Material

Industry

CPC
H01L2224/13599

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13599Material

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing package structure having elastic bump
- Patent number 10,580,665
- Issue date Mar 3, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a liquid crystal polymer solder mask and r...
- Patent number 10,342,126
- Issue date Jul 2, 2019
- Harris Corporation
- Louis Joseph Rendek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component and electronic unit
- Patent number 9,595,646
- Issue date Mar 14, 2017
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for chip packaging structure
- Patent number 9,293,432
- Issue date Mar 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices for metallization
- Patent number 9,006,893
- Issue date Apr 14, 2015
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, devices, and materials for metallization
- Patent number 8,518,815
- Issue date Aug 27, 2013
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 8,120,154
- Issue date Feb 21, 2012
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 7,691,670
- Issue date Apr 6, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making lithographic contact springs
- Patent number 6,616,966
- Issue date Sep 9, 2003
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a flip chip on leadframe semiconductor package
- Patent number 6,550,666
- Issue date Apr 22, 2003
- Advanpack Solutions PTE LTD
- Jimmy Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a flip chip semiconductor package
- Patent number 6,510,976
- Issue date Jan 28, 2003
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for making spring interconnect structures
- Patent number 6,491,968
- Issue date Dec 10, 2002
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Method of making and using lithographic contact springs
- Patent number 6,268,015
- Issue date Jul 31, 2001
- FormFactor
- Gaetan L. Mathieu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20170339785
- Publication date Nov 23, 2017
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACHMENT SYSTEM
- Publication number 20160035686
- Publication date Feb 4, 2016
- Kyocera America Inc
- Dinah LIEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20150294949
- Publication date Oct 15, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20140054776
- Publication date Feb 27, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20120007239
- Publication date Jan 12, 2012
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COATING FOR INDIUM BUMP BONDING
- Publication number 20110315429
- Publication date Dec 29, 2011
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20100140762
- Publication date Jun 10, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20090273065
- Publication date Nov 5, 2009
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FLIP CHIP ON LEADFRAME SEMICONDUCTOR PACKAGE
- Publication number 20030038162
- Publication date Feb 27, 2003
- Jimmy Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20020170942
- Publication date Nov 21, 2002
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making and using lithographic contact springs
- Publication number 20010021483
- Publication date Sep 13, 2001
- Gaetan L. Mathieu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing package structure having elastic bump

Electronic device having a liquid crystal polymer solder mask and r...

Electronic component and electronic unit

Metal contact for chip packaging structure

Metal coating for indium bump bonding

Devices for metallization

Methods, devices, and materials for metallization

Electroconductive bonding material, method for bonding conductor, a...

Interconnection of lead frame to die utilizing flip chip process

Interconnection of lead frame to die utilizing flip chip process

Method of making lithographic contact springs

Method for forming a flip chip on leadframe semiconductor package

Method for forming a flip chip semiconductor package

Methods for making spring interconnect structures

Method of making and using lithographic contact springs

Patents Applicationslast 30 patents

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

CHIP ATTACHMENT SYSTEM

CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION

METAL COATING FOR INDIUM BUMP BONDING

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

METHOD FOR FORMING A FLIP CHIP ON LEADFRAME SEMICONDUCTOR PACKAGE

METHOD FOR FORMING A FLIP CHIP SEMICONDUCTOR PACKAGE

Method of making and using lithographic contact springs