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  • H01L2224/79985
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/79985Material
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  • Information Patent Application

    THERMOCOMPRESSION BONDING DEVICE
    • Publication number 20200411466
    • Publication date Dec 31, 2020
    • Sakai Display Products Corporation
    • YOHICHIROH SAKAKI
    • G02 - OPTICS