Masks not provided for in groups H05K3/02 - H05K3/46

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H05K3/0073

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46

Industries

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Patents Grantslast 30 patents

Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,641,716
- Issue date May 2, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou Noguchi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mask and electronic device thereof
- Patent number 11,307,725
- Issue date Apr 19, 2022
- Hannstar Display Corporation
- Mei-Ling Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board trace for galvanic effect reduction
- Patent number 11,234,327
- Issue date Jan 25, 2022
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect circuit methods and devices
- Patent number 11,116,070
- Issue date Sep 7, 2021
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials for masking substrates and associated methods
- Patent number 10,744,529
- Issue date Aug 18, 2020
- HZO, Inc.
- David James Astle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board and semiconductor package structure
- Patent number 10,568,200
- Issue date Feb 18, 2020
- SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package structure
- Patent number 10,568,198
- Issue date Feb 18, 2020
- SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package structure
- Patent number 10,568,199
- Issue date Feb 18, 2020
- SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Masking substrates for application of protective coatings
- Patent number 10,449,568
- Issue date Oct 22, 2019
- HZO, INC.
- David James Astle
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Fan-out wafer level packages having preformed embedded ground plane...
- Patent number 10,440,819
- Issue date Oct 8, 2019
- NXP USA, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,366,949
- Issue date Jul 30, 2019
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dry film solder mask composite laminate materials
- Patent number 10,327,336
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Sarah K. Czaplewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 10,103,113
- Issue date Oct 16, 2018
- DAEDUCK ELECTRONICS CO., LTD.
- Young-Joo Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing resin multilayer substrate
- Patent number 10,098,238
- Issue date Oct 9, 2018
- Murata Manufacturing Co., Ltd.
- Masaki Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 10,080,284
- Issue date Sep 18, 2018
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flexible and/or stretchable electronic de...
- Patent number 10,034,382
- Issue date Jul 24, 2018
- Nanyang Technology University
- Chaoyi Yan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for manufacturing resin multilayer board
- Patent number 9,961,780
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Hirofumi Shinagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,875,957
- Issue date Jan 23, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of controlling alloy composition during electropl...
- Patent number 9,867,293
- Issue date Jan 9, 2018
- Northrop Grumman Systems Corporation
- Jerry T. Fang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method and apparatus for forming fine scale structures in dielectri...
- Patent number 9,843,155
- Issue date Dec 12, 2017
- M-SOLV LIMITED
- David Charles Milne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for making the same
- Patent number 9,832,888
- Issue date Nov 28, 2017
- Avary Holding (Shenzhen) Co., Limited.
- Yan-Lu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out wafer level packages having preformed embedded ground plane...
- Patent number 9,826,630
- Issue date Nov 21, 2017
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor packages including the same
- Patent number 9,775,230
- Issue date Sep 26, 2017
- Samsung Electronics Co., Ltd.
- Young-jae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel motherboard and manufacturing method thereof
- Patent number 9,730,331
- Issue date Aug 8, 2017
- BOE Technology Group Co., Ltd.
- Guang Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK AND ELECTRONIC DEVICE THEREOF
- Publication number 20210405817
- Publication date Dec 30, 2021
- HANNSTAR DISPLAY CORPORATION
- Mei-Ling Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20210352798
- Publication date Nov 11, 2021
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20210136921
- Publication date May 6, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou NOGUCHI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20190021161
- Publication date Jan 17, 2019
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180376582
- Publication date Dec 27, 2018
- Shanghai Zhaoxin Semiconductor Co., Ltd.
- Nai-Shung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20180166372
- Publication date Jun 14, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGES HAVING PREFORMED EMBEDDED GROUND PLANE...
- Publication number 20180063948
- Publication date Mar 1, 2018
- NXP USA, Inc.
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20170339795
- Publication date Nov 23, 2017
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- YAN-LU LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20170243841
- Publication date Aug 24, 2017
- DAEDUCK ELECTRONICS CO., LTD.
- Young-Joo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20170064824
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Young-jae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-RESOLUTION PRINTER
- Publication number 20160374207
- Publication date Dec 22, 2016
- CAMTEK LTD
- Yehuda Ben-Abu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SYSTEMS AND METHODS FOR BREADBOARD SYTLE PRINTED CIRCUIT BOARD
- Publication number 20160360613
- Publication date Dec 8, 2016
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160353582
- Publication date Dec 1, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- WEI-SHUO SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRY FILM SOLDER MASK COMPOSITE LAMINATE MATERIALS
- Publication number 20160338205
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Sarah K. Czaplewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MASK FIRST PROCESS
- Publication number 20160316573
- Publication date Oct 27, 2016
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DE...
- Publication number 20160192501
- Publication date Jun 30, 2016
- Nanyang Technological University
- Chaoyi YAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20160174364
- Publication date Jun 16, 2016
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160113111
- Publication date Apr 21, 2016
- Wistron Corporation
- Jui-Yun Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR F...
- Publication number 20160088734
- Publication date Mar 24, 2016
- Harris Corporation
- Louis Joseph Rendek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGES HAVING PREFORMED EMBEDDED GROUND PLANE...
- Publication number 20160073496
- Publication date Mar 10, 2016
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20160066434
- Publication date Mar 3, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Seong Min CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD
- Publication number 20160050766
- Publication date Feb 18, 2016
- MURATA MANUFACTURING CO., LTD.
- Hirofumi Shinagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL MOTHERBOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150313021
- Publication date Oct 29, 2015
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Guang YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTICOLOR PRINTING
- Publication number 20150296627
- Publication date Oct 15, 2015
- CAMTEK LTD
- Yehuda Ben-Abu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150296618
- Publication date Oct 15, 2015
- Subtron Technology Co., Ltd.
- Yu-Chi Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND WIRING BOARD PRODUCTION METHOD
- Publication number 20150282313
- Publication date Oct 1, 2015
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masks not provided for in groups H05K3/02 - H05K3/46

