Material of the protective coating

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H01L2224/02215

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02215Material of the protective coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 12,062,630
- Issue date Aug 13, 2024
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 11,824,024
- Issue date Nov 21, 2023
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,817,405
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Sumin Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact pad and method of making
- Patent number 11,784,089
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,776,922
- Issue date Oct 3, 2023
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,756,912
- Issue date Sep 12, 2023
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,605,606
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,538,777
- Issue date Dec 27, 2022
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,521,945
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,508,681
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 11,424,203
- Issue date Aug 23, 2022
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact pad and method of making
- Patent number 11,410,878
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,380,636
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Seung Min Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film structure for bond pad
- Patent number 11,322,464
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages having a die with an enca...
- Patent number 11,315,891
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,251,144
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper structure
- Patent number 10,937,720
- Issue date Mar 2, 2021
- Infineon Technologies Austria AG
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact pad
- Patent number 10,923,391
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,892,239
- Issue date Jan 12, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
- Publication number 20240321791
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP LAYER FOR PAD OXIDATION PREVENTION
- Publication number 20240243080
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Platinum-Based Solder Body Contacts for Integration of a First Subs...
- Publication number 20240128213
- Publication date Apr 18, 2024
- Newport Fab. LLC dba Tower Semiconductor Newport Beach
- Zhirong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
- Publication number 20240113054
- Publication date Apr 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Clément Lobre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240014156
- Publication date Jan 11, 2024
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369278
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230326893
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Sangho CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFA...
- Publication number 20230109650
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC FILM STRESS BUFFER FOR INTERFACE OF METAL AND DIELECTRIC
- Publication number 20230098501
- Publication date Mar 30, 2023
- Intel Corporation
- Sarah BLYTHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078259
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20220384371
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Samuele SCIARRILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20220367390
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING
- Publication number 20220359276
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20220285301
- Publication date Sep 8, 2022
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20220254744
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Packages Having a Die with an Enca...
- Publication number 20220246559
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220246556
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Sumin AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...
- Publication number 20220157750
- Publication date May 19, 2022
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACER OVER BONDING PAD
- Publication number 20220130779
- Publication date Apr 28, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20220108962
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220102319
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005773
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005772
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210407945
- Publication date Dec 30, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Taiichi OGUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING
- Publication number 20210125860
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsu YEN
- H01 - BASIC ELECTRIC ELEMENTS

Material of the protective coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and method of manufacturing semiconductor module

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor packages having a die, an encapsulant, and a redistri...

Semiconductor structures with via openings and methods of making th...

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor module and method of manufacturing semiconductor module

Semiconductor device and method of fabricating the same

Semiconductor chip

Semiconductor device with contact pad and method of making

Semiconductor structure containing pre-polymerized protective layer...

Semiconductor device and manufacturing method for semiconductor device

Semiconductor device with spacer over bonding pad

Semiconductor structure containing pre-polymerized protective layer...

Semiconductor device with spacer over bonding pad

Semiconductor package and method of fabricating the same

Semiconductor structure having counductive bump with tapered portio...

Semiconductor module and method of manufacturing semiconductor module

Semiconductor device with contact pad and method of making

Semiconductor package

Film structure for bond pad

Methods of forming semiconductor packages having a die with an enca...

Manufacturing of flip-chip electronic device with carrier having he...

Semiconductor chip

Dry etch process landing on metal oxide etch stop layer over metal...

Semiconductor device

Semiconductor structure having a conductive bump with a plurality o...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device with copper structure

Semiconductor device with contact pad

Bond pad reliability of semiconductor devices

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

FILM STRUCTURE FOR BOND PAD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

CAP LAYER FOR PAD OXIDATION PREVENTION

Platinum-Based Solder Body Contacts for Integration of a First Subs...

ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION

THICK REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFA...

ORGANIC FILM STRESS BUFFER FOR INTERFACE OF METAL AND DIELECTRIC

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

FILM STRUCTURE FOR BOND PAD

Methods of Forming Semiconductor Packages Having a Die with an Enca...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...

SEMICONDUCTOR DEVICE WITH SPACER OVER BONDING PAD

SEMICONDUCTOR CHIP

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING