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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/405Material

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,664,288
- Issue date May 30, 2023
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 11,195,770
- Issue date Dec 7, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 11,171,068
- Issue date Nov 9, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput deposition of a voltage-tunable dielectric material
- Patent number 9,490,314
- Issue date Nov 8, 2016
- BlackBerry Limited
- Marina Zelner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual-chip packaging structure and preparation method thereof
- Patent number 9,184,117
- Issue date Nov 10, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device having interstitial elements in grain boundar...
- Patent number 9,178,117
- Issue date Nov 3, 2015
- LG Innotek Co., Ltd
- Han Byul Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411338
- Publication date Dec 21, 2023
- Rohm Co., Ltd.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230245994
- Publication date Aug 3, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078615
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yasuaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABL...
- Publication number 20210272922
- Publication date Sep 2, 2021
- INL-International Iberian Nanotechnology Laboratory
- Rosana Maria ALVES DIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Related Methods
- Publication number 20200286865
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20200168519
- Publication date May 28, 2020
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140110743
- Publication date Apr 24, 2014
- Han Byul KANG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package and related methods

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device, semiconductor device,...

Method of manufacturing semiconductor device, semiconductor device,...

High-throughput deposition of a voltage-tunable dielectric material

Stacked dual-chip packaging structure and preparation method thereof

Light emitting device having interstitial elements in grain boundar...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABL...

Semiconductor Package and Related Methods

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

LIGHT EMITTING DEVICE