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H01L2924/30111

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/30111matching

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package design scheme for enabling high-speed low-loss signaling an...
- Patent number 12,057,413
- Issue date Aug 6, 2024
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Launch structures for radio frequency integrated device packages
- Patent number 11,894,322
- Issue date Feb 6, 2024
- Analog Devices, Inc.
- Bruce E. Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based radio frequency amplifiers having back side...
- Patent number 11,837,559
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,830,787
- Issue date Nov 28, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,798,862
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplification module
- Patent number 11,791,782
- Issue date Oct 17, 2023
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package interface with improved impedance continuity
- Patent number 11,756,905
- Issue date Sep 12, 2023
- CREDO TECHNOLOGY GROUP LIMITED
- Mengying Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,749,622
- Issue date Sep 5, 2023
- SUMITOMO DEVICE INNOVATIONS, INC.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 11,728,283
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Chilwoo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transistor amplifiers having leadframes with integr...
- Patent number 11,588,448
- Issue date Feb 21, 2023
- Wolfspeed, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone radio frequency transistor amplifiers
- Patent number 11,533,024
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,476,226
- Issue date Oct 18, 2022
- Murata Manufacturing Co., Ltd.
- Takanori Uejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifiers with series-coupled output bondwire arrays and shunt...
- Patent number 11,476,209
- Issue date Oct 18, 2022
- NXP B.V.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor die with output bondpad at the input side of the die, an...
- Patent number 11,444,044
- Issue date Sep 13, 2022
- NXP USA, INC.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor devices with input-output isolation and methods...
- Patent number 11,417,617
- Issue date Aug 16, 2022
- Wolfspeed, Inc.
- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with efficient partitioning of hig...
- Patent number 11,367,708
- Issue date Jun 21, 2022
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect core
- Patent number 11,355,458
- Issue date Jun 7, 2022
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure
- Patent number 11,335,661
- Issue date May 17, 2022
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,322,462
- Issue date May 3, 2022
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,302,659
- Issue date Apr 12, 2022
- Murata Manufacturing Co., Ltd.
- Hisanori Namie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer radio frequency integrated circuit package and related...
- Patent number 11,277,902
- Issue date Mar 15, 2022
- Arbe Robotics Ltd.
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally-formed multiple-path power amplifier with on-die combini...
- Patent number 11,277,098
- Issue date Mar 15, 2022
- NXP USA, INC.
- Xavier Hue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-performance integrated circuit packaging platform compatible w...
- Patent number 11,257,771
- Issue date Feb 22, 2022
- Keysight Technologies, Inc.
- Philipp Pahl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY CIRCUIT
- Publication number 20230223363
- Publication date Jul 13, 2023
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230107764
- Publication date Apr 6, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akira SAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...
- Publication number 20230091513
- Publication date Mar 23, 2023
- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH UNIFORM COMPONENTS AND METHODS OF FORMING THE...
- Publication number 20220254762
- Publication date Aug 11, 2022
- Cree, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220108935
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220045017
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Chilwoo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
- Publication number 20210408976
- Publication date Dec 30, 2021
- Cree, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...
- Publication number 20210408978
- Publication date Dec 30, 2021
- Cree, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Interface with Improved Impedance Continuity
- Publication number 20210375798
- Publication date Dec 2, 2021
- CREDO TECHNOLOGY GROUP LIMITED
- Mengying MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...
- Publication number 20210368615
- Publication date Nov 25, 2021
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS
- Publication number 20210327795
- Publication date Oct 21, 2021
- Intel Corporation
- ZHIGUO QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE-BASED RADIO FREQUENCY AMPLIFIERS HAVING BACK SIDE...
- Publication number 20210313286
- Publication date Oct 7, 2021
- Cree, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT...
- Publication number 20210225784
- Publication date Jul 22, 2021
- NXP B.V.
- Vikas SHILIMKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION MODULE
- Publication number 20210194444
- Publication date Jun 24, 2021
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH-PERFORMANCE INTEGRATED CIRCUIT PACKAGING PLATFORM COMPATIBLE W...
- Publication number 20210193599
- Publication date Jun 24, 2021
- KEYSIGHT TECHNOLOGIES, INC.
- Philipp Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC DIE WITH ACOUSTIC WAVE RESONATORS AND ACTIVE CIRCUITRY
- Publication number 20210067132
- Publication date Mar 4, 2021
- Intel Corporation
- Telesphor Kamgaing
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20210043573
- Publication date Feb 11, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20210043541
- Publication date Feb 11, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210013165
- Publication date Jan 14, 2021
- MURATA MANUFACTURING CO., LTD.
- Hisanori NAMIE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS...
- Publication number 20200402933
- Publication date Dec 24, 2020
- Cree, Inc.
- Frank Trang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Wire Bonding Structure
- Publication number 20200395331
- Publication date Dec 17, 2020
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS
- Publication number 20200373232
- Publication date Nov 26, 2020
- Intel Corporation
- ZHIGUO QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DESIGN SCHEME FOR ENABLING HIGH-SPEED LOW-LOSS SIGNALING AN...
- Publication number 20200343202
- Publication date Oct 29, 2020
- Intel Corporation
- Lijiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20200321289
- Publication date Oct 8, 2020
- Murata Manufacturing Co., Ltd.
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200295462
- Publication date Sep 17, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Device packages with uniform components and methods of forming the...

Package design scheme for enabling high-speed low-loss signaling an...

Impedance controlled electrical interconnection employing meta-mate...

Launch structures for radio frequency integrated device packages

Group III nitride-based radio frequency amplifiers having back side...

Thermal management in integrated circuit packages

Semiconductor package

Power amplification module

Package interface with improved impedance continuity

Field effect transistor and semiconductor device

Package substrate and semiconductor package including the same

Ribbon bond solution for reducing thermal stress on an intermittent...

Package substrates with magnetic build-up layers

Radio frequency transistor amplifiers having leadframes with integr...

Multi-zone radio frequency transistor amplifiers

Radio-frequency module and communication device

RF amplifiers with series-coupled output bondwire arrays and shunt...

Impedance controlled electrical interconnection employing meta-mate...

Power amplifier systems with control interface and bias circuit

Transistor die with output bondpad at the input side of the die, an...

Packaged transistor devices with input-output isolation and methods...

Microelectronic devices designed with efficient partitioning of hig...

Interconnect core

Wire bonding structure

Semiconductor device

Semiconductor device

Single layer radio frequency integrated circuit package and related...

Integrally-formed multiple-path power amplifier with on-die combini...

High-performance integrated circuit packaging platform compatible w...

Patents Applicationslast 30 patents

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

DOHERTY AMPLIFIERS

SEMICONDUCTOR PACKAGE

HIGH FREQUENCY CIRCUIT

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

DEVICE PACKAGES WITH UNIFORM COMPONENTS AND METHODS OF FORMING THE...

SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...

Package Interface with Improved Impedance Continuity

SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...

PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS

GROUP III NITRIDE-BASED RADIO FREQUENCY AMPLIFIERS HAVING BACK SIDE...

RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT...

POWER AMPLIFICATION MODULE

HIGH-PERFORMANCE INTEGRATED CIRCUIT PACKAGING PLATFORM COMPATIBLE W...

MONOLITHIC DIE WITH ACOUSTIC WAVE RESONATORS AND ACTIVE CIRCUITRY

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICE

PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS...

Wire Bonding Structure

PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS

PACKAGE DESIGN SCHEME FOR ENABLING HIGH-SPEED LOW-LOSS SIGNALING AN...

SEMICONDUCTOR CHIP

Integrated Circuit Package Including Miniature Antenna