBSTR...
- Publication number 20220342324
- Publication date Oct 27, 2022
- Canon Kabushiki Kaisha
- Shinichi Egashira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR CORRECTING NON-IDEAL WAFER TOPOGRAPHY
- Publication number 20220319895
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Mu Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALIGNMENT SCHEME OF MASK TO ZERO LAYER MARK UNDERNEATH EPI LAYER AN...
- Publication number 20220320003
- Publication date Oct 6, 2022
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Min-Hwa CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING A POSITION OF A FIRST OBJECT RELATIVE TO A SE...
- Publication number 20220299889
- Publication date Sep 22, 2022
- ASML NETHERLANDS B.V.
- Thijs Adriaan Cornelis VAN KEULEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SYSTEMS AND METHODS FOR TRANSFERRING DEVICES OR PATTERNS TO A SUBST...
- Publication number 20220223451
- Publication date Jul 14, 2022
- VueReal Inc.
- Hameed TALEBI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING THIN FILM
- Publication number 20220213586
- Publication date Jul 7, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Quanqin SUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mask-wafer alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alignment mask, metal mask assembly, and preparation method therefor

Apparatus and method for bonding a plurality of dies to a carrier p...

Processing system, processing method, measurement apparatus, substr...

Multi-depth film for optical devices

Bonding method, bonding device, and holding member

Metrology data correction

Lithographic overlay correction and lithographic process

Pellicle removal tool

Wafer notch positioning detection

Mixed exposure for large die

Measurement system, substrate processing system, and device manufac...

Method of controlling a position of a first object relative to a se...

Processing system, processing method, measurement apparatus, substr...

Wafer bonding method and wafer bonding apparatus

Method and system for thinning wafer thereof

Position measuring apparatus and measuring method

System and method for correcting overlay errors in a lithographic p...

Pellicle removal tool

Workpiece referencing system for referencing workpieces

Alignment system and alignment mark

Substrate transporting method and substrate processing system

Semiconductor device and method of fabrication the same

Exposure apparatus, manufacturing method of flat-panel display, dev...

Wafer notch positioning detection

High speed substrate aligner apparatus

Selective step coverage for micro-fabricated structures

Vapor deposition mask and method for manufacturing same, vapor depo...

Measurement system, substrate processing system, and device manufac...

System and method for wafer processing

System and method for correcting non-ideal wafer topography

Patents Applicationslast 30 patents

System and Method for Bonding Semiconductor Devices

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APP...

ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME

PELLICLE REMOVAL TOOL

SEMICONDUCTOR PACKAGING METHOD

WAFER NOTCH POSITIONING DETECTION

COMPACT OPTICAL MICROSCOPE, METROLOGY DEVICE COMPRISING THE OPTICAL...

SEMICONDUCTOR PACKAGING METHOD

SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME

MULTI-PITCH GRID OVERLAY TARGET FOR SCANNING OVERLAY METROLOGY

DEPOSITION APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROCESSING SYSTEM, PROCESSING METHOD, MEASUREMENT APPARATUS, SUBSTR...

PELLICLE REMOVAL TOOL

METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE

WAFER NOTCH POSITIONING DETECTION

METROLOGY DATA CORRECTION

SEMICONDUCTOR DEVICE

PROCESS MONITORING AND TUNING USING PREDICTION MODELS

LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME

METHOD FOR TRANSFERRING ELECTRONIC ELEMENTS

MEASUREMENT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFAC...

ALIGNMENT DEVICE

PROCESSING SYSTEM, PROCESSING METHOD, MEASUREMENT APPARATUS, SUBSTR...

SYSTEM AND METHOD FOR CORRECTING NON-IDEAL WAFER TOPOGRAPHY

ALIGNMENT SCHEME OF MASK TO ZERO LAYER MARK UNDERNEATH EPI LAYER AN...

METHOD OF CONTROLLING A POSITION OF A FIRST OBJECT RELATIVE TO A SE...

SYSTEMS AND METHODS FOR TRANSFERRING DEVICES OR PATTERNS TO A SUBST...

DEVICE AND METHOD FOR MANUFACTURING THIN FILM