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

On-demand method of making PCB pallets using additive manufacturing

Methods of forming flexible interconnect circuits

Methods of forming interconnect circuits

Method for manufacturing printed circuit board

On-demand method of making PCB pallets using additive manufacturing

Mask and electronic device thereof

Printed circuit board trace for galvanic effect reduction

Interconnect circuit methods and devices

High-speed interconnects for printed circuit boards

Materials for masking substrates and associated methods

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Masking substrates for application of protective coatings

Fan-out wafer level packages having preformed embedded ground plane...

Wiring substrate and semiconductor device

Dry film solder mask composite laminate materials

Method of manufacturing printed circuit board

Method of manufacturing resin multilayer substrate

Circuit board structure

High-speed interconnects for printed circuit boards

Method of manufacturing a flexible and/or stretchable electronic de...

Method for manufacturing resin multilayer board

Wiring substrate and semiconductor device

Method and system of controlling alloy composition during electropl...

Method and apparatus for forming fine scale structures in dielectri...

Circuit board and method for making the same

Fan-out wafer level packages having preformed embedded ground plane...

Printed circuit board and semiconductor packages including the same

Display panel motherboard and manufacturing method thereof

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

Interconnect Circuit Methods And Devices

INTERCONNECT CIRCUIT METHODS AND DEVICES

MASK AND ELECTRONIC DEVICE THEREOF

INTERCONNECT CIRCUIT METHODS AND DEVICES

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

INTERCONNECT CIRCUIT METHODS AND DEVICES

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

Wiring Substrate and Semiconductor Device

FAN-OUT WAFER LEVEL PACKAGES HAVING PREFORMED EMBEDDED GROUND PLANE...

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

MULTI-RESOLUTION PRINTER

SYSTEMS AND METHODS FOR BREADBOARD SYTLE PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

DRY FILM SOLDER MASK COMPOSITE LAMINATE MATERIALS

SOLDER MASK FIRST PROCESS

METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DE...

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR F...

FAN-OUT WAFER LEVEL PACKAGES HAVING PREFORMED EMBEDDED GROUND PLANE...

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD

DISPLAY PANEL MOTHERBOARD AND MANUFACTURING METHOD THEREOF

MULTICOLOR PRINTING

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND WIRING BOARD PRODUCTION METHOD