Material of the discharge electrode

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H01L2224/7827

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/7827Material of the discharge electrode

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus, circuit for wire bonding apparatus, and met...
- Patent number 10,964,661
- Issue date Mar 30, 2021
- Shinkawa Ltd.
- Junichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball forming device for wire bonder
- Patent number 10,629,563
- Issue date Apr 21, 2020
- Kaijo Corporation
- Yusuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball forming device, wire-bonding apparatus, and ball formation method
- Patent number 10,410,992
- Issue date Sep 10, 2019
- Shinkawa Ltd.
- Yoshihito Hagiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Initial ball forming method for wire bonding wire and wire bonding...
- Patent number 7,299,966
- Issue date Nov 27, 2007
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Initial ball forming method for wire bonding wire and wire bonding...
- Patent number 6,874,673
- Issue date Apr 5, 2005
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discharge abnormality detection device and method for use in wire b...
- Patent number 5,988,482
- Issue date Nov 23, 1999
- Kabushiki Kaisha Shinkawa
- Kazumasa Sasakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 5,763,849
- Issue date Jun 9, 1998
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING DEVICE, CIRCUIT FOR WIRE BONDING DEVICE, AND METHOD FO...
- Publication number 20200294957
- Publication date Sep 17, 2020
- SHINKAWA LTD.
- Junichi ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRAZE BONDED NAIL HEAD LEAD
- Publication number 20200043882
- Publication date Feb 6, 2020
- LUCAS-MILHAUPT, INC.
- Dean W Kick
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL FORMING DEVICE FOR WIRE BONDER
- Publication number 20170330854
- Publication date Nov 16, 2017
- KAIJO CORPORATION
- Yusuke SAKURAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...
- Publication number 20160358879
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- KAZUMASA SASAKURA
- G01 - MEASURING TESTING
Information Patent Application
Initial ball forming method for wire bonding wire and wire bonding...
- Publication number 20040000577
- Publication date Jan 1, 2004
- KABUSHIKI KAISHA SHINKAWA
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Initial ball forming method for wire bonding wire and wire bonding...
- Publication number 20040000578
- Publication date Jan 1, 2004
- KABUSHIKI KAISHA SHINKAWA
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Material of the discharge electrode

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding apparatus, circuit for wire bonding apparatus, and met...

Ball forming device for wire bonder

Discharge examination device, wire-bonding apparatus, and discharge...

Ball forming device, wire-bonding apparatus, and ball formation method

Initial ball forming method for wire bonding wire and wire bonding...

Initial ball forming method for wire bonding wire and wire bonding...

Discharge abnormality detection device and method for use in wire b...

Wire bonding apparatus

Patents Applicationslast 30 patents

WIRE BONDING DEVICE, CIRCUIT FOR WIRE BONDING DEVICE, AND METHOD FO...

BRAZE BONDED NAIL HEAD LEAD

BALL FORMING DEVICE FOR WIRE BONDER

DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...

Initial ball forming method for wire bonding wire and wire bonding...

Initial ball forming method for wire bonding wire and wire bonding...