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H01L2224/82399

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for metalizing blind vias
- Patent number 9,003,654
- Issue date Apr 14, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Fabrice Jacquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package unit and stacking structure thereof
- Patent number 8,502,378
- Issue date Aug 6, 2013
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20160141265
- Publication date May 19, 2016
- Intel Corporation
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20140177193
- Publication date Jun 26, 2014
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE UNIT AND STACKING STRUCTURE THEREOF
- Publication number 20120091581
- Publication date Apr 19, 2012
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METALIZING BLIND VIAS
- Publication number 20110219612
- Publication date Sep 15, 2011
- Comm. á I'éner. atom. et aux énergies alter.
- Fabrice JACQUET
- H01 - BASIC ELECTRIC ELEMENTS