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H01L2224/37599

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/37599Material

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Patents Grantslast 30 patents

Information Patent Grant
Clips for semiconductor package and related methods
- Patent number 11,264,311
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 10,763,201
- Issue date Sep 1, 2020
- Littelfuse, Inc.
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped lead terminals for packaging a semiconductor device for elec...
- Patent number 10,658,284
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including semiconduct...
- Patent number 10,546,839
- Issue date Jan 28, 2020
- Renesas Electronic Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,682
- Issue date Jan 7, 2020
- Mitsubishi Electric Corporation
- Yuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous metal layer and an electronic...
- Patent number 10,515,910
- Issue date Dec 24, 2019
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with reinforcing board
- Patent number 10,461,012
- Issue date Oct 29, 2019
- Fuji Electric Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,395,967
- Issue date Aug 27, 2019
- Renesas Electronics Corporation
- Takamitsu Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting heat-dissipating substrate
- Patent number 10,388,596
- Issue date Aug 20, 2019
- NSK Ltd.
- Shigeru Shimakawa
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor device
- Patent number 10,366,957
- Issue date Jul 30, 2019
- Denso Corporation
- Kenji Onoda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 10,312,178
- Issue date Jun 4, 2019
- Mitsubishi Electric Corporation
- Takanobu Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked terminals
- Patent number 10,304,770
- Issue date May 28, 2019
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages for flip chip devices
- Patent number 10,269,687
- Issue date Apr 23, 2019
- NAVITAS SEMICONDUCTOR, INC.
- Daniel Marvin Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,262,927
- Issue date Apr 16, 2019
- Renesas Electronics Corporation
- Kazunori Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,262,912
- Issue date Apr 16, 2019
- Mitsubishi Electric Corporation
- Takanobu Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting heat-dissipating substrate
- Patent number 10,249,558
- Issue date Apr 2, 2019
- NSK Ltd.
- Shigeru Shimakawa
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor module that have multiple paths for heat dissipation
- Patent number 10,217,690
- Issue date Feb 26, 2019
- Kabushiki Kaisha Toshiba
- Tatsuo Tonedachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including a first sem...
- Patent number 10,217,727
- Issue date Feb 26, 2019
- Renesas Electronics Corporation
- Akira Muto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module including a case and base board
- Patent number 10,211,122
- Issue date Feb 19, 2019
- Mitsubishi Electric Corporation
- Hajime Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion apparatus having a warpage suppre...
- Patent number 10,204,872
- Issue date Feb 12, 2019
- Hitachi Automotive Systems, Ltd.
- Toshiyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,186,473
- Issue date Jan 22, 2019
- Hitachi Automotive Systems, Ltd.
- Fusao Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board, power module and power unit
- Patent number 10,170,433
- Issue date Jan 1, 2019
- Mitsubishi Electric Corporation
- Shinnosuke Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) devices
- Patent number 10,147,698
- Issue date Dec 4, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having inner and outer semiconductor compon...
- Patent number 9,991,183
- Issue date Jun 5, 2018
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a plate-shaped lead terminal
- Patent number 9,917,064
- Issue date Mar 13, 2018
- Mitsubishi Electric Corporation
- Yusuke Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power field-effect transistor (FET), pre-driver, controller, and se...
- Patent number 9,870,984
- Issue date Jan 16, 2018
- Texas Instruments Incorporated
- Indumini Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUS BAR, POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A BUS BAR...
- Publication number 20230207511
- Publication date Jun 29, 2023
- INFINEON TECHNOLOGIES AG
- Marco Rasel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220173022
- Publication date Jun 2, 2022
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20210111104
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190088629
- Publication date Mar 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Akira MUTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180374814
- Publication date Dec 27, 2018
- Mitsubishi Electric Corporation
- Yuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Power Conversion Device
- Publication number 20180303001
- Publication date Oct 18, 2018
- Hitachi Automotive Systems, Ltd.
- Tokihito SUWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SE...
- Publication number 20180138112
- Publication date May 17, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Indumini Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead And Lead Frame For Power Package
- Publication number 20180096918
- Publication date Apr 5, 2018
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...
- Publication number 20180019222
- Publication date Jan 18, 2018
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Clips for semiconductor package and related methods

Semiconductor device having terminals directly attachable to circui...

Lead and lead frame for power package

Shaped lead terminals for packaging a semiconductor device for elec...

Semiconductor device and electronic apparatus including semiconduct...

Semiconductor device

Semiconductor device having a porous metal layer and an electronic...

Semiconductor module with reinforcing board

Method of manufacturing a semiconductor device

Method for manufacturing semiconductor device

Electronic part mounting heat-dissipating substrate

Semiconductor device

Semiconductor device

Semiconductor device with stacked terminals

Electronic packages for flip chip devices

Semiconductor device and manufacturing method thereof

Semiconductor device

Electronic part mounting heat-dissipating substrate

Semiconductor module that have multiple paths for heat dissipation

Semiconductor device and electronic apparatus including a first sem...

Semiconductor module including a case and base board

Power module and power conversion apparatus having a warpage suppre...

Power module

Insulated circuit board, power module and power unit

Radio frequency (RF) devices

Semiconductor device

Semiconductor component having inner and outer semiconductor compon...

Semiconductor device, method of manufacturing a semiconductor devic...

Semiconductor device with a plate-shaped lead terminal

Power field-effect transistor (FET), pre-driver, controller, and se...

Patents Applicationslast 30 patents

BUS BAR, POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A BUS BAR...

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

Power Semiconductor Device and Power Conversion Device

POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SE...

Lead And Lead Frame For Power Package

FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